R7F7016493AFP-C#BA1 - RH850/F1KM-S4 240MHz 4MB MCU | Renesas
MPN: R7F7016493AFP-C#BA1 ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $17.57 | $17.57 |
| 10 | $15.8 | $158.00 |
| 100 | $13.95 | $1,395.00 |
| 500 | $12.4 | $6,200.00 |
| 1,000 | $11.05 | $11,050.00 |
R7F7016493AFP-C#BA1 Overview
A 32-bit MCU (microcontroller) is a single-chip processor that integrates CPU core, volatile and non-volatile memory, peripherals, and analog interfaces on one die. The RH850 family is Renesas' mainstream automotive-grade 32-bit architecture built around a Harvard-style RISC core with hardware-assisted safety features. Within the family hierarchy, the RH850/F1KM-S4 sits under RH850/F1K -> RH850/F1x -> RH850 -> Renesas 32-bit automotive MCU. Compared with consumer-grade ARM Cortex-M MCUs, RH850 devices emphasize functional safety (lockstep, ECC, MPU) and automotive qualification to AEC-Q100.
Key features include a 240 MHz core, 4 MB Flash with background operation support, 12-bit ADC, multiple CAN-FD controllers, LIN/UART/SPI/I2C, PWM timers for motor control, and integrated safety mechanisms such as ECC on Flash/SRAM, watchdog timers, and a memory protection unit. The wide supply range 3.0 V to 5.5 V makes it tolerant of automotive 12 V battery transients when paired with a system-basis chip.
Architecturally, the RH850/F1KM-S4 uses the RH850G3KH core with variable-length instructions, dedicated DSP extensions, and a low-latency interrupt controller. The 4 MB Flash uses dual-bank layout to support in-field firmware updates without downtime. The 176-pin LFQFP exposes the full peripheral set including up to 6 CAN channels, multiple SENT interfaces, and motor-control PWMs.
Typical applications include automotive body control modules (BCM), power sliding doors, tailgate/liftgate controllers, seat control units, and electric power steering (EPS) peripherals. It is also used in HVAC blowers and lighting ECUs where real-time deterministic control and AEC-Q100 qualification are required.
When designing with this part, budget enough PCB area for the 176-pin LFQFP and route all decoupling capacitors close to VDD/VSS pairs. Plan firmware size with headroom for OTA-capable dual-bank operation and reserve one CAN-FD channel for diagnostics.
This page synthesizes distributor availability across Mouser, DigiKey, Octopart, and LCSC, plus a Renesas cross-reference result and a comparison with other RH850/F1KM members, to help sourcing engineers quickly qualify substitutes and confirm pin/pin replacements.
Drop-in alternatives for R7F7016493AFP-C#BA1 — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with R7F7016493AFP-C#BA1 (same form factor and footprint) — differing in ADC, Package, Mounting Type, Communication Interfaces, Core Architecture.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
R7F7016493AFP-C#KA1
✅ Drop-In📋 Reference alternative (not in catalog)
R7F7017093AFP-C#BA1
✅ Drop-In📋 Reference alternative (not in catalog)
R5F56318CDFP#V0
✅ Drop-In ⚠️ Specs Unverified✓ In Stock
$16.0781 / Unit
View Datasheet →R5F5631BCDFP
✅ Drop-In ⚠️ Specs Unverified✓ In Stock
$9.05 / Unit
View Datasheet →R7F7016493AFP-C#BA1
✅ Drop-In✓ In Stock
$11.05 / Unit
View Datasheet →R7F7016493AFP-C#BA1 Maximum Ratings & Electrical Characteristics
| Core Architecture | RH850G3KH (RH850 RISC) |
| Product Family | RH850/F1KM-S4 |
| CPU Width | 32-bit |
| Core Count | Single-core |
| Maximum Clock Frequency | 240 MHz |
| Program Memory | 4 MB Flash (4M x 8) |
| Supply Voltage Range | 3.0 V to 5.5 V |
| Operating Temperature Range | -40 C to +105 C |
| Package | 176-LFQFP |
| Mounting Type | Surface Mount |
| Number of Pins | 176 |
| Package Series | LFQFP (QFP) |
| ADC | 12-bit (integrated) |
| CAN Channels | Multiple CAN / CAN-FD controllers |
| Communication Interfaces | UART, SPI, I2C, LIN, SENT |
| RoHS Status | Compliant |
| Lead Free | Yes |
| Application Domain | Automotive body and chassis ECUs |
R7F7016493AFP-C#BA1 lfqfp (qfp) Pin Configuration Guide
Pin configuration for R7F7016493AFP-C#BA1 (lfqfp (qfp) package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for R7F7016493AFP-C#BA1.
Refer to the datasheet for full pin configuration.
Typical Applications
R7F7016493AFP-C#BA1 is suitable for 6 applications: Automotive Body Control Module (BCM), Power Liftgate / Sliding Door Controller, Seat Control Unit, HVAC Blower and Damper ECU, Automotive Lighting ECU, Chassis Sensor Cluster / EPS Peripheral.
Automotive Body Control Module (BCM)
The R7F7016493AFP-C#BA1's 240 MHz core and multi-channel CAN-FD controllers make it ideal for body control modules that aggregate door, lighting, wiper, and access functions. Its AEC-Q100 Grade 2 rating at +105 C meets engine-bay-adjacent placement requirements, and 4 MB Flash holds the full LIN/CAN gateway stack plus diagnostics. The 176-LFQFP exposes enough GPIO for digital switch inputs, PWM-driven LED matrices, and external power-MOSFET gate drivers.
Recommended
Power Liftgate / Sliding Door Controller
In liftgate and sliding-door ECUs the R7F7016493AFP-C#BA1 drives multiple brush or stepper motors while reading Hall sensors, anti-pinch switches, and CAN-FD commands. The 12-bit ADC sample rate and dedicated motor-control PWM timers handle the closed-loop spindle control required by anti-pinch regulations, and the 4 MB Flash stores LUTs for damping curves. The +105 C ambient rating is essential because the controller often lives next to the motor housing.
Recommended
Seat Control Unit
The 176-pin LFQFP version of the R7F7016493AFP-C#BA1 supports a seat module's mix of CAN-FD, LIN, and switch-scan I/O plus memory for occupant position profiles. Designers use the device's encoder interfaces for seat-rail Hall sensors and its PWM channels to drive pneumatic or motorized lumbar pumps. Flash ECC plus watchdog timers satisfy ISO 26262 ASIL-B hardware elements in the seat-adjustment path.
Recommended
HVAC Blower and Damper ECU
HVAC modules benefit from the R7F7016493AFP-C#BA1's deterministic RH850 interrupt latency, which keeps blower PWM phase-locked to the cabin temperature control loop. With LIN transceivers integrated indirectly through external PHY, the MCU can also serve rear-seat climate nodes. The 240 MHz headroom plus 4 MB Flash stores adaptive climate-control algorithms and OTA-capable dual-bank firmware images.
Recommended
Automotive Lighting ECU
LED matrix and adaptive headlamp ECUs leverage the R7F7016493AFP-C#BA1's high-resolution PWM timers and CAN-FD bandwidth to drive thousands of LEDs with per-pixel diagnostics. The 176-pin LFQFP package exposes sufficient pins for separate matrix segments and the device's operational -40 C to +105 C supports headlamp modules that see direct engine-bay heat. AEC-Q100 plus ECC on Flash/SRAM is mandatory because these ECUs run functional-safety diagnostics.
Recommended
Chassis Sensor Cluster / EPS Peripheral
Although not a primary EPS microcontroller, the R7F7016493AFP-C#BA1 fits as a chassis sensor cluster, CAN-FD aggregator, and steering-angle-sensor interface in distributed EPS architectures. Its +105 C ambient rating and CAN-FD bandwidth handle the high-rate sensor data fusion required for ADAS perception hints. Flash ECC plus dual-bank update enable ASIL-C software workflows.
Recommended
Recommended Products Summary
Engineering reference data for R7F7016493AFP-C#BA1 — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | R7F7016493AFP-C#KA1 | R7F7017093AFP-C#BA1 | R5F56318CDFP#V0 | R5F5631BCDFP |
|---|---|---|---|---|---|
| Brand | Renesas Electronics | Renesas Electronics | Renesas Electronics | Renesas Electronics | Renesas Electronics |
| Package | 176-LFQFP | 176-LFQFP - same | 176-LFQFP - same | 176-LFQFP - same | 176-LFQFP - same |
| Core Architecture | RH850G3KH | RH850G3KH | RH850G3KH | RXv2 | RXv1 (RX63N) |
| Maximum Clock Frequency | 240 MHz | 240 MHz | 240 MHz | 240 MHz | 100 MHz |
| Supply Voltage | 3.0 V to 5.5 V | 3.0 V to 5.5 V | 3.0 V to 5.5 V | 2.7 V to 3.6 V | 2.7 V to 3.6 V |
| Automotive Qualification | AEC-Q100 Grade 2 | AEC-Q100 Grade 2 | AEC-Q100 Grade 2 | Not AEC-Q100 | Not AEC-Q100 |
| Operating Temperature | -40 C to +105 C | -40 C to +105 C | -40 C to +105 C | -40 C to +85 C | -40 C to +85 C |
Key Differentiators
- 240 MHz RH850G3KH core with 4 MB Flash for body ECU scale (vs R5F5631BCDFP)
- AEC-Q100 Grade 2 qualification with RH850 functional-safety hooks (vs R5F56318CDFP#V0)
- Same-die family extension with identical pin map (vs R7F7017093AFP-C#BA1)
Design Notes
Route at least 10 uF bulk + 100 nF high-frequency ceramic pairs for each VDD/VSS pair on the R7F7016493AFP-C#BA1, keeping trace length below 3 mm to suppress the RH850 core's instantaneous current steps. The 5 V rail must come from an automotive-qualified LDO or PMIC tolerating load-dump up to 40 V. Estimated: with eight GPIO switching at 10 MHz simultaneously, dynamic current can reach 250 mA, so power-trace width should be at least 1.5 mm on outer layers.
The 176-LFQFP package dissipates up to about 1.0 W in continuous operation; with theta_JA near 35 C/W on a four-layer 2 oz board, junction-to-ambient rise is roughly 35 C above ambient. Derate to 80 % of the 240 MHz capability if the device is enclosed with no airflow, and use copper-filled thermal land patterns tied to VSS pins.
Match the 176-LFQFP land pattern 1:1 with the reference design in the RH850/F1KM-S4 hardware manual; pad dimensions of approximately 0.5 mm x 0.3 mm with 0.1 mm solder-mask dams are recommended. Place all decoupling capacitors within one ball-pitch of their respective VDD pins and avoid routing high-speed signals under the package body to preserve signal integrity.
Failing to strap the mode-select pins to the correct logic level causes the R7F7016493AFP-C#BA1 to enter serial-programming or boundary-scan modes instead of normal execution; verify each reset bootstrap configuration before connecting battery. Additionally, misconfiguring the Flash access window can introduce wait states that halve execution throughput.
For CAN-FD lines, keep the bus within 30 mm of the MCU and use a 120 ohm differential termination at both ends; add a TVS diode and common-mode choke for automotive transient compliance per IEC 62228-3. Route SENT and LIN away from PWM outputs to minimize coupling into analog sensor inputs, and ground-reference the analog VREF pin to a clean 4.7 uF RC filter.
Compliance Information
AEC-Q100 Grade 2 qualification applies to the RH850/F1KM-S4 group per the Renesas datasheet. Halo: not stated; halogen status unknown in the supplied distributor text and labelled [DATA_NEEDED] where it would otherwise appear in specs.
