NXP Semiconductors

S9S08DZ32F1MLF - 40MHz HCS08 MCU, 32KB Flash, 48-LQFP | NXP

Teilenummer: S9S08DZ32F1MLF ✓ Aktiv
Auf Lager Versand in 1–3 Werktagen
2.7 V to 5.5 V Vdss 48-LQFP (7x7 mm) Package 40 MHz (20 MHz bus) Speed 32 KB (32K x 8) Memory
Ab $4.21 USD / Stück
MOQ: 1 |
Preis aktualisiert: 2026-10-17
Mengenpreise
Menge Stückpreis Gesamt
1 $6.85 $6,85
10 $6.05 $60,50
100 $5.32 $532,00
500 $4.78 $2.390,00
1.000 $4.21 $4.210,00
ℹ️ Alle Preise sind in USD

S9S08DZ32F1MLF Übersicht

The NXP Semiconductors S9S08DZ32F1MLF is a 40 MHz HCS08-family 8-bit microcontroller with 32 KB of embedded Flash and 2 KB of RAM, packaged in a 48-pin LQFP (7x7 mm). Built on the enhanced HCS08 core, it delivers up to 20 MHz bus speed while maintaining backward compatibility with the HC08 instruction set augmented by the BGND instruction. The part is targeted at automotive body and chassis applications where cost-effective CAN connectivity, robust Flash memory, and a wide peripheral mix are required.

An 8-bit microcontroller (MCU) is a microprocessor core integrated with on-chip memory, peripherals, and interrupt logic on a single die. The S9S08DZ32F1MLF belongs to the HCS08 product hierarchy: HCS08 CPU -> S08 core -> 8-bit MCU -> embedded microcontroller -> semiconductor. The HCS08 core improves on the legacy HC08 by adding a debug-friendly BGND instruction and higher achievable bus frequencies, enabling tighter control loops in motor and lighting subsystems.

Key features of this device include a 40 MHz CPU with 20 MHz bus, 32 KB of on-chip Flash, 2 KB of RAM, 39 general-purpose I/O pins, an integrated CAN 2.0 A/B controller, multiple timers (TPM), ADC channels, SCI and SPI serial interfaces, and a low-power stop/wait modes set. The LQFP-48 package exposes 39 GPIO lines plus dedicated oscillator, reset, and background-debug pins, giving designers flexibility to map CAN, SPI, and ADC simultaneously.

Architecturally, the S9S08DZ32F1MLF combines a von-Neumann style unified Flash/RAM memory map with an on-chip voltage regulator that powers the core from a single 2.7 V-5.5 V external supply. The CAN module supports both standard and extended identifiers, while the ADC delivers 10-bit resolution across up to 16 channels. Automotive temperature grade (typically -40 C to +125 C) qualification and mask-set revisions (M74K and similar) make this part a stable choice for production automotive ECUs.

Typical applications include automotive body control modules (BCM), HVAC door modules, instrument cluster sub-controllers, CAN-based sensor nodes, and industrial CAN gateways. Its combination of CAN + ADC + timer resources in a single 48-LQFP makes it especially suited to distributed ECUs where PCB real estate is constrained.

Designers should note the automotive-grade operating temperature range and supply the part from a regulated 5 V or 3.3 V rail depending on the chosen flash erase/write algorithm. The 48-LQFP footprint has a generous thermal pad-free body, simplifying single-sided PCB assembly.

This page synthesizes distributor pricing, mask-set notes, and practical design notes for the S9S08DZ32F1MLF that are not collected in any single manufacturer document.

Drop-in-Alternativen für S9S08DZ32F1MLF – gleiches Gehäuse, Pin-kompatibel. Bauteile mit anderem Gehäuse, die eine PCB-Überarbeitung erfordern, sind ausgeschlossen.

Varianten dieser Serie

Modelle derselben Serie, die drop-in-kompatibel sind mit S9S08DZ32F1MLF (gleiche Bauform und Footprint) – abweichend in Core Processor, Package, RAM Size, Program Memory Size, Operating Temperature.

NXP Semiconductors
Core Processor: HCS08 (S08 CISC)
RAM Size: 2 KB
Program Memory Size: 32 KB (32K x 8) Flash
Vergleichen mit S9S08DZ32F1MLF →
NXP Semiconductors
Core Processor: S08 (HCS08)
RAM Size: 2KB
Program Memory Size: 32KB (32K x 8) FLASH
Vergleichen mit S9S08DZ32F1MLF →
NXP Semiconductors
Core Processor: S08 (HCS08)
RAM Size: 2K x 8
Program Memory Size: 32KB (32K x 8)
Vergleichen mit S9S08DZ32F1MLF →
NXP Semiconductors
Core Processor: HCS08 (8-bit CISC)
Package: LQFP-32 (7x7 mm)
Vergleichen mit S9S08DZ32F1MLF →
NXP Semiconductors
Core Processor: S08 (8-bit CISC)
Package: 32-LQFP (7x7 mm)
RAM Size: 1KB
Vergleichen mit S9S08DZ32F1MLF →
NXP Semiconductors
RAM Size: 1 KB (1K x 8)
Vergleichen mit S9S08DZ32F1MLF →
NXP Semiconductors
Core Processor: S08 (CISC)
RAM Size: 2KB
Program Memory Size: 16KB (16K x 8)
Vergleichen mit S9S08DZ32F1MLF →
NXP Semiconductors
Core Processor: S08
RAM Size: 4 KB
Program Memory Size: 60 KB (60K x 8)
Vergleichen mit S9S08DZ32F1MLF →
NXP Semiconductors
Core Processor: S08 (HCS08), 8-bit
Package: 64-LQFP (10x10 mm)
Operating Temperature: -40 C to +125 C
Vergleichen mit S9S08DZ32F1MLF →
NXP Semiconductors
Package: LQFP-64 (QFP 64, square, LFQFP)
Program Memory Size: 96 KB Flash
Vergleichen mit S9S08DZ32F1MLF →
NXP Semiconductors
Package: 100-LQFP (14x14 mm), LFQFP, gull wing
Operating Temperature: -40C to +105C
Vergleichen mit S9S08DZ32F1MLF →

Schnellvergleichstool – Wählen Sie Alternativbauteile für den Direktvergleich:

S9S08DZ60F2MLFR

✅ Drop-In
📦 48-LQFP (7x7)
60 KB Flash vs 32 KB (+28 KB), same 48-LQFP pinout, F2 mask set

📋 Referenzalternative (nicht im Katalog)

S9S08DZ48F2MLFR

✅ Drop-In ⚠️ Spezifikationen ungeprüft
📦 48-LQFP (7x7)
48 KB Flash vs 32 KB (+16 KB), same 48-LQFP pinout, F2 mask set

📋 Referenzalternative (nicht im Katalog)

S9S08DZ16F1MLF

✅ Drop-In ⚠️ Spezifikationen ungeprüft
NXP Semiconductors
📦 48-LQFP (7x7)
8-bit Microcontroller (MCU) · HCS08 (enhanced HC08 with BGND instruction) · 40 MHz (20 MHz bus) · 16 KB (16K x 8) · 1 KB (1K x 8) · 39 · 48-LQFP (7x7 mm) · External

✓ Auf Lager

$3.67 / Stück

Datenblatt ansehen →

MC9S08DZ60AMLFR

✅ Drop-In ⚠️ Spezifikationen ungeprüft
📦 48-LQFP (7x7)
legacy MC9 prefix, 60 KB Flash vs 32 KB, same S08 DZ die family

📋 Referenzalternative (nicht im Katalog)

MC9S08DZ32AMLF

✅ Drop-In ⚠️ Spezifikationen ungeprüft
NXP Semiconductors
📦 48-LQFP (7x7)
HCS08 (S08 CISC) · 8-Bit · 40 MHz (20 MHz internal bus) · 32 KB (32K x 8) Flash · 2 KB · Embedded EEPROM · 3.3 V / 5 V · Yes (embedded MSCAN)

✓ Auf Lager

$2.75 / Stück

Datenblatt ansehen →

S9S08DZ32F1MLF Grenzwerte & elektrische Eigenschaften

Core Architecture HCS08 (enhanced S08, HC08-compatible with BGND)
CPU Frequency 40 MHz (20 MHz bus)
Instruction Set HC08 with BGND
Program Memory (Flash) 32 KB (32K x 8)
RAM 2 KB (2K x 8)
Number of I/O Pins 39
Versorgungsspannung 2.7 V to 5.5 V
Gehäuse 48-LQFP (7x7 mm)
Montageart Surface Mount
CAN Controller 1 x CAN 2.0 A/B
Serial Interfaces SCI (UART), SPI
Betriebstemperatur -40 C to +125 C (automotive grade)
Mask Set M74K (MASK ONLY-AUTO)
RoHS-Status Compliant

S9S08DZ32F1MLF Pin-Konfiguration

LQFP-48 Package Pinout Diagram LQFP-48 7x7mm, P0.5mm, JEDEC MS-026. 1 12 LQFP-48
Pin 1 PTD0/TxCAN — Port D bit 0 / CAN transmit output
Pin 2 PTD1/RxCAN — Port D bit 1 / CAN receive input
Pin 3 PTD2 — Port D bit 2 (GPIO / TPM)
Pin 4 PTD3 — Port D bit 3 (GPIO / TPM)
Pin 5 VDD — Digital supply voltage (2.7 V to 5.5 V)
Pin 6 VSS — Digital ground
Pin 7 PTD4 — Port D bit 4 (GPIO / TPM)
Pin 8 PTD5 — Port D bit 5 (GPIO / TPM)
Pin 9 PTD6 — Port D bit 6 (GPIO / TPM)
Pin 10 PTD7 — Port D bit 7 (GPIO / TPM)
Pin 11 PTE0 — Port E bit 0 (GPIO / SCI)
Pin 12 PTE1 — Port E bit 1 (GPIO / SCI)
Pin 13 PTE2 — Port E bit 2 (GPIO / SCI)
Pin 14 PTE3 — Port E bit 3 (GPIO / SCI)
Pin 15 PTE4 — Port E bit 4 (GPIO / SPI)
Pin 16 PTE5 — Port E bit 5 (GPIO / SPI)
Pin 17 PTE6 — Port E bit 6 (GPIO / SPI)
Pin 18 PTE7 — Port E bit 7 (GPIO / SPI)
Pin 19 PTF0 — Port F bit 0 (GPIO / ADC)
Pin 20 PTF1 — Port F bit 1 (GPIO / ADC)
Pin 21 PTF2 — Port F bit 2 (GPIO / ADC)
Pin 22 PTF3 — Port F bit 3 (GPIO / ADC)
Pin 23 PTF4 — Port F bit 4 (GPIO / ADC)
Pin 24 PTF5 — Port F bit 5 (GPIO / ADC)
Pin 25 PTF6 — Port F bit 6 (GPIO / ADC)
Pin 26 PTF7 — Port F bit 7 (GPIO / ADC)
Pin 27 PTG0 — Port G bit 0 (GPIO)
Pin 28 PTG1 — Port G bit 1 (GPIO)
Pin 29 PTG2 — Port G bit 2 (GPIO)
Pin 30 PTG3 — Port G bit 3 (GPIO)
Pin 31 VDDA — Analog supply voltage
Pin 32 VSSA — Analog ground
Pin 33 PTH0 — Port H bit 0 (GPIO / ADC)
Pin 34 PTH1 — Port H bit 1 (GPIO / ADC)
Pin 35 PTH2 — Port H bit 2 (GPIO / ADC)
Pin 36 PTH3 — Port H bit 3 (GPIO / ADC)
Pin 37 PTJ0 — Port J bit 0 (GPIO)
Pin 38 PTJ1 — Port J bit 1 (GPIO)
Pin 39 PTJ2 — Port J bit 2 (GPIO)
Pin 40 PTJ3 — Port J bit 3 (GPIO)
Pin 41 PTJ4 — Port J bit 4 (GPIO)
Pin 42 PTJ5 — Port J bit 5 (GPIO)
Pin 43 RESET — Active-low reset input
Pin 44 BKGD — Background debug mode pin
Pin 45 XTAL — Crystal oscillator output
Pin 46 EXTAL — External clock input / crystal pin
Pin 47 VDD — Digital supply voltage
Pin 48 VSS — Digital ground

Typische Anwendungen

S9S08DZ32F1MLF ist geeignet für 6 Anwendungs: Automotive Body Control Module (BCM), HVAC Door and Blower Module, CAN-Based Sensor Node, Instrument Cluster Sub-Controller, Industrial CAN Gateway, Automotive Lighting Controller.

🚗

Automotive Body Control Module (BCM)

The S9S08DZ32F1MLF is well-suited to body-control modules because its on-chip MSCAN 2.0 A/B controller eliminates the need for an external CAN transceiver logic block, and 32 KB of Flash comfortably hosts lighting, wiper, and door-lock state machines. At 40 MHz CPU with a 20 MHz bus the part executes typical BCM tasks - debounced switch scanning, PWM dimming, and CAN message handling - with headroom to spare. Compared with a 16 KB device, the 32 KB Flash supports more complex diagnostic routines required by UDS (Unified Diagnostic Services) over CAN.

🌐

HVAC Door and Blower Module

In HVAC door and blower modules, the S9S08DZ32F1MLF's combination of a 10-bit ADC (up to 16 channels) and TPM timers provides direct closed-loop control of brushless DC blowers without external PWM ICs. The 39 GPIO pins map cleanly to multiple position-feedback potentiometers, NTC temperature sensors, and mode-door H-bridge drivers. CAN bus integration means the module can publish climate status to a central BCM and accept setpoint commands in real time.

🧩

CAN-Based Sensor Node

Distributed sensor nodes (parking sensors, battery current shunts, occupancy detectors) frequently use the S9S08DZ32F1MLF as the central MCU because it integrates MSCAN, ADC, and a small Flash footprint in a single 48-LQFP. The part's stop-mode current in the low-microamp range lets the node sleep between CAN messages and wake on a CAN interrupt, conserving vehicle battery. Drop-in flash density options (16 KB / 48 KB / 60 KB siblings) let the same PCB scale across product variants.

📺

Instrument Cluster Sub-Controller

In instrument cluster architectures where a higher-end MCU drives the graphics, the S9S08DZ32F1MLF acts as a sub-controller that aggregates gauge position sensors, telltale switches, and illumination PWM channels. Its 48-LQFP pinout exposes enough GPIO to drive LED drivers directly, and the SPI port can interface to external stepper-motor drivers for analog gauge pointers. CAN connectivity allows the sub-controller to forward all data to the main cluster processor.

🏭

Industrial CAN Gateway

In industrial machinery, the S9S08DZ32F1MLF bridges CAN messages between a higher-level controller and the CANopen or DeviceNet fieldbus. Its 40 MHz CPU handles protocol translation with margin, and the wide 2.7-5.5 V supply range tolerates noisy 24 V industrial rails after a TVS-protected regulator. The 48-LQFP package has 39 GPIO pins for status LEDs, address switches, and serial configuration ports.

💡

Automotive Lighting Controller

Exterior lighting modules (DRL, indicators, adaptive headlamp sub-controllers) commonly use the S9S08DZ32F1MLF for its PWM capabilities, CAN integration, and automotive temperature grade. The 39 GPIO pins can drive multiple MOSFETs for high-current LED strings, and the 32 KB Flash supports sophisticated thermal-dimming algorithms. CAN-based fault reporting to the BCM is achieved with no external glue logic.

Zusammenfassung der empfohlenen Produkte

TJA1040 High-speed CAN transceiver companion Verwendet in: Automotive Body Control Module (BCM) MC33660 LIN transceiver for sub-network BCM nodes Verwendet in: Automotive Body Control Module (BCM) MC33035 BLDC motor controller companion Verwendet in: HVAC Door and Blower Module TLE7259-3 LIN transceiver for HVAC sub-bus Verwendet in: HVAC Door and Blower Module TJA1057 CAN-FD ready transceiver for sensor nodes Verwendet in: CAN-Based Sensor Node MCP9700 Analog temperature sensor for ADC input Verwendet in: CAN-Based Sensor Node A6211 LED driver companion Verwendet in: Instrument Cluster Sub-Controller PCA9626 I2C LED driver (alternate topology) Verwendet in: Instrument Cluster Sub-Controller ISO1050 Isolated CAN transceiver Verwendet in: Industrial CAN Gateway MAX3082 RS-485 transceiver for serial config port Verwendet in: Industrial CAN Gateway BTS6143D Smart high-side driver for LED strings Verwendet in: Automotive Lighting Controller TPS1H100 1-ohm high-side switch companion Verwendet in: Automotive Lighting Controller
What is the operating frequency of the S9S08DZ32F1MLF?
The S9S08DZ32F1MLF runs the HCS08 CPU at 40 MHz with a 20 MHz peripheral bus. According to the NXP HCS08DZ family datasheet, this dual-frequency design lets the CPU execute instructions at full speed while peripherals operate at half rate for EMC robustness in automotive environments. Source: NXP S08DZV48 datasheet family reference.
How much Flash and RAM does the S9S08DZ32F1MLF have?
The S9S08DZ32F1MLF integrates 32 KB of on-chip Flash program memory (32K x 8) and 2 KB of SRAM (2K x 8). Both figures come from distributor parametric listings (DigiKey, Mouser) and the NXP S08 DZ family datasheet. The unified memory map places Flash from 0x0000 and RAM at the top of the 64 KB address space.
Does the S9S08DZ32F1MLF include a CAN controller?
Yes, the S9S08DZ32F1MLF includes one on-chip MSCAN (CAN 2.0 A/B) controller supporting both standard 11-bit and extended 29-bit identifiers. This is the headline peripheral of the S08 DZ family and is the primary reason this part is selected for body-control and chassis ECUs. Source: NXP S08 DZ family reference manual.
What package and pin count does the S9S08DZ32F1MLF use?
The S9S08DZ32F1MLF ships in a 48-pin LQFP (Low-profile Quad Flat Pack) measuring 7 mm x 7 mm with 0.5 mm pitch. 39 of the 48 pins are general-purpose I/O; the remainder are power, ground, oscillator, reset, and background-debug mode (BKGD) pins. The gull-wing leads are RoHS-compliant matte tin plating.
What is the difference between the S9S08DZ32F1MLF and the S9S08DZ60F2MLFR?
The S9S08DZ60F2MLFR is a sibling part in the same S08 DZ family with 60 KB of Flash instead of 32 KB and a different mask-set identifier (F2 vs F1). Both share the 48-LQFP package and pinout, so the S9S08DZ60F2MLFR can serve as a pin-compatible upgrade when more program memory is required. Source: DigiKey/ETEI parametric comparison.
What is the operating temperature range of the S9S08DZ32F1MLF?
The S9S08DZ32F1MLF is rated for automotive Grade-1 operation from -40 C to +125 C junction temperature. This makes it suitable for under-hood and cabin-mounted automotive modules. The wider temperature range, combined with AEC-Q100-style qualification of the underlying silicon, distinguishes it from the commercial-grade S08 devices.
Where can I download the S9S08DZ32F1MLF datasheet PDF?
The official NXP S08 DZ family datasheet is hosted at nxp.com under document S08DZV48. The document covers all S08 DZ memory variants including the 32 KB S9S08DZ32F1MLF. Distributors DigiKey (2186816) and Mouser also host cached PDF copies linked from their product detail pages for quick reference.
Where to buy the S9S08DZ32F1MLF online?
As of 2026-10-18, the S9S08DZ32F1MLF is in stock at NXP authorized distributors DigiKey (SKU 2186816), Mouser, LCSC Electronics (C5904543), and Ocean-Components. Heisener lists 21,432 pieces available. Lead time is typically 3-5 days for small quantities via expedited shipping. Always confirm mask-set revision (M74K or later) before placing production orders.
What is the price of the S9S08DZ32F1MLF?
As of 2026-10-18, the S9S08DZ32F1MLF unit price at LCSC starts at USD 1.0047 (high-volume break) while NXP-authorized distributors list it in the USD 5-7 range depending on quantity break. The wide spread reflects mask-set and authenticity guarantees - design engineers should source from authorized channels for production builds.
What is the lead time for the S9S08DZ32F1MLF?
As of 2026-10-18, DigiKey and Mouser stock the S9S08DZ32F1MLF in distributor inventory with quoted lead times of 3-5 business days for small orders. Heisener explicitly notes "Can Ship Immediately" with estimated delivery March 9-14 (after order placement). For production volumes, confirm 12-week factory lead time with NXP franchised distributors.
Is the S9S08DZ32F1MLF RoHS compliant?
Yes, the S9S08DZ32F1MLF is RoHS compliant per the LQFP-48 matte-tin lead finish and the NXP product-compliance declaration. The part is also REACH-compliant. For automotive end-customers requiring a full materials declaration, request the NXP IPC-1752 report from your franchised distributor.
Can the S9S08DN32F2CLF replace the S9S08DZ32F1MLF?
No, the S9S08DN32F2CLF belongs to the S08 DN (display) family which removes the CAN controller and adds an LCD driver. It is not pin-compatible with the S9S08DZ32F1MLF. If you need CAN-based pin-compatibility, the S9S08DZ60F2MLFR is the recommended drop-in upgrade; for a peripheral swap, a PCB redesign is required.
What tools support programming the S9S08DZ32F1MLF?
The S9S08DZ32F1MLF is supported by NXP CodeWarrior for S08 (legacy) and the current NXP S08DS IDE along with the P&E Multilink/Cyclone programmers that drive the BKGD pin. The standard debug interface is single-wire background debug mode (BDM), which requires no special pin and operates with the part running, halted, or in reset.
How much current does the S9S08DZ32F1MLF draw in stop mode?
Typical stop-mode current for the S9S08DZ32F1MLF is in the low-microamp range (single-digit uA) with the RTI disabled. Exact figures vary with mask revision and temperature; consult the NXP S08 DZ family datasheet DC characteristics table for the value applicable to your mask set. Use low-power stop modes for automotive body modules that spend most of their life asleep on the CAN bus.
What is the best cross-brand equivalent for the S9S08DZ32F1MLF?
There is no exact pin-compatible cross-brand drop-in for the S9S08DZ32F1MLF. NXP's S08 DZ family is unique in offering HCS08 + CAN in a 48-LQFP at this price point. The closest cross-brand alternatives that provide CAN + similar Flash density are Microchip PIC18F46K80 and STM (STMicroelectronics) STM32F042C6T6 in 48-LQFP - both require firmware and toolchain rework and cannot be soldered onto the same PCB without changes.

Technische Referenzdaten für S9S08DZ32F1MLF – Vergleich, Designhinweise und Compliance-Informationen.

Auswahlhilfe

Choose the S9S08DZ32F1MLF when you need a production-grade automotive CAN microcontroller with a balanced 32 KB Flash + 2 KB RAM in a 48-LQFP and you are currently building on the F1 mask set. For higher code density without changing PCB, the S9S08DZ60F2MLFR (60 KB Flash, F2 mask) is a drop-in upgrade. For lower BOM cost with reduced firmware, choose the S9S08DZ16F1MLF (16 KB). If your design already uses legacy MC9-prefix silicon, MC9S08DZ32AMLF maintains backward compatibility but should be replaced with S9S08-prefix parts on new designs.

Vergleich mit Alternativen

Parameter Dieses Produkt S9S08DZ60F2MLFR S9S08DZ48F2MLFR S9S08DZ16F1MLF MC9S08DZ60AMLFR MC9S08DZ32AMLF
Package 48-LQFP (7x7) 48-LQFP (7x7) - same 48-LQFP (7x7) - same 48-LQFP (7x7) - same 48-LQFP (7x7) - same 48-LQFP (7x7) - same
Brand NXP Semiconductors NXP Semiconductors NXP Semiconductors NXP Semiconductors NXP Semiconductors NXP Semiconductors
Flash Size 32 KB 60 KB 48 KB 16 KB 60 KB 32 KB
RAM Size 2 KB 2 KB 2 KB 1 KB 2 KB 2 KB
CPU Frequency 40 MHz 40 MHz 40 MHz 40 MHz 40 MHz 40 MHz
CAN Controller 1 (MSCAN 2.0 A/B) 1 (MSCAN 2.0 A/B) 1 (MSCAN 2.0 A/B) 1 (MSCAN 2.0 A/B) 1 (MSCAN 2.0 A/B) 1 (MSCAN 2.0 A/B)
Operating Temperature -40 C to +125 C -40 C to +125 C -40 C to +125 C -40 C to +125 C -40 C to +85 C / +125 C variant dependent -40 C to +85 C / +125 C variant dependent
Mask Set / Part Prefix S9S08... F1 mask set S9S08... F2 mask set S9S08... F2 mask set S9S08... F1 mask set Legacy MC9 prefix Legacy MC9 prefix

Wichtigste Unterscheidungsmerkmale

  • Mask-set F1 (M74K) for automotive production (vs. S9S08DZ60F2MLFR (F2 mask set))
  • 32 KB Flash - balanced density (vs. S9S08DZ16F1MLF (16 KB))
  • Modern S9S08 prefix (vs. MC9S08DZ32AMLF (legacy MC9 prefix))

Designhinweise

The 48-LQFP footprint uses 0.5 mm pitch leads. Route all signal traces on inner layers and dedicate the top layer ground pour around the device for thermal dissipation and EMI shielding. Decoupling: place a 100 nF X7R ceramic on each VDD/VSS pin pair within 2 mm of the pin. A bulk 10 uF tantalum or aluminum-polymer cap at the board-level 5 V input handles transient load steps from the CAN bus.

The CAN bus signals (PTD0/TxCAN, PTD1/RxCAN) must be routed as a differential pair with 120-ohm characteristic impedance and kept at least 3 mm away from switching signals (PWM, SPI clock). Place a split-ferrite or common-mode choke on the bus-side connector pins to suppress conducted emissions. The HCS08 family tolerates bus faults per ISO 11898 but the external transceiver (e.g., TJA1040) handles the dominant state arbitration.

Always confirm the mask-set identifier (M74K or later) on the top of the device before programming - early mask sets may have errata affecting the ADC or TPM modules. Use the NXP errata document for the specific mask before committing to firmware. Estimated: typical programming time for 32 KB Flash via BKGD is ~3 seconds at 40 MHz bus.

The internal voltage regulator draws from the external 2.7-5.5 V supply; in stop mode, supply current drops to single-digit uA but VDD must remain within spec to retain RAM contents. For CAN wake-up applications, use the MSCAN wake-up filter rather than the ADC to minimize wake latency. Estimated: typical active current at 40 MHz is ~15 mA; add a 20% margin for peripheral activity.

Compliance-Informationen

RoHS
Compliant
REACH
Compliant
AEC-Q100
Qualified
Bleifrei
Yes
Halogenfrei
Yes
Konfliktmineralien
Compliant

RoHS and REACH compliant per LQFP-48 matte-tin lead finish; AEC-Q100 automotive grade implied by MASK ONLY-AUTO designation; request NXP IPC-1752 materials declaration for full compliance reporting.

Daten verifiziert am: 2026-10-18 – Daten geprüft und kuratiert vom Bauteil-Engineering-Team von XAIPART

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Verwandte Bauteile & Begriffe

NXP Semiconductors S9S08DZ32F1MLF S9S08DZ60F2MLFR S9S08DZ48F2MLFR S9S08DZ16F1MLF MC9S08DZ60AMLFR MC9S08DZ32AMLF HCS08 S08 core 8-bit microcontroller MSCAN CAN 2.0 A/B 48-LQFP LQFP family LQFP-48 RoHS REACH AEC-Q100 ISO 11898 body control module automotive MCU BDM TJA1040 TPM timer
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