S9S08DZ32F1MLF - 40MHz HCS08 MCU, 32KB Flash, 48-LQFP | NXP
Référence : S9S08DZ32F1MLF ✓ Actif| Qté | Prix unitaire | Total |
|---|---|---|
| 1 | $6.85 | $6,85 |
| 10 | $6.05 | $60,50 |
| 100 | $5.32 | $532,00 |
| 500 | $4.78 | $2 390,00 |
| 1 000 | $4.21 | $4 210,00 |
S9S08DZ32F1MLF Présentation
An 8-bit microcontroller (MCU) is a microprocessor core integrated with on-chip memory, peripherals, and interrupt logic on a single die. The S9S08DZ32F1MLF belongs to the HCS08 product hierarchy: HCS08 CPU -> S08 core -> 8-bit MCU -> embedded microcontroller -> semiconductor. The HCS08 core improves on the legacy HC08 by adding a debug-friendly BGND instruction and higher achievable bus frequencies, enabling tighter control loops in motor and lighting subsystems.
Key features of this device include a 40 MHz CPU with 20 MHz bus, 32 KB of on-chip Flash, 2 KB of RAM, 39 general-purpose I/O pins, an integrated CAN 2.0 A/B controller, multiple timers (TPM), ADC channels, SCI and SPI serial interfaces, and a low-power stop/wait modes set. The LQFP-48 package exposes 39 GPIO lines plus dedicated oscillator, reset, and background-debug pins, giving designers flexibility to map CAN, SPI, and ADC simultaneously.
Architecturally, the S9S08DZ32F1MLF combines a von-Neumann style unified Flash/RAM memory map with an on-chip voltage regulator that powers the core from a single 2.7 V-5.5 V external supply. The CAN module supports both standard and extended identifiers, while the ADC delivers 10-bit resolution across up to 16 channels. Automotive temperature grade (typically -40 C to +125 C) qualification and mask-set revisions (M74K and similar) make this part a stable choice for production automotive ECUs.
Typical applications include automotive body control modules (BCM), HVAC door modules, instrument cluster sub-controllers, CAN-based sensor nodes, and industrial CAN gateways. Its combination of CAN + ADC + timer resources in a single 48-LQFP makes it especially suited to distributed ECUs where PCB real estate is constrained.
Designers should note the automotive-grade operating temperature range and supply the part from a regulated 5 V or 3.3 V rail depending on the chosen flash erase/write algorithm. The 48-LQFP footprint has a generous thermal pad-free body, simplifying single-sided PCB assembly.
This page synthesizes distributor pricing, mask-set notes, and practical design notes for the S9S08DZ32F1MLF that are not collected in any single manufacturer document.
Alternatives de remplacement direct pour S9S08DZ32F1MLF — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
Variantes de cette série
Modèles de la même série directement compatibles avec S9S08DZ32F1MLF (même facteur de forme et même empreinte) — différant par Core Processor, Package, RAM Size, Program Memory Size, Operating Temperature.
Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :
S9S08DZ60F2MLFR
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
S9S08DZ48F2MLFR
✅ Remplacement direct ⚠️ Spécifications non vérifiées📋 Alternative de référence (hors catalogue)
S9S08DZ16F1MLF
✅ Remplacement direct ⚠️ Spécifications non vérifiées✓ En stock
$3.67 / unité
Voir la fiche technique →MC9S08DZ60AMLFR
✅ Remplacement direct ⚠️ Spécifications non vérifiées📋 Alternative de référence (hors catalogue)
MC9S08DZ32AMLF
✅ Remplacement direct ⚠️ Spécifications non vérifiées✓ En stock
$2.75 / unité
Voir la fiche technique →S9S08DZ32F1MLF Valeurs maximales et caractéristiques électriques
| Core Architecture | HCS08 (enhanced S08, HC08-compatible with BGND) |
| CPU Frequency | 40 MHz (20 MHz bus) |
| Instruction Set | HC08 with BGND |
| Program Memory (Flash) | 32 KB (32K x 8) |
| RAM | 2 KB (2K x 8) |
| Number of I/O Pins | 39 |
| Tension d'alimentation | 2.7 V to 5.5 V |
| Boîtier | 48-LQFP (7x7 mm) |
| Type de montage | Surface Mount |
| CAN Controller | 1 x CAN 2.0 A/B |
| Serial Interfaces | SCI (UART), SPI |
| Température de fonctionnement | -40 C to +125 C (automotive grade) |
| Mask Set | M74K (MASK ONLY-AUTO) |
| Statut RoHS | Compliant |
Configuration des broches de S9S08DZ32F1MLF
| Broche 1 | PTD0/TxCAN — Port D bit 0 / CAN transmit output |
| Broche 2 | PTD1/RxCAN — Port D bit 1 / CAN receive input |
| Broche 3 | PTD2 — Port D bit 2 (GPIO / TPM) |
| Broche 4 | PTD3 — Port D bit 3 (GPIO / TPM) |
| Broche 5 | VDD — Digital supply voltage (2.7 V to 5.5 V) |
| Broche 6 | VSS — Digital ground |
| Broche 7 | PTD4 — Port D bit 4 (GPIO / TPM) |
| Broche 8 | PTD5 — Port D bit 5 (GPIO / TPM) |
| Broche 9 | PTD6 — Port D bit 6 (GPIO / TPM) |
| Broche 10 | PTD7 — Port D bit 7 (GPIO / TPM) |
| Broche 11 | PTE0 — Port E bit 0 (GPIO / SCI) |
| Broche 12 | PTE1 — Port E bit 1 (GPIO / SCI) |
| Broche 13 | PTE2 — Port E bit 2 (GPIO / SCI) |
| Broche 14 | PTE3 — Port E bit 3 (GPIO / SCI) |
| Broche 15 | PTE4 — Port E bit 4 (GPIO / SPI) |
| Broche 16 | PTE5 — Port E bit 5 (GPIO / SPI) |
| Broche 17 | PTE6 — Port E bit 6 (GPIO / SPI) |
| Broche 18 | PTE7 — Port E bit 7 (GPIO / SPI) |
| Broche 19 | PTF0 — Port F bit 0 (GPIO / ADC) |
| Broche 20 | PTF1 — Port F bit 1 (GPIO / ADC) |
| Broche 21 | PTF2 — Port F bit 2 (GPIO / ADC) |
| Broche 22 | PTF3 — Port F bit 3 (GPIO / ADC) |
| Broche 23 | PTF4 — Port F bit 4 (GPIO / ADC) |
| Broche 24 | PTF5 — Port F bit 5 (GPIO / ADC) |
| Broche 25 | PTF6 — Port F bit 6 (GPIO / ADC) |
| Broche 26 | PTF7 — Port F bit 7 (GPIO / ADC) |
| Broche 27 | PTG0 — Port G bit 0 (GPIO) |
| Broche 28 | PTG1 — Port G bit 1 (GPIO) |
| Broche 29 | PTG2 — Port G bit 2 (GPIO) |
| Broche 30 | PTG3 — Port G bit 3 (GPIO) |
| Broche 31 | VDDA — Analog supply voltage |
| Broche 32 | VSSA — Analog ground |
| Broche 33 | PTH0 — Port H bit 0 (GPIO / ADC) |
| Broche 34 | PTH1 — Port H bit 1 (GPIO / ADC) |
| Broche 35 | PTH2 — Port H bit 2 (GPIO / ADC) |
| Broche 36 | PTH3 — Port H bit 3 (GPIO / ADC) |
| Broche 37 | PTJ0 — Port J bit 0 (GPIO) |
| Broche 38 | PTJ1 — Port J bit 1 (GPIO) |
| Broche 39 | PTJ2 — Port J bit 2 (GPIO) |
| Broche 40 | PTJ3 — Port J bit 3 (GPIO) |
| Broche 41 | PTJ4 — Port J bit 4 (GPIO) |
| Broche 42 | PTJ5 — Port J bit 5 (GPIO) |
| Broche 43 | RESET — Active-low reset input |
| Broche 44 | BKGD — Background debug mode pin |
| Broche 45 | XTAL — Crystal oscillator output |
| Broche 46 | EXTAL — External clock input / crystal pin |
| Broche 47 | VDD — Digital supply voltage |
| Broche 48 | VSS — Digital ground |
Applications typiques
S9S08DZ32F1MLF convient pour 6 applications: Automotive Body Control Module (BCM), HVAC Door and Blower Module, CAN-Based Sensor Node, Instrument Cluster Sub-Controller, Industrial CAN Gateway, Automotive Lighting Controller.
Automotive Body Control Module (BCM)
The S9S08DZ32F1MLF is well-suited to body-control modules because its on-chip MSCAN 2.0 A/B controller eliminates the need for an external CAN transceiver logic block, and 32 KB of Flash comfortably hosts lighting, wiper, and door-lock state machines. At 40 MHz CPU with a 20 MHz bus the part executes typical BCM tasks - debounced switch scanning, PWM dimming, and CAN message handling - with headroom to spare. Compared with a 16 KB device, the 32 KB Flash supports more complex diagnostic routines required by UDS (Unified Diagnostic Services) over CAN.
Recommandé
HVAC Door and Blower Module
In HVAC door and blower modules, the S9S08DZ32F1MLF's combination of a 10-bit ADC (up to 16 channels) and TPM timers provides direct closed-loop control of brushless DC blowers without external PWM ICs. The 39 GPIO pins map cleanly to multiple position-feedback potentiometers, NTC temperature sensors, and mode-door H-bridge drivers. CAN bus integration means the module can publish climate status to a central BCM and accept setpoint commands in real time.
Recommandé
CAN-Based Sensor Node
Distributed sensor nodes (parking sensors, battery current shunts, occupancy detectors) frequently use the S9S08DZ32F1MLF as the central MCU because it integrates MSCAN, ADC, and a small Flash footprint in a single 48-LQFP. The part's stop-mode current in the low-microamp range lets the node sleep between CAN messages and wake on a CAN interrupt, conserving vehicle battery. Drop-in flash density options (16 KB / 48 KB / 60 KB siblings) let the same PCB scale across product variants.
Recommandé
Instrument Cluster Sub-Controller
In instrument cluster architectures where a higher-end MCU drives the graphics, the S9S08DZ32F1MLF acts as a sub-controller that aggregates gauge position sensors, telltale switches, and illumination PWM channels. Its 48-LQFP pinout exposes enough GPIO to drive LED drivers directly, and the SPI port can interface to external stepper-motor drivers for analog gauge pointers. CAN connectivity allows the sub-controller to forward all data to the main cluster processor.
Recommandé
Industrial CAN Gateway
In industrial machinery, the S9S08DZ32F1MLF bridges CAN messages between a higher-level controller and the CANopen or DeviceNet fieldbus. Its 40 MHz CPU handles protocol translation with margin, and the wide 2.7-5.5 V supply range tolerates noisy 24 V industrial rails after a TVS-protected regulator. The 48-LQFP package has 39 GPIO pins for status LEDs, address switches, and serial configuration ports.
Recommandé
Automotive Lighting Controller
Exterior lighting modules (DRL, indicators, adaptive headlamp sub-controllers) commonly use the S9S08DZ32F1MLF for its PWM capabilities, CAN integration, and automotive temperature grade. The 39 GPIO pins can drive multiple MOSFETs for high-current LED strings, and the 32 KB Flash supports sophisticated thermal-dimming algorithms. CAN-based fault reporting to the BCM is achieved with no external glue logic.
Recommandé
Récapitulatif des produits recommandés
Données de référence d'ingénierie pour S9S08DZ32F1MLF — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit | S9S08DZ60F2MLFR | S9S08DZ48F2MLFR | S9S08DZ16F1MLF | MC9S08DZ60AMLFR | MC9S08DZ32AMLF |
|---|---|---|---|---|---|---|
| Package | 48-LQFP (7x7) | 48-LQFP (7x7) - same | 48-LQFP (7x7) - same | 48-LQFP (7x7) - same | 48-LQFP (7x7) - same | 48-LQFP (7x7) - same |
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Flash Size | 32 KB | 60 KB | 48 KB | 16 KB | 60 KB | 32 KB |
| RAM Size | 2 KB | 2 KB | 2 KB | 1 KB | 2 KB | 2 KB |
| CPU Frequency | 40 MHz | 40 MHz | 40 MHz | 40 MHz | 40 MHz | 40 MHz |
| CAN Controller | 1 (MSCAN 2.0 A/B) | 1 (MSCAN 2.0 A/B) | 1 (MSCAN 2.0 A/B) | 1 (MSCAN 2.0 A/B) | 1 (MSCAN 2.0 A/B) | 1 (MSCAN 2.0 A/B) |
| Operating Temperature | -40 C to +125 C | -40 C to +125 C | -40 C to +125 C | -40 C to +125 C | -40 C to +85 C / +125 C variant dependent | -40 C to +85 C / +125 C variant dependent |
| Mask Set / Part Prefix | S9S08... F1 mask set | S9S08... F2 mask set | S9S08... F2 mask set | S9S08... F1 mask set | Legacy MC9 prefix | Legacy MC9 prefix |
Principaux différenciateurs
- Mask-set F1 (M74K) for automotive production (vs S9S08DZ60F2MLFR (F2 mask set))
- 32 KB Flash - balanced density (vs S9S08DZ16F1MLF (16 KB))
- Modern S9S08 prefix (vs MC9S08DZ32AMLF (legacy MC9 prefix))
Notes de conception
The 48-LQFP footprint uses 0.5 mm pitch leads. Route all signal traces on inner layers and dedicate the top layer ground pour around the device for thermal dissipation and EMI shielding. Decoupling: place a 100 nF X7R ceramic on each VDD/VSS pin pair within 2 mm of the pin. A bulk 10 uF tantalum or aluminum-polymer cap at the board-level 5 V input handles transient load steps from the CAN bus.
The CAN bus signals (PTD0/TxCAN, PTD1/RxCAN) must be routed as a differential pair with 120-ohm characteristic impedance and kept at least 3 mm away from switching signals (PWM, SPI clock). Place a split-ferrite or common-mode choke on the bus-side connector pins to suppress conducted emissions. The HCS08 family tolerates bus faults per ISO 11898 but the external transceiver (e.g., TJA1040) handles the dominant state arbitration.
Always confirm the mask-set identifier (M74K or later) on the top of the device before programming - early mask sets may have errata affecting the ADC or TPM modules. Use the NXP errata document for the specific mask before committing to firmware. Estimated: typical programming time for 32 KB Flash via BKGD is ~3 seconds at 40 MHz bus.
The internal voltage regulator draws from the external 2.7-5.5 V supply; in stop mode, supply current drops to single-digit uA but VDD must remain within spec to retain RAM contents. For CAN wake-up applications, use the MSCAN wake-up filter rather than the ADC to minimize wake latency. Estimated: typical active current at 40 MHz is ~15 mA; add a 20% margin for peripheral activity.
Informations de conformité
RoHS and REACH compliant per LQFP-48 matte-tin lead finish; AEC-Q100 automotive grade implied by MASK ONLY-AUTO designation; request NXP IPC-1752 materials declaration for full compliance reporting.