S9S08SL8F1CTJ - 8-bit 40MHz MCU 8KB Flash TSSOP-20 | NXP
Teilenummer: S9S08SL8F1CTJ ✓ Aktiv| Menge | Stückpreis | Gesamt |
|---|---|---|
| 1 | $2.02 | $2,02 |
| 10 | $1.92 | $19,20 |
| 100 | $1.75 | $175,00 |
| 500 | $1.58 | $790,00 |
| 1.000 | $1.42 | $1.420,00 |
S9S08SL8F1CTJ Übersicht
An 8-bit MCU is a microcontroller whose CPU processes data in 8-bit words, sitting in the hierarchy of microcontroller -> embedded processor -> integrated circuit. MCUs combine a processor core, program memory (flash), data memory, and peripherals such as timers, ADCs, and serial interfaces on a single chip, making them the backbone of cost-sensitive embedded control systems.
Key features of the S9S08SL8F1CTJ include the 40 MHz S08 CPU core for fast interrupt response, 8 KB of in-circuit programmable flash for firmware storage, an integrated LIN slave interface controller (SLIC) that offloads LIN 2.x protocol handling from software, and an integrated EEPROM block for non-volatile parameter storage without external memory. The device operates over a -40 C to +85 C industrial temperature range per distributor data (LCSC) and includes a 10-bit ADC for analog signal measurement.
Technically, the S08SL family is built on a 0.25 um process (per NXP part description: 9S08 UC W/ 32K 0.25UM SG) and targets automotive LIN slave nodes such as window lifters, seat controls, wiper modules, and lighting modules. The SLIC subsystem reduces CPU load and simplifies certification of LIN slave communication stacks.
Typical applications include LIN bus slave nodes in automotive body electronics, small appliance and HVAC control boards, battery-powered sensor nodes, and low-cost industrial actuators where an 8-bit MCU with LIN connectivity reduces system cost.
For design, verify the exact supply voltage range, EEPROM size, and peripheral allocation in the NXP S08SL reference manual, as these parameters vary across family members and temperature grades. Confirm the CTJ suffix grade matches your ambient requirements.
This page synthesizes distributor pricing, drop-in family alternatives, and practical design notes not found in the manufacturer datasheet, with pricing and availability verified against distributor listings as of 2026-10-18.
Drop-in-Alternativen für S9S08SL8F1CTJ – gleiches Gehäuse, Pin-kompatibel. Bauteile mit anderem Gehäuse, die eine PCB-Überarbeitung erfordern, sind ausgeschlossen.
Varianten dieser Serie
Modelle derselben Serie, die drop-in-kompatibel sind mit S9S08SL8F1CTJ (gleiche Bauform und Footprint) – abweichend in Core Processor, Package, Program Memory Size, EEPROM Size, Operating Temperature.
Schnellvergleichstool – Wählen Sie Alternativbauteile für den Direktvergleich:
MC9S08SL16CTJ
✅ Drop-In✓ Auf Lager
$1.83 / Stück
Datenblatt ansehen →S9S08SL16F1MTJ
✅ Drop-In📋 Referenzalternative (nicht im Katalog)
S9S08SL8F1CTJR
✅ Drop-In📋 Referenzalternative (nicht im Katalog)
S9S08SG16E1CTJ
✅ Drop-In✓ Auf Lager
Preis auf Anfrage
Datenblatt ansehen →S9S08SG16E1CTJR
✅ Drop-In📋 Referenzalternative (nicht im Katalog)
MC9S08PT8AVTJ
✅ Drop-In📋 Referenzalternative (nicht im Katalog)
S9S08SL8F1CTJ Grenzwerte & elektrische Eigenschaften
| Core Processor | S08 8-bit |
| Core Size | 8-bit |
| Maximale Taktfrequenz | 40 MHz |
| Flash Memory | 8 KB (8K x 8) |
| ADC Resolution | 10-bit |
| LIN Interface | Embedded slave LIN interface controller (SLIC) |
| Gehäuse | 20-TSSOP (0.173 in, 4.40 mm width) |
| Montageart | Surface Mount |
| Betriebstemperatur | -40 C to +85 C |
| Feuchtigkeitsempfindlichkeitsgrad (MSL) | 3 |
| Peak Reflow Temperature | 260 C |
| Maximum Time at Peak Reflow Temperature | 40 s |
| Terminal Finish | Tin (JESD-609 Code e3) |
| Process Technology | 0.25 um |
| RoHS-Status | Compliant |
S9S08SL8F1CTJ 20-tssop (0.173 in, 4.40 mm width) Pinbelegungsleitfaden
Pinbelegung für S9S08SL8F1CTJ (20-tssop (0.173 in, 4.40 mm width)-Gehäuse). Dieser digitale IC umfasst GPIO, Kommunikationsschnittstellen (UART, SPI, I2C) und Versorgungspins. Alternative Pin-Funktionen und Konfigurationsoptionen entnehmen Sie dem Herstellerdatenblatt. Unverzichtbar für Embedded-System-Design und PCB-Layout.
Keine detaillierten Pinbelegungsdaten verfügbar für S9S08SL8F1CTJ.
Siehe die Datenblatt für die vollständige Pin-Konfiguration.
Typische Anwendungen
S9S08SL8F1CTJ ist geeignet für 6 Anwendungs: Automotive LIN Slave Nodes, HVAC and Blower Control Modules, Lighting Control Modules (Interior/Exterior), Small Appliance and Tool Control Boards, Battery-Powered Sensor Nodes, Industrial Actuator and Pump Control.
Automotive LIN Slave Nodes
The S9S08SL8F1CTJ was purpose-built for LIN slave nodes: its embedded slave LIN interface controller (SLIC) offloads LIN 2.x frame handling, wake-up detection, and header response from the CPU, freeing the 40 MHz S08 core for application logic. NXP explicitly markets the S08SL family with SLIC and EEPROM to increase LIN slave performance and reduce development time. In a typical node such as a window lifter or seat adjust module, the MCU sits between the LIN transceiver and the actuator driver H-bridge, handling the 19.2 kbps LIN bus while controlling motor direction and current via PWM. The integrated EEPROM stores seat position and calibration data across power cycles without an external memory chip, cutting BOM cost and board area in cost-driven body electronics platforms.
Empfohlen
HVAC and Blower Control Modules
Automotive and appliance HVAC controllers benefit from the S9S08SL8F1CTJ's combination of a 10-bit ADC, 8 KB flash, and LIN connectivity. The 10-bit ADC reads NTC temperature sensors, potentiometer position feedback, and supply-voltage supervision signals with roughly 5 mV resolution on a 5 V reference, sufficient for closed-loop temperature regulation. The SLIC LIN controller lets the blower module respond to climate-control master commands without a heavy software protocol stack, and the EEPROM retains fault codes and learned blower-curve calibration data. Operating from -40 C to +85 C, the CTJ grade covers cabin and under-dash ambient conditions. PWM outputs from the S08 timer modules drive blower motor stages or brushless driver ICs, while the 40 MHz bus supports fast PID loop execution for stable airflow control.
Empfohlen
Lighting Control Modules (Interior/Exterior)
Interior ambient lighting and exterior lamp modules use the S9S08SL8F1CTJ as a LIN-controlled LED driver sequencer. The SLIC LIN slave controller receives brightness commands and fault polling from the body controller master, while the 10-bit ADC monitors LED current-sense resistors and diagnostic feedback for open/short detection, supporting LED fault reporting required in automotive lighting architectures. The S08 timer channels generate dimming PWM at frequencies above audible range to eliminate flicker and whine, and the 8 KB flash accommodates a LIN transport layer plus dimming curves stored in the integrated EEPROM. With a 20-TSSOP footprint of roughly 6.5 x 4.4 mm, the MCU fits compact lamp driver PCBs. For exterior lamps exposed above +85 C, migrate to the automotive-qualified S9S08SL16F1MTJ on the same footprint.
Empfohlen
Small Appliance and Tool Control Boards
Cost-sensitive appliance controllers - kettles, fans, coffee machines, power tools - adopt the S9S08SL8F1CTJ for its single-chip integration of flash, EEPROM, 10-bit ADC, and timers. The 10-bit ADC digitizes button matrices via resistor ladders, NTC temperature probes, and zero-cross detection signals from the mains, while timer PWM drives triac/optocoupler firing circuits or DC motor bridges. The 8 KB flash holds the full control state machine plus LIN or UART-based service interfaces, and the EEPROM stores user preferences and usage counters. The 20-TSSOP package supports standard surface-mount assembly, MSL 3 handling, and 260 C reflow profiles used in high-volume consumer manufacturing. The -40 C to +85 C rating provides margin for enclosure-internal temperatures near heating elements.
Empfohlen
Battery-Powered Sensor Nodes
The S08SL family's low-power S08 architecture suits battery-operated sensor nodes that report over LIN or a UART link. The MCU spends most of its life in stop mode, waking on LIN bus activity via the SLIC's wake detection or on timer/ADC events to sample a sensor with the 10-bit ADC, transmit the reading, and return to sleep - a duty cycle that extends battery life substantially versus always-on operation. The integrated EEPROM stores sensor calibration coefficients and node addressing without external non-volatile memory, saving board space and quiescent cost. Typical nodes include fluid-level sensors, position sensors with potentiometer feedback, and temperature hubs in distributed 12 V/24 V systems. Designers should verify exact stop-mode current in the NXP S08SL datasheet to finalize battery sizing.
Empfohlen
Industrial Actuator and Pump Control
In industrial equipment, the S9S08SL8F1CTJ serves as a compact actuator controller driving valves, dampers, and small pumps under a higher-level fieldbus master. The 40 MHz S08 core executes closed-loop position or flow control at kilohertz rates using 10-bit ADC feedback from potentiometers or hall-effect current sensors, while timer PWM outputs command driver stages. A UART or LIN link (via the SLIC) connects the node to the system controller, and the EEPROM retains actuator end-stop calibration and diagnostic counters across power cycles. The -40 C to +85 C industrial temperature range and RoHS-compliant, MSL 3, 260 C-reflow-rated TSSOP-20 package simplify integration into standard industrial PCB assembly flows. The 8 KB flash is sufficient for PID control, command parsing, and fault-management state machines.
Empfohlen
Zusammenfassung der empfohlenen Produkte
Technische Referenzdaten für S9S08SL8F1CTJ – Vergleich, Designhinweise und Compliance-Informationen.
Auswahlhilfe
Vergleich mit Alternativen
| Parameter | Dieses Produkt | MC9S08SL16CTJ | S9S08SL16F1MTJ | S9S08SL8F1CTJR | S9S08SG16E1CTJ | MC9S08PT8AVTJ |
|---|---|---|---|---|---|---|
| Package | 20-TSSOP (4.40 mm) | 20-TSSOP - same | 20-TSSOP - same | 20-TSSOP - same | 20-TSSOP - same | 20-TSSOP - same |
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Flash Memory | 8 KB | 16 KB | 16 KB | 8 KB | 16 KB | 8 KB |
| LIN Slave Controller (SLIC) | Yes | Yes | Yes | Yes | No (SG series peripherals) | No (PT series peripherals) |
Wichtigste Unterscheidungsmerkmale
- Integrated SLIC LIN slave controller (vs. S9S08SG16E1CTJ)
- Lowest-cost memory point in the SL family (vs. S9S08SL16F1MTJ)
- Integrated EEPROM eliminates external NVM (vs. MC9S08PT8AVTJ)
Designhinweise
Confirm the temperature grade suffix before release: the CTJ grade is rated -40 C to +85 C per LCSC distributor data, while the MTJ variant of the SL16 family extends to +125 C. Using the SL8 in under-hood or lamp-adjacent locations above 85 C ambient violates the operating range and will not be caught in bench testing. Similarly, the S9S08SL8F1CTJR differs from the CTJ only in packaging (tape and reel) - not electrically - so avoid conflating the two when specifying reel quantities for production assembly.
The 20-TSSOP package has 0.5 mm pin pitch: design land patterns per the NXP package drawing and use a standard SMT stencil; MSL 3 parts require baking if exposed beyond floor-life after opening the moisture-barrier bag. The rating of 260 C peak reflow for 40 s (per Vyrian component data) fits standard lead-free reflow profiles, but verify your oven profile does not exceed the 40 s time above peak. Keep the LIN transceiver and its bulk capacitor close to the MCU supply pins, and route the LIN line away from the ADC inputs to protect 10-bit measurement accuracy.
Estimated: the exact supply voltage range is not published in the retrieved distributor data, so pull the VDD range, brown-out thresholds, and stop/wait mode currents from the NXP S08SL family datasheet before finalizing the power tree. For automotive 12 V rails, place a transient-suppressed 5 V (or 3.3 V) regulator ahead of the MCU and size the regulator for LIN transceiver current plus MCU load. Decouple VDD with 100 nF ceramic at each supply pin plus 4.7-10 uF bulk near the regulator output, per standard S08-family power design practice in NXP reference designs.
Compliance-Informationen
RoHS compliant per PCB Electronics distributor listing; terminal finish Tin with JESD-609 code e3 (lead-free) per Vyrian component data. AEC-Q100 qualification not stated for the CTJ grade - the SL16 MTJ variant is the automotive-qualified family member.
