S9S08SG16E1CTJ - 8-bit S08 MCU 16KB Flash 40MHz | NXP
MPN: S9S08SG16E1CTJ ✗ End of Life| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $0 | $0.00 |
| 10 | $0 | $0.00 |
| 100 | $0 | $0.00 |
| 500 | $0 | $0.00 |
| 1,000 | $0 | $0.00 |
S9S08SG16E1CTJ Overview
An 8-bit MCU is an integrated circuit that combines a processor core, memory, and peripherals on a single chip, sitting within the broader hierarchy of microcontroller -> embedded processor -> semiconductor. Entry-level 8-bit MCUs like the S08SG family are widely used for cost-sensitive control tasks such as LIN slave nodes, sensor interfacing, and simple actuator control, where 32-bit processors would add unnecessary cost and complexity.
Key features of the S9S08SG16E1CTJ include the 40 MHz S08 core, 16KB Flash program memory, 1K x 8 RAM, and 16 general-purpose I/O lines. The oscillator type is internal, which reduces external component count and bill-of-material cost, an important benefit in space-constrained automotive modules.
The S08SG family from NXP (formerly Freescale Semiconductor) is positioned as an entry-level to mid-range offering designed for LIN slave, general market, high-temperature, and space-constrained applications. The automotive qualification of this grade makes it suitable for body electronics and convenience modules that must survive harsh in-vehicle environments, while the 20-pin TSSOP keeps PCB footprint minimal for tightly packed boards.
Typical applications include LIN slave nodes in automotive body electronics, small appliance and general-market motor control, and space-constrained sensor or actuator interface boards. The internal oscillator and rich S08 peripheral set let designers implement these functions with minimal external circuitry.
A key design consideration is lifecycle: NXP lists the S9S08SG16E1CTJ as End of Life, so new designs should verify the NXP-recommended replacement or select an active S08/Kinetis alternative. Existing designs should secure last-time-buy inventory.
This page synthesizes distributor pricing context, drop-in alternatives, and practical design notes not found in the manufacturer datasheet, providing engineering decision support for both new designs and EOL migration.
Drop-in alternatives for S9S08SG16E1CTJ — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with S9S08SG16E1CTJ (same form factor and footprint) — differing in Core Processor, Operating Temperature, Connectivity, Package, Peripherals.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
S9S08SG16E1VTJ
✅ Drop-In ⚠️ Specs Unverified✓ In Stock
Contact for price
View Datasheet →S9S08SG16E1MTJ
✅ Drop-In ⚠️ Specs Unverified📋 Reference alternative (not in catalog)
MC9S08SL16CTJ
✅ Drop-In ⚠️ Specs Unverified✓ In Stock
$1.83 / Unit
View Datasheet →MC9S08PT16AVWJ
✅ Drop-In ⚠️ Specs Unverified✓ In Stock
$1.65 / Unit
View Datasheet →S9S08SG16E1CTJ Maximum Ratings & Electrical Characteristics
| Core Processor | S08 |
| Core Size | 8-Bit |
| Architecture | CISC |
| Speed | 40 MHz |
| Program Memory Size | 16KB (16K x 8) |
| Program Memory Type | FLASH |
| RAM Size | 1K x 8 |
| Number of I/O | 16 |
| Oscillator Type | Internal |
| Supply Voltage | 3.3 V / 5 V |
| Operating Temperature | -40C to +85C |
| Qualification | Automotive Qualified |
| Package / Case | 20-TSSOP (0.173", 4.40 mm Width) |
| Mounting Type | Surface Mount |
| Packaging | Tube |
| Peripherals | LIN support, S08 peripheral set |
| Lifecycle Status | End of Life |
S9S08SG16E1CTJ 20-tssop (0.173", 4.40 mm width) Pin Configuration Guide
Pin configuration for S9S08SG16E1CTJ (20-tssop (0.173", 4.40 mm width) package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for S9S08SG16E1CTJ.
Refer to the datasheet for full pin configuration.
Typical Applications
S9S08SG16E1CTJ is suitable for 6 applications: Automotive LIN Slave Nodes, Body Electronics Modules, Small Appliance and General Market Control, Space-Constrained Sensor Interfaces, Motor Starters and Actuator Control, EOL Migration and Legacy System Maintenance.
Automotive LIN Slave Nodes
The S9S08SG16E1CTJ is explicitly designed by NXP for LIN slave applications, combining the 40 MHz S08 core with 16KB Flash and an internal oscillator that eliminates the external crystal required by many competing MCUs. In a typical LIN node such as a window lift, seat adjuster, or wiper module, the MCU handles LIN 2.x frame scheduling, diagnostic services, and PWM actuator control while sleeping at low current between frames. The automotive qualification and -40C to +85C rating ensure reliability in cabin and under-dash environments. The 20-pin TSSOP footprint keeps node PCB area small, and the internal oscillator reduces bill-of-material cost - a key factor in high-volume automotive programs.
Recommended
Body Electronics Modules
Automotive body control functions - mirror switches, lighting logic, and convenience closures - need a low-cost, qualified MCU with adequate I/O and Flash. The S9S08SG16E1CTJ offers 16 general-purpose I/O lines and 16KB Flash, sufficient for switch debouncing, relay or LED driver sequencing, and fault diagnostics. Its 3.3 V/5 V operation matches the mixed-voltage rails common in vehicle electrical architectures, and the 20-pin TSSOP package fits into the compact connector-adjacent PCB regions typical of body modules. Because the part is EOL, designers maintaining these modules should pair the SG16 with last-time-buy inventory, while new body-electronics designs should select an active NXP S08 successor to secure long-term supply.
Recommended
Small Appliance and General Market Control
Beyond automotive, the S08SG family targets the general market, making the S9S08SG16E1CTJ suitable for small appliance control boards: fan speed sequencing, temperature-based heater control, and user-interface scanning. The internal oscillator removes the crystal from the BOM, and the 16 I/O lines cover buttons, LEDs, and a TRIAC or relay drive with margin. At 40 MHz, the S08 core executes control loops and ADC-filtering tasks comfortably within the timing budgets of appliance firmware. The 5 V operation simplifies interfacing with mains-derived supplies that lack regulated 3.3 V rails. Although this grade is automotive-qualified, its general-market pedigree keeps it cost-effective for consumer and white-goods applications.
Recommended
Space-Constrained Sensor Interfaces
With a 20-pin TSSOP body only 4.40 mm wide, the S9S08SG16E1CTJ fits dense sensor-interface boards where a 32- or 44-pin package cannot. Typical roles include conditioning outputs from pressure, position, or temperature sensors and digitizing them before passing data over LIN or UART to a domain controller. The 16KB Flash stores calibration tables and linearization code, while the 1KB RAM buffers sampling data. The internal oscillator supports standalone operation at the sensor node. Designers should budget the limited 16 I/O pins carefully, since several pins are shared with communication and debug functions; the datasheet pin muxing table governs allocation in dense layouts.
Recommended
Motor Starters and Actuator Control
Small brushed-DC motors in HVAC dampers, locks, and pumps require simple PWM drive and current-limit supervision rather than complex field-oriented control. The S9S08SG16E1CTJ's 40 MHz core generates PWM with software timers, monitors overcurrent via comparator inputs, and implements stall detection in firmware. The 5 V operation directly drives logic-level MOSFET gate drivers, and the -40C to +85C range suits engine-bay-adjacent actuator locations. The internal oscillator's accuracy is adequate for PWM frequencies used in actuator control, though closed-loop speed regulation from back-EMF should validate timing tolerance. For higher-performance motor control, NXP's DZ-family devices with dedicated PWM modules are the natural upgrade path.
Recommended
EOL Migration and Legacy System Maintenance
A primary real-world use of the S9S08SG16E1CTJ today is sustaining production of legacy automotive and industrial boards after NXP's End-of-Life announcement. Procurement teams must bridge supply with open-market purchases from sources such as Win Source or Avaq while engineering qualifies a migration path. The nearest like-for-like migration targets are other SG16 ordering variants (same die, same TSSOP-20 footprint) or the active MC9S08SL16CTJ, which shares core size and memory class. A sound migration plan verifies pinout identity, revalidates oscillator accuracy and peripheral timing, and runs the existing firmware regression suite before releasing the redesign to production.
Recommended
Recommended Products Summary
Engineering reference data for S9S08SG16E1CTJ — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | S9S08SG16E1VTJ | S9S08SG16E1MTJ | MC9S08SL16CTJ | MC9S08PT16AVWJ |
|---|---|---|---|---|---|
| Package | 20-TSSOP (4.40 mm width) | 20-TSSOP - same | 20-TSSOP - same | 20-TSSOP - same | 20-TSSOP - same |
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Flash Memory | 16KB (16K x 8) | 16KB | 16KB | 16KB | 16KB |
Key Differentiators
- Same-die ordering variants preserve footprint (vs S9S08SG16E1VTJ / S9S08SG16E1MTJ)
- Automotive qualification (vs MC9S08PT16AVWJ)
- Internal oscillator lowers BOM cost (vs MC9S08SL16CTJ)
Design Notes
The S9S08SG16E1CTJ is End of Life per the NXP product page. Do not start new designs with this part. For existing designs, execute a last-time-buy sized to cover field-service projections plus attrition, and download NXP's discontinuance and replacement Product Change Notice from the part page to confirm the officially recommended successor before qualifying a substitute.
The device operates from 3.3 V or 5 V supplies. Decouple VDD with a 0.1 uF ceramic capacitor placed within 5 mm of the pin, plus a 1-10 uF bulk capacitor per supply rail. Because the oscillator is internal, supply noise directly affects clock accuracy and ADC results; keep the analog supply node quiet and avoid routing PWM return currents under the MCU.
The 20-pin TSSOP has a 0.65 mm pin pitch; use a standard TSSOP-20 land pattern per the NXP packaging document and verify solder-mask definitions for fine-pitch assembly. Allocate the 16 I/O pins before routing - several pins are multiplexed with debug (BGND/BKGD) and communication functions, so locking the debug access pin early avoids a respin.
Compliance Information
Verified data states 'Automotive Qualified' for this part. Detailed RoHS/REACH/lead-free status is available on the NXP product page Environmental Quality section but was not included in the retrieved snippets.
