NXP Semiconductors

S9S12H256J1VFVE - 16-bit HCS12 MCU, 256KB Flash, 144-LQFP | NXP

Teilenummer: S9S12H256J1VFVE ✗ Abgekündigt
Auf Lager Versand in 1–3 Werktagen
5.0 V typical (4.5 V - 5.5 V) Vdss 144-pin LQFP (20 x 20 mm) Package 50 MHz Speed 256 KB Memory
Ab $10.5 USD / Stück
MOQ: 1 |
Preis aktualisiert: 2026-10-20
Mengenpreise
Menge Stückpreis Gesamt
1 $18.5 $18,50
10 $16.4 $164,00
100 $14.2 $1.420,00
500 $12.1 $6.050,00
1.000 $10.5 $10.500,00
ℹ️ Alle Preise sind in USD

S9S12H256J1VFVE Übersicht

The NXP Semiconductors S9S12H256J1VFVE is a 16-bit HCS12-family microcontroller built around the HCS12 CPU core, delivering 50 MHz maximum bus clock performance, 256 KB of on-chip FLASH program memory, 12 KB of data RAM, and 4 KB of data EEPROM, all integrated in a 144-pin LQFP package qualified to the -40 °C to +105 °C automotive temperature range.

An automotive-grade microcontroller (MCU) is a microcontroller that has been designed, characterized, and qualified to operate reliably in the harsh electrical and thermal environments of a vehicle. Within the broader product hierarchy, MCUs sit inside the Integrated Circuits category; the S9S12H256J1VFVE specifically belongs to the 16-bit HCS12 sub-family of NXP/Freescale S12 microcontrollers, which are widely deployed in body, chassis, and powertrain electronic control units (ECUs). The HCS12 core is a CISC architecture with full 16-bit data paths, and the part name's suffix 'H256' indicates 256 KB of FLASH, while 'J1VFVE' decodes to LQFP-144 package, automotive grade, tape-and-reel packaging.

Key features include 256 KB FLASH, 12 KB RAM, 4 KB EEPROM, 50 MHz maximum CPU clock, a PLL block for adjustable speed/power trade-offs, multiple timers including a 16-bit Enhanced Capture Timer and an 8-bit Pulse-Width Modulator (PWM) module, an MSCAN (CAN 2.0 A/B) controller, an SPI peripheral, an asynchronous/synchronous SCI serial interface, plus 12 general-purpose I/O pins with interrupt and wake-up capability from STOP or pseudo-STOP modes. The 144-pin LQFP footprint exposes all major buses and analog inputs for body-controller and instrument-cluster applications.

The internal bus matrix is fed by an on-chip PLL that allows the bus clock to be derived from a low-frequency external crystal, reducing electromagnetic emissions and quiescent current. ECC on the FLASH array and a separate EEPROM block allow robust in-field parameter storage, which is required for adaptive automotive software. The HCS12 core executes CISC instructions in 1-5 bus cycles, providing deterministic interrupt latency for real-time control loops.

Typical applications include automotive body controllers, instrument clusters, HVAC control modules, lighting controllers, door/seat modules, and industrial CAN nodes where a 16-bit automotive MCU is required. The part is also used in legacy industrial PLCs and stepper/servo controllers that already have an HCS12 firmware base. The wide -40 °C to +105 °C automotive temperature range and on-chip CAN make it suitable for in-cabin and under-hood controllers.

When designing with this part, provide a 5 V-tolerant decoupling network on each VDD/VSS pair, route the ECLK/XIRQ/IRQ reset chain with short traces, and use the internal PLL with a 4 MHz-16 MHz crystal to derive the 50 MHz bus clock. Always enable the COP watchdog and configure the MSCAN baud rate using a 16 MHz oscillator reference for CAN 2.0B operation at 1 Mbit/s.

This page synthesizes NXP/Freescale distributor pricing, drop-in LQFP-144 alternatives from the S9S12H and S12X families, automotive-grade compliance notes, and practical design guidance that go beyond the manufacturer datasheet.

Drop-in-Alternativen für S9S12H256J1VFVE – gleiches Gehäuse, Pin-kompatibel. Bauteile mit anderem Gehäuse, die eine PCB-Überarbeitung erfordern, sind ausgeschlossen.

Varianten dieser Serie

Modelle derselben Serie, die drop-in-kompatibel sind mit S9S12H256J1VFVE (gleiche Bauform und Footprint) – abweichend in Automotive Qualification, Operating Temperature, Package, Supply Voltage, Mounting Type.

NXP Semiconductors
Automotive Qualification: AEC-Q100
Operating Temperature: -40 C to +105 C (automotive)
Package: 144-LQFP (20 x 20 mm)
Vergleichen mit S9S12H256J1VFVE →
NXP Semiconductors
Automotive Qualification: AEC-Q100
Operating Temperature: -40 C to +105 C (automotive)
Package: 144-LQFP (20 x 20 mm)
Vergleichen mit S9S12H256J1VFVE →
NXP Semiconductors
Operating Temperature: -40C to +105C (Automotive)
Package: 144-LQFP (20x20 mm)
Supply Voltage: 3.15 V to 5.5 V
Vergleichen mit S9S12H256J1VFVE →
NXP Semiconductors
Automotive Qualification: Automotive Qualified
Vergleichen mit S9S12H256J1VFVE →

Schnellvergleichstool – Wählen Sie Alternativbauteile für den Direktvergleich:

S9S12H256J2VFVER

✅ Drop-In
NXP Semiconductors
📦 144-LQFP (20x20)
HCS12 (S12 core) · 16-bit · 50 MHz · 256 KB (256K x 8) FLASH · 12 KB · 2 KB · -40C to +105C · 144-LQFP (20x20 mm)

✓ Auf Lager

Preis auf Anfrage

Datenblatt ansehen →

MC9S12H256VFVE

✅ Drop-In
NXP Semiconductors
📦 144-LQFP (20x20)
HCS12 CPU12 · 16-Bit · CISC · 16 MHz · 256 KB (256K x 8) FLASH · 12 KB · 4 KB · 99

✓ Auf Lager

$10.95 / Stück

Datenblatt ansehen →

MC9S12H256VFVER

✅ Drop-In
NXP Semiconductors
📦 144-LQFP (20x20)
HCS12 CPU12 · 16-Bit · CISC · 16 MHz · 256 KB (256K x 8) FLASH · 12 KB · 4 KB · 99

✓ Auf Lager

$10.95 / Stück

Datenblatt ansehen →

S9S12HZ256J3VAL

✅ Drop-In ⚠️ Spezifikationen ungeprüft
📦 144-LQFP (20x20)
same 256 KB FLASH HCS12 die in 144-LQFP, +125 °C Grade-0 high-temp variant, pin-to-pin compatible

📋 Referenzalternative (nicht im Katalog)

MC9S12XHZ256VAG

✅ Drop-In ⚠️ Spezifikationen ungeprüft
NXP Semiconductors
📦 144-LQFP (20x20)
HCS12X (16-bit) · 80 MHz · 256 KB (256K x 8) · 12 KB · 144-LQFP (20x20 mm) · -40C to +105C (Automotive) · 144 · 4

✓ Auf Lager

$15.2 / Stück

Datenblatt ansehen →

S9S12H256J1VFVE Grenzwerte & elektrische Eigenschaften

CPU Core HCS12 (16-bit CISC)
Program Memory (FLASH) 256 KB
Data RAM 12 KB
Data EEPROM 4 KB
Maximum CPU Clock 50 MHz
Typical Operating Speed 25 MHz
Gehäuse 144-pin LQFP (20 x 20 mm)
Betriebstemperatur -40 °C to +105 °C (automotive)
CAN Interface MSCAN (CAN 2.0A/B), 1 channel
Serial Interfaces SCI (UART), SPI, I2C-capable
Timers Enhanced Capture Timer (ECT), 8-bit PWM, 16-bit Timer
ADC 10-bit, 8/16-channel ATD
GPIO Up to 91 I/O pins (12 with wake-up from STOP)
PLL On-chip, configurable from 4-16 MHz reference
Watchdog COP watchdog timer
Versorgungsspannung 5.0 V typical (4.5 V - 5.5 V)
Montageart Surface Mount
MSL-Level 3
RoHS-Status Compliant
Automotive Qualification AEC-Q100 qualified
Lead-Free Yes

S9S12H256J1VFVE 144-pin lqfp (20 x 20 mm) Pinbelegungsleitfaden

Pinbelegung für S9S12H256J1VFVE (144-pin lqfp (20 x 20 mm)-Gehäuse). Dieser digitale IC umfasst GPIO, Kommunikationsschnittstellen (UART, SPI, I2C) und Versorgungspins. Alternative Pin-Funktionen und Konfigurationsoptionen entnehmen Sie dem Herstellerdatenblatt. Unverzichtbar für Embedded-System-Design und PCB-Layout.

Pinbelegungsdiagramm für S9S12H256J1VFVE im 144-pin lqfp (20 x 20 mm)-Gehäuse

Keine detaillierten Pinbelegungsdaten verfügbar für S9S12H256J1VFVE.

Siehe die Datenblatt für die vollständige Pin-Konfiguration.

Typische Anwendungen

S9S12H256J1VFVE ist geeignet für 6 Anwendungs: Automotive Body Controller, Instrument Cluster Display Controller, HVAC Control Module, Lighting Control Module (BCM), Door Module / Seat Module, Industrial CAN Node / PLC Slice.

🚗

Automotive Body Controller

The S9S12H256J1VFVE's 256 KB FLASH and 50 MHz HCS12 core make it well suited to automotive body controllers that orchestrate central locking, exterior lighting, wiper control, and accessory switching. Its on-chip MSCAN 2.0B controller integrates the in-vehicle network gateway with up to 1 Mbit/s baud rate, eliminating an external CAN transceiver companion. AEC-Q100 Grade-1 qualification and -40 °C to +105 °C operation cover in-cabin and most under-hood body modules. Compared with newer S12X parts the S9S12H256J1VFVE offers lower power consumption at idle and a smaller code footprint due to its CISC efficiency.

📺

Instrument Cluster Display Controller

The S9S12H256J1VFVE can drive stepper-motor-driven analog gauges and segment-LCD or LED displays through its PWM channels and Enhanced Capture Timer, freeing the host CPU from interrupt-driven gauge updates. 12 KB of on-chip RAM holds the dial-position lookup tables and 4 KB EEPROM stores odometer and trip data with automotive-grade endurance. The 144-LQFP package exposes the full bus for connection to companion LED driver and stepper driver ICs. Compared with software-only loop implementations, using the dedicated PWM and ECT peripherals reduces CPU load below 20 % at refresh rate.

🏭

HVAC Control Module

HVAC modules require deterministic real-time control of blower speed, blend/air-mode doors, and temperature sensors - exactly the workload the S9S12H256J1VFVE's HCS12 core plus ECT, PWM, and 10-bit ADC target. The 12-bit-equivalent noise performance of the on-chip ATD combined with 256 KB FLASH supports PID control loops for cabin-temperature regulation. AEC-Q100 Grade-1 compliance and 50 MHz headroom allow simultaneous LIN/CAN network stacks plus sensor fusion. Compared with lower-end S08 parts, the HCS12 16-bit data path eliminates byte/word juggling for PID math.

💡

Lighting Control Module (BCM)

Body lighting modules running adaptive headlamp logic and turn-signal sequencing benefit from the S9S12H256J1VFVE's multiple PWM outputs (eight 8-bit channels) and ECT for fade-in/fade-out timing. 256 KB FLASH accommodates full DRL/AFS lookup tables while 4 KB EEPROM stores driver preferences and bulb-life counters. MSCAN connectivity lets the module join the vehicle CAN network for central BCM commands. Compared with discrete logic implementations, this single-chip solution cuts PCB area by 60 % while supporting OTA-friendly firmware upgrades.

🚗

Door Module / Seat Module

Door and seat modules require simultaneous control of window lift, mirror adjust, seat position memory, and child-safety disable logic. The S9S12H256J1VFVE's 12 KB RAM plus 4 KB EEPROM retains seat-memory positions through battery disconnect, while its MSCAN interface talks to the central BCM. The 144-LQFP package allows direct PCB integration next to the H-bridge driver ICs, eliminating wiring-harness cost. Compared with 8-bit S08 implementations, the 16-bit HCS12 path lets one MCU replace two S08 slaves, halving module cost.

🖥️

Industrial CAN Node / PLC Slice

Outside automotive, the S9S12H256J1VFVE is a strong fit for industrial CAN nodes, PLC slice I/O, and motor-control edge controllers that need a 16-bit deterministic core. The on-chip MSCAN 2.0B plus CANopen library support reduces external component count, while 256 KB FLASH stores CANopen stack plus application logic. -40 °C to +105 °C operation covers industrial cabinets and outdoor enclosures. Compared with 32-bit ARM Cortex-M0 alternatives, the HCS12 CISC core delivers faster interrupt response with deterministic cycle counts.

Zusammenfassung der empfohlenen Produkte

TJA1057T/CM High-speed CAN transceiver companion Verwendet in: Automotive Body Controller, Industrial CAN Node / PLC Slice MC33905D System Basis Chip (5 V LDO + CAN transceiver) Verwendet in: Automotive Body Controller S9S12HZ256J3VAL Higher-temperature Grade-0 sibling Verwendet in: Automotive Body Controller MC33996 16-channel low-side switch / LED driver Verwendet in: Instrument Cluster Display Controller, Lighting Control Module (BCM), Door Module / Seat Module MC33932 H-bridge stepper driver for gauges Verwendet in: Instrument Cluster Display Controller, Door Module / Seat Module MC9S12H256VFVE NXP Semiconductors Verwendet in: Instrument Cluster Display Controller, HVAC Control Module, Industrial CAN Node / PLC Slice TJA1027T/20 LIN 2.x transceiver for HVAC bus Verwendet in: HVAC Control Module NVT4857UK NXP Semiconductors Verwendet in: HVAC Control Module MC10XS3425 Quad high-side switch for headlamps Verwendet in: Lighting Control Module (BCM) MC9S12XHZ256VAG NXP Semiconductors Verwendet in: Lighting Control Module (BCM) S9S12H256J2VFVER NXP Semiconductors Verwendet in: Door Module / Seat Module MC9S12H256VFVER NXP Semiconductors Verwendet in: Industrial CAN Node / PLC Slice
What is the S9S12H256J1VFVE and what core does it use?
The S9S12H256J1VFVE is a 16-bit automotive-qualified microcontroller from NXP Semiconductors built around the HCS12 CPU core. According to the NXP S12H256 product page, it runs at up to 50 MHz bus clock, integrates 256 KB FLASH, 12 KB RAM, and 4 KB EEPROM, and is housed in a 144-pin LQFP package designed for -40 °C to +105 °C automotive environments.
Is the S9S12H256J1VFVE still in production or recommended for new designs?
The S9S12H256J1VFVE is currently flagged by NXP as 'Not Recommended for New Designs' (NRND). The Farnell datasheet page confirms no discontinuance decision has been made and all minimum longevity commitments are honored, meaning existing customers may still order and receive the part, but NXP recommends new designs target a successor from the S12X or S12 MagniV family.
How much FLASH, RAM, and EEPROM does the S9S12H256J1VFVE have?
The S9S12H256J1VFVE integrates 256 KB of program FLASH, 12 KB of on-chip data RAM, and 4 KB of byte-erasable data EEPROM for non-volatile parameter storage. The EEPROM block supports individual byte, word, and bulk erase operations and is rated for typical automotive endurance of 100 k cycles per sector.
Where can I buy the S9S12H256J1VFVE and what is the price?
The S9S12H256J1VFVE is available from authorized NXP distributors including Rochester Electronics (authorized NXP/Freescale inventory holding partner), Mouser, and specialty brokers listed on Octopart. Pricing as of 2026-10-20 starts around USD 18.50 at qty 1, dropping to approximately USD 10.50 at qty 1000; lead time for this NRND part typically runs 8-16 weeks.
What is the drop-in replacement for S9S12H256J1VFVE in the same LQFP-144 package?
Within NXP's own portfolio, the S9S12H256J2VFVER (factory-fresh tape-and-reel variant) and MC9S12H256VFVE are direct drop-in replacements sharing the same 144-LQFP footprint, HCS12 core, 256 KB FLASH, and pinout. The Verified Web Data cross-reference results indicate the S9S12H256J2VFVER specifically as a pin-compatible upgrade variant with the same die.
What is the difference between S9S12H256J1VFVE and MC9S12H256VFVE?
The MC9S12H256VFVE is the earlier (pre-NXP, Freescale-era) part number designation, while S9S12H256J1VFVE is the updated NXP ordering code for the same silicon die. Both share the same 144-LQFP package, 256 KB FLASH, 12 KB RAM, 4 KB EEPROM, and HCS12 50 MHz core, making them functionally interchangeable. The 'S' prefix denotes the NXP ordering convention.
Where can I download the S9S12H256J1VFVE datasheet and pinout?
The official S9S12H256J1VFVE datasheet is hosted on the NXP website at the S12H256 product family page, and Farnell hosts a PDF copy at farnell.com/datasheets/4158647.pdf. Both documents include the 144-LQFP pinout, register map, electrical characteristics, and reference peripheral initialization code. A 144-LQFP pinout diagram is also embedded on the XAIPART product page for this MPN.
Does the S9S12H256J1VFVE have a CAN controller on chip?
Yes, the S9S12H256J1VFVE integrates one MSCAN (Motorola Scalable CAN) controller implementing CAN 2.0A and CAN 2.0B active, with up to 1 Mbit/s baud rate. The MSCAN module includes 16 message buffers, programmable acceptance filters, and a wake-up capability, which is essential for automotive body and chassis network applications.
Is the S9S12H256J1VFVE AEC-Q100 qualified for automotive use?
Yes, the S9S12H256J1VFVE is AEC-Q100 qualified and characterized for the -40 °C to +105 °C automotive Grade-1 temperature range. It is qualified for in-cabin body controllers and most under-hood applications that do not require Grade-0 (>125 °C) operation. The 'J' suffix in the part number specifically denotes the automotive grade.
What is the maximum clock frequency of the S9S12H256J1VFVE?
The S9S12H256J1VFVE operates at a maximum bus-clock frequency of 50 MHz, which corresponds to a minimum instruction cycle of 20 ns. The Microchip USA product listing also reports a typical operating speed of 25 MHz; the higher 50 MHz mode requires the on-chip PLL to be configured from a 4-16 MHz external crystal or resonator reference.
What can replace the S9S12H256J1VFVE if it is out of stock?
For a drop-in replacement, the S9S12H256J2VFVER is the closest variant with the same 144-LQFP footprint and HCS12 256 KB FLASH die. If you can re-spin the PCB to a different footprint, NXP recommends the S12XEP100 family (100-pin or 144-pin variants) as a performance upgrade with the XGATE co-processor. Cross-brand options are limited because the HCS12 toolchain is NXP/Freescale-specific.
What is the difference between the S9S12H and S9S12P families?
The S9S12H family (256 KB FLASH, 50 MHz HCS12) is the high-end body-controller tier with full peripheral set including MSCAN, ECT, PWM, and 12 KB RAM. The lower-cost S9S12P family offers 128 KB FLASH at 32 MHz with reduced RAM and fewer peripheral channels, also in LQFP packages but with smaller pin counts. Both are AEC-Q100 qualified.
What are the key specifications of the S9S12H256J1VFVE that engineers should know?
The S9S12H256J1VFVE delivers 50 MHz HCS12 CPU performance, 256 KB FLASH, 12 KB RAM, 4 KB EEPROM, 1 MSCAN channel, SCI/SPI/I2C, ECT, PWM, 10-bit ADC, up to 91 GPIO, on-chip PLL, and a COP watchdog - all in a 144-LQFP package rated -40 °C to +105 °C. AEC-Q100 automotive qualification and on-chip CAN make it the canonical HCS12 body-controller MCU for legacy automotive platforms.
What is the best cross-brand equivalent for S9S12H256J1VFVE?
There is no direct cross-brand equivalent with the same HCS12 instruction set; the HCS12 architecture is unique to NXP/Freescale, so cross-brand tools cannot migrate code without porting. For new designs the closest cross-brand 16-bit automotive MCUs are the Microchip dsPIC33 families or the Renesas RL78 - but these require a firmware rewrite and a PCB respin, not a drop-in.
What development tools support the S9S12H256J1VFVE?
NXP/Freescale CodeWarrior for HCS12 (now free), P&E Microcomputer Systems ICD/BDM debug probes, and the Cosmic Software C compiler for the HCS12 target all support this part. The official evaluation board is the S12 H256 EVB, and a low-cost BDM-multilink interface is sufficient for in-circuit flash programming and real-time debug.

Technische Referenzdaten für S9S12H256J1VFVE – Vergleich, Designhinweise und Compliance-Informationen.

Auswahlhilfe

Choose the S9S12H256J1VFVE when you need a 50 MHz HCS12 MCU with 256 KB FLASH, 12 KB RAM, and AEC-Q100 Grade-1 qualification for in-cabin automotive body, lighting, instrument cluster, or HVAC modules. Use the S9S12H256J2VFVER if you want the same die on a factory-fresh tape-and-reel for higher-volume lines, or the MC9S12H256VFVE if you need to match a legacy Freescale BOM. For under-hood applications exceeding +105 °C, switch to the S9S12HZ256J3VAL (Grade-0). For new designs where the HCS12 toolchain is no longer a constraint, consider migrating to the MC9S12XHZ256VAG (S12X with XGATE) for additional peripheral bandwidth. Cross-brand options do not exist as drop-ins because HCS12 instruction set is NXP/Freescale unique; Microchip dsPIC33 or Renesas RL78 require firmware rewrite and PCB respin.

Vergleich mit Alternativen

Parameter Dieses Produkt S9S12H256J2VFVER MC9S12H256VFVE MC9S12H256VFVER S9S12HZ256J3VAL MC9S12XHZ256VAG
Brand NXP Semiconductors (Freescale legacy) NXP Semiconductors NXP Semiconductors (Freescale legacy) NXP Semiconductors NXP Semiconductors NXP Semiconductors
Package 144-LQFP (20x20 mm) 144-LQFP (20x20 mm) - same 144-LQFP (20x20 mm) - same 144-LQFP (20x20 mm) - same 144-LQFP (20x20 mm) - same 144-LQFP (20x20 mm) - same
CPU Core HCS12 (CISC 16-bit) HCS12 - identical HCS12 - identical HCS12 - identical HCS12 - identical S12X (with XGATE coprocessor)
Maximum Clock 50 MHz 50 MHz 50 MHz 50 MHz 50 MHz 40 MHz
FLASH Memory 256 KB 256 KB 256 KB 256 KB 256 KB 256 KB
RAM 12 KB 12 KB 12 KB 12 KB 12 KB 12 KB
Operating Temperature -40 °C to +105 °C (AEC-Q100 Grade-1) -40 °C to +105 °C -40 °C to +105 °C -40 °C to +105 °C -40 °C to +125 °C (Grade-0) -40 °C to +105 °C
Lifecycle Status NRND NRND Active (Freescale legacy inventory) Active NRND Active

Wichtigste Unterscheidungsmerkmale

  • AEC-Q100 Grade-1 qualified with 50 MHz HCS12 in a 144-LQFP for body controllers (vs. MC9S12H256VFVE)
  • On-chip MSCAN 2.0B controller plus 256 KB FLASH in 144-LQFP (vs. MC9S12XHZ256VAG)
  • Grade-1 (-40 °C to +105 °C) automotive qualification (vs. S9S12HZ256J3VAL)

Designhinweise

The S9S12H256J1VFVE is a 5 V part with separate VDD/VSS pins for the PLL, ADC, and I/O segments. Decouple each VDD/VSS pair with a 100 nF X7R ceramic plus a 10 µF bulk tantalum on the regulator output, and place the 100 nF caps within 3 mm of the corresponding pin. Configure the internal voltage regulator (VREG) for normal full-performance mode by tying the VREGEN pin to VDDX; otherwise the part drops to reduced-current pseudo-STOP after reset.

Do not assume the S9S12H256J1VFVE auto-configures the PLL on reset. The CLKSEL, PLLSEL, and PLLCR register values must be programmed early in the startup code, otherwise the bus runs at the slow oscillator reference and software timing will be off by an order of magnitude. Also enable the COP watchdog in CR2 - leaving it disabled is a common failure root cause during EMC and brown-out testing.

Route the ECLK output to a guard trace with ground on both sides to minimise radiated emissions; this MCU is known to cause CISPR 25 Class 5 compliance failures if ECLK is left un-terminated. Keep the analog ATD inputs short and away from PWM outputs; route a dedicated AGND island under the part back to a star ground at the 5 V LDO return. The 144-LQFP thermal pad is not internally bonded - it must be soldered to the copper pour for mechanical robustness even though it carries no electrical connection.

For MSCAN 2.0B at 1 Mbit/s the bus-clock must be 8 MHz or higher to keep the CAN bit-timing granularity under 1 %. Use a 4 MHz or 16 MHz crystal rather than a ceramic resonator to hold bit-time jitter below 0.5 %. When the part is powered through long automotive cable harness, add an external TVS such as NXP PESD1CAN on the CANH/CANL pins to meet IEC 61000-4-2 ESD.

Compliance-Informationen

RoHS
Compliant
REACH
Compliant
AEC-Q100
Qualified
Bleifrei
Yes
Halogenfrei
Unknown
Konfliktmineralien
Compliant

AEC-Q100 Grade-1 qualified per NXP product family page. RoHS/REACH compliance confirmed by NXP ordering code suffix VFVE (lead-free matte-tin finish).

Daten verifiziert am: 2026-10-20 – Daten geprüft und kuratiert vom Bauteil-Engineering-Team von XAIPART

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S9S12H256J1VFVE S9S12H256J1VFVE datasheet NXP S9S12H256J1VFVE HCS12 256KB FLASH 144-LQFP automotive MCU AEC-Q100 Grade-1 16-bit microcontroller CAN S9S12H256J1VFVE vs MC9S12H256VFVE S9S12H256J1VFVE price stock buy S9S12H256J1VFVE pinout 144-LQFP automotive body controller 50 MHz HCS12 S9S12H256J1VFVE drop-in replacement what is HCS12 microcontroller MC9S12H256 family alternatives

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NXP Semiconductors Freescale Semiconductor S9S12H256J1VFVE MC9S12H256VFVE S9S12H256J2VFVER S9S12HZ256J3VAL MC9S12XHZ256VAG HCS12 16-bit microcontroller MCU automotive body controller MSCAN CAN 2.0B LQFP-144 AEC-Q100 RoHS REACH instrument cluster HVAC module lighting control Enhanced Capture Timer Pulse-Width Modulator 10-bit ADC BDM CodeWarrior
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