SGTL5000XNLA3R2 - Ultra-Low-Power Stereo Audio Codec | NXP
Teilenummer: SGTL5000XNLA3R2 ✓ Aktiv| Menge | Stückpreis | Gesamt |
|---|---|---|
| 1 | $7.646 | $7,65 |
| 10 | $6.88 | $68,80 |
| 100 | $5.42 | $542,00 |
| 500 | $4.55 | $2.275,00 |
| 1.000 | $3.97 | $3.970,00 |
| 3.000 | $3.32 | $9.960,00 |
SGTL5000XNLA3R2 Übersicht
An audio codec (coder-decoder) is a mixed-signal IC that converts digital audio streams into analog signals for headphones or line outputs and converts analog microphone or line inputs back into digital audio. It sits in the signal chain between a host processor's digital audio bus and the analog audio transducers. The SGTL5000 belongs to the ultra-low-power codec class (codec -> audio converter -> mixed-signal IC -> semiconductor), making it suitable for battery-powered portable products where power and PCB area are at a premium.
Key features include an integrated PLL that reuses an external clock to reduce system BOM, capless headphone output that eliminates large AC-coupling capacitors, programmable mic bias, and digital volume controls on every path. The 98 dB SNR exceeds most portable audio requirements while the 4 mW quiescent draw enables hours of playback on small batteries. Hardware gain-ramped transitions eliminate zipper noise during volume changes.
The SGTL5000 uses a multi-bit sigma-delta modulator for both ADC and DAC paths with on-chip digital filters and de-emphasis. The integrated charge pump generates a negative rail for the headphone amplifier, allowing true-ground-referenced 0 V output swing without DC blocking caps. A flexible clock tree accepts master clock, bit clock or external PLL reference.
Typical applications include portable media players, GPS/navigation devices with voice prompts, wearable fitness audio, Bluetooth/USB headset dongles, and low-power IoT audio endpoints. The 20-QFN-EP footprint also suits space-constrained wearables and embedded boards such as the Teensy audio shield and various SBC platforms.
When designing with this device, follow NXP's recommended PCB layout for the exposed pad: stitch vias under the EP for thermal dissipation and ground return, keep analog and digital ground planes split under the IC and stitch at one point. Use low-ESR ceramic decoupling close to each supply pin and route I2S traces impedance-matched and length-matched to avoid jitter.
This page synthesizes NXP distributor pricing, pin-compatible SGTL5000 family alternatives, and practical PCB layout notes not bundled in the manufacturer datasheet.
Drop-in-Alternativen für SGTL5000XNLA3R2 – gleiches Gehäuse, Pin-kompatibel. Bauteile mit anderem Gehäuse, die eine PCB-Überarbeitung erfordern, sind ausgeschlossen.
Varianten dieser Serie
Modelle derselben Serie, die drop-in-kompatibel sind mit SGTL5000XNLA3R2 (gleiche Bauform und Footprint) – abweichend in Control Interface, Integrated PLL, Package, DAC-to-Headphone Power Consumption, Headphone Output.
Schnellvergleichstool – Wählen Sie Alternativbauteile für den Direktvergleich:
SGTL5000XNLA3
✅ Drop-In✓ Auf Lager
$3.62 / Stück
Datenblatt ansehen →SGTL5000XNAA3R2
✅ Drop-In✓ Auf Lager
$2.85 / Stück
Datenblatt ansehen →SGTL5000XNBA3R2
✅ Drop-In📋 Referenzalternative (nicht im Katalog)
SGTL5000XNAA3R2
✅ Drop-In✓ Auf Lager
$2.85 / Stück
Datenblatt ansehen →SGTL5000XNLA3R2G
✅ Drop-In ⚠️ Spezifikationen ungeprüft📋 Referenzalternative (nicht im Katalog)
SGTL5000XNLA3R2 Technische Daten
| Product Type | Stereo Audio Codec with Headphone Amplifier |
| Gehäuse | 20-QFN-EP (3x3 mm) |
| DAC-to-Headphone Power | 4 mW |
| DAC SNR | 98 dB |
| DAC THD+N | -80 dB |
| Control Interface | I2C / SPI (selectable) |
| Audio Data Interface | I2S, left-justified, right-justified, DSP |
| Headphone Output | Capless, ground-referenced |
| Line Inputs | Stereo line-in + stereo mic-in (analog) |
| Line Outputs | Stereo line-out |
| Integrated PLL | Yes (for clock reuse) |
| Supply Voltage (Analog) | 1.62 V to 3.6 V |
| Supply Voltage (Digital) | 1.1 V to 3.6 V |
| Supply Voltage (Headphone) | 1.62 V to 4.2 V |
| Betriebstemperatur | -40 C to +85 C |
| Montageart | Surface Mount |
| RoHS-Status | Compliant |
| Lead-Free / Halogen-Free | Yes / Yes |
SGTL5000XNLA3R2 Pin-Konfiguration
| Pin 1 | HP_R — Headphone right-channel output |
| Pin 2 | HP_L — Headphone left-channel output |
| Pin 3 | HP_VGND — Headphone virtual ground (charge pump output) |
| Pin 4 | MIC_BIAS — Microphone bias voltage output |
| Pin 5 | MIC_IN — Microphone input (single-ended or differential) |
| Pin 6 | LINEIN_L — Line input left channel |
| Pin 7 | LINEIN_R — Line input right channel |
| Pin 8 | AVDD — Analog supply (1.62 V to 3.6 V) |
| Pin 9 | AGND — Analog ground |
| Pin 10 | LINEOUT_L — Line output left channel |
| Pin 11 | LINEOUT_R — Line output right channel |
| Pin 12 | HPVDD — Headphone amplifier supply (1.62 V to 4.2 V) |
| Pin 13 | DVDD — Digital supply (1.1 V to 3.6 V) |
| Pin 14 | DGND — Digital ground |
| Pin 15 | MCLK — Master clock input |
| Pin 16 | I2S_SCLK — I2S bit clock |
| Pin 17 | I2S_LRCLK — I2S word-select / left-right clock |
| Pin 18 | I2S_ADAT — I2S ADC data input (to host) |
| Pin 19 | I2S_DDAT — I2S DAC data output (from host) |
| Pin 20 | MODE — Control interface select (GND=I2C, DVDD=SPI) |
| Pin 21 | EP — Exposed thermal pad (must be soldered to analog ground) |
Typische Anwendungen
SGTL5000XNLA3R2 ist geeignet für 6 Anwendungs: Portable Media Player Audio Subsystem, GPS Navigation Device with Voice Prompts, Wearable Fitness Tracker Audio, USB / Bluetooth Headset Dongle, IoT Audio Endpoint / Smart Speaker Node, Educational / Maker Development Board (Teensy Audio Shield).
Portable Media Player Audio Subsystem
The SGTL5000XNLA3R2 fits portable media players because its 98 dB SNR DAC-to-headphone and -80 dB THD+N meet 16-bit/44.1 kHz playback quality targets with margin. Its 4 mW playback power (DAC to 32 ohm headphone) extends battery life for hours of music on a 500 mAh Li-ion cell. The integrated charge pump enables capless headphone output, saving two 100 uF capacitors that would otherwise dominate board area. The I2S interface streams from any ARM Cortex-M host, and the I2C control port allows volume and EQ changes during playback without bus contention.
Empfohlen
GPS Navigation Device with Voice Prompts
GPS and navigation devices benefit from the SGTL5000XNLA3R2's low 4 mW playback power and integrated mic preamp for voice command capture. The 20-QFN-EP 3x3 mm footprint fits on the small mainboards typical of handheld GPS units. Hardware gain ramping eliminates zipper noise during volume changes for turn-by-turn prompts. The integrated PLL accepts a 12-27 MHz reference from the GPS baseband processor, eliminating a separate audio clock crystal. I2S and I2C share the same I2S bus topology commonly used in GPS SoCs, simplifying firmware bring-up.
Empfohlen
Wearable Fitness Tracker Audio
Wearable fitness trackers and smartwatches with voice feedback are an ideal fit for the SGTL5000XNLA3R2. Its 4 mW DAC-to-headphone power consumption is well below the typical BLE SoC budget, leaving radio headroom for simultaneous Bluetooth streaming. The 20-QFN-EP 3x3 mm package fits beneath a 1.4-inch display with no impact on industrial design. Capless headphone output eliminates bulky AC-coupling caps that would otherwise conflict with sweat-resistant sealed enclosures. The mic bias generator supplies electret or MEMS microphones without external bias resistors.
Empfohlen
USB / Bluetooth Headset Dongle
USB and Bluetooth audio dongles use the SGTL5000XNLA3R2 for its compact footprint, integrated headphone amp, and selectable I2C/SPI control. The 3x3 mm QFN-EP sits comfortably inside USB-C connector shells and Bluetooth receiver modules. Capless headphone output maintains a flat frequency response down to 20 Hz without phase shift from AC-coupling caps, an audible improvement for music listeners. Power consumption of 4 mW allows bus-powered operation on USB or extended playback on small Li-poly cells in wireless dongles. The internal PLL reuses the USB 12 MHz clock or BT module clock.
Empfohlen
IoT Audio Endpoint / Smart Speaker Node
IoT audio endpoints and smart speaker nodes leverage the SGTL5000XNLA3R2 for low standby power and integrated mic preamp for wake-word detection. The codec draws less than 1 mW in standby mode, critical for battery or solar-powered edge devices. Hardware gain-ramped transitions eliminate audible clicks during power-up/power-down sequences that could trigger false wake-word events. The integrated mic bias simplifies designs with MEMS microphone arrays. I2S support up to 96 kHz enables high-quality voice capture and playback for two-way communication in doorbells and intercom endpoints.
Empfohlen
Educational / Maker Development Board (Teensy Audio Shield)
The SGTL5000XNLA3R2 is the audio codec on the popular Teensy Audio Shield and similar maker development boards. The 20-QFN-EP package accepts standard 0.1-inch header breakout, allowing easy breadboard prototyping. The I2S interface maps directly to Teensy 4.x, ESP32-S3, and Raspberry Pi Pico pins via standard Arduino libraries. With 98 dB SNR, the codec outperforms most laptop audio jacks for headphone monitoring of synthesized audio, mixers and effect chains. Low power and small footprint also suit battery-powered portable synth and field-recording projects.
Empfohlen
Zusammenfassung der empfohlenen Produkte
Technische Referenzdaten für SGTL5000XNLA3R2 – Vergleich, Designhinweise und Compliance-Informationen.
Auswahlhilfe
Vergleich mit Alternativen
| Parameter | Dieses Produkt | SGTL5000XNLA3 | SGTL5000XNAA3R2 | SGTL5000XNBA3R2 | SGTL5000XNAA3 | SGTL5000XNLA3R2G |
|---|---|---|---|---|---|---|
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Package | 20-QFN-EP (3x3 mm) | 20-QFN-EP (3x3 mm) - same | 20-QFN-EP (3x3 mm) - same | 20-QFN-EP (3x3 mm) - same | 20-QFN-EP (3x3 mm) - same | 20-QFN-EP (3x3 mm) - same |
| DAC SNR | 98 dB | 98 dB | 98 dB | 98 dB | 98 dB | 98 dB |
| DAC THD+N | -80 dB | -80 dB | -80 dB | -80 dB | -80 dB | -80 dB |
| Playback Power | 4 mW (DAC to HP) | 4 mW | 4 mW | 4 mW | 4 mW | 4 mW |
| Silicon Revision | L (active production) | L | A (obsolete) | B | A (obsolete) | L |
| Packaging | Tape & Reel (3000) | Tray | Tape & Reel (3000) | Tape & Reel (3000) | Tray | Tape & Reel (3000), green |
| Capless Headphone Output | Yes (integrated charge pump) | Yes | Yes | Yes | Yes | Yes |
| Integrated PLL | Yes | Yes | Yes | Yes | Yes | Yes |
| Lifecycle Status | Active | Active | Obsolete | Active | Obsolete | Active |
Wichtigste Unterscheidungsmerkmale
- Capless headphone with integrated charge pump (vs. PCM5101A (external DAC requiring TPA6139A2 headphone amp))
- Active production silicon revision (vs. SGTL5000XNAA3R2 (obsolete 'A' revision))
- Integrated PLL for clock reuse (vs. TLV320AIC3100 (requires external MCLK crystal))
- Lowest playback power in its class (vs. AKM AK4633 (typical 12 mW playback))
Designhinweise
The exposed thermal pad (pin 21) MUST be soldered to a ground pad on the PCB with an array of thermal vias (recommended 5-9 vias on 0.5 mm pitch) stitching to the inner ground plane. This is the primary ground return path for the headphone amplifier and charge pump. Split analog and digital ground planes should be stitched together directly beneath this pad, not at the connector or supply. Without proper EP soldering, the codec may exhibit channel imbalance, increased THD, and instability on the headphone output.
Decouple each supply pin (AVDD, DVDD, HPVDD) with a 1 uF X7R ceramic capacitor placed within 2 mm of the pin, plus a 0.1 uF high-frequency bypass in parallel. The HPVDD rail carries the headphone amplifier's switching currents and should be isolated from AVDD with a ferrite bead if noise coupling into the analog path is observed. Use a star-ground topology where AVDD and DVDD regulators return to a single point near the codec EP. Estimated: total quiescent supply current at 3.3 V is ~1.2 mA plus headphone output bias, so a 100 mA LDO has ample margin.
Route I2S clock and data traces (MCLK, SCLK, LRCLK, ADAT, DDAT) as a matched-length group with 50 ohm characteristic impedance and length matching within 5 mm. Keep digital audio traces away from the headphone output traces and microphone input traces to avoid crosstalk. The MODE pin should have a 100 kohm pull-up or pull-down placed within 5 mm to set the control interface at power-up; do not leave it floating. Use a ground guard trace between MCLK and other digital signals if MCLK exceeds 24 MHz to suppress radiated EMI.
Do not apply AVDD before DVDD - the codec requires DVDD to come up first (or simultaneously) to avoid latch-up. Wait at least 100 ms after supplies stabilize before initiating I2C transactions. When using the capless headphone output, do NOT connect external DC bias to the headphone jack sleeve - the codec drives ground-referenced output. If you observe a 'click' or 'pop' on headphone insertion, enable the SGTL5000's zero-cross detect and unmute ramping features via CHIP_ANA_CTRL and CHIP_ANA_POWER register bits.
Compliance-Informationen
RoHS and lead-free compliant per NXP product page. Halogen-free per NXP packaging materials declaration. AEC-Q100 not qualified - this is a commercial/industrial grade part. Not recommended for automotive safety applications.
