SGTL5000XNLA3R2 - Ultra-Low-Power Stereo Audio Codec | NXP
Артикул: SGTL5000XNLA3R2 ✓ Активен| Кол-во | Цена за ед. | Итого |
|---|---|---|
| 1 | $7.646 | $7,65 |
| 10 | $6.88 | $68,80 |
| 100 | $5.42 | $542,00 |
| 500 | $4.55 | $2.275,00 |
| 1.000 | $3.97 | $3.970,00 |
| 3.000 | $3.32 | $9.960,00 |
SGTL5000XNLA3R2 Обзор
An audio codec (coder-decoder) is a mixed-signal IC that converts digital audio streams into analog signals for headphones or line outputs and converts analog microphone or line inputs back into digital audio. It sits in the signal chain between a host processor's digital audio bus and the analog audio transducers. The SGTL5000 belongs to the ultra-low-power codec class (codec -> audio converter -> mixed-signal IC -> semiconductor), making it suitable for battery-powered portable products where power and PCB area are at a premium.
Key features include an integrated PLL that reuses an external clock to reduce system BOM, capless headphone output that eliminates large AC-coupling capacitors, programmable mic bias, and digital volume controls on every path. The 98 dB SNR exceeds most portable audio requirements while the 4 mW quiescent draw enables hours of playback on small batteries. Hardware gain-ramped transitions eliminate zipper noise during volume changes.
The SGTL5000 uses a multi-bit sigma-delta modulator for both ADC and DAC paths with on-chip digital filters and de-emphasis. The integrated charge pump generates a negative rail for the headphone amplifier, allowing true-ground-referenced 0 V output swing without DC blocking caps. A flexible clock tree accepts master clock, bit clock or external PLL reference.
Typical applications include portable media players, GPS/navigation devices with voice prompts, wearable fitness audio, Bluetooth/USB headset dongles, and low-power IoT audio endpoints. The 20-QFN-EP footprint also suits space-constrained wearables and embedded boards such as the Teensy audio shield and various SBC platforms.
When designing with this device, follow NXP's recommended PCB layout for the exposed pad: stitch vias under the EP for thermal dissipation and ground return, keep analog and digital ground planes split under the IC and stitch at one point. Use low-ESR ceramic decoupling close to each supply pin and route I2S traces impedance-matched and length-matched to avoid jitter.
This page synthesizes NXP distributor pricing, pin-compatible SGTL5000 family alternatives, and practical PCB layout notes not bundled in the manufacturer datasheet.
Аналоги без доработки для SGTL5000XNLA3R2 — тот же корпус, pin-to-pin совместимость. Компоненты в других корпусах, требующие переработки PCB, исключены.
Варианты в этой серии
Модели той же серии, совместимые без доработки с SGTL5000XNLA3R2 (тот же форм-фактор и посадочное место) — отличается по Control Interface, Integrated PLL, Package, DAC-to-Headphone Power Consumption, Headphone Output.
Инструмент быстрого сравнения — выберите альтернативные компоненты для сравнения бок о бок:
SGTL5000XNLA3
✅ Прямая замена✓ В наличии
$3.62 / шт.
Открыть даташит →SGTL5000XNAA3R2
✅ Прямая замена✓ В наличии
$2.85 / шт.
Открыть даташит →SGTL5000XNBA3R2
✅ Прямая замена📋 Справочный аналог (нет в каталоге)
SGTL5000XNAA3R2
✅ Прямая замена✓ В наличии
$2.85 / шт.
Открыть даташит →SGTL5000XNLA3R2G
✅ Прямая замена ⚠️ Характеристики не проверены📋 Справочный аналог (нет в каталоге)
SGTL5000XNLA3R2 Характеристики
| Product Type | Stereo Audio Codec with Headphone Amplifier |
| Корпус | 20-QFN-EP (3x3 mm) |
| DAC-to-Headphone Power | 4 mW |
| DAC SNR | 98 dB |
| DAC THD+N | -80 dB |
| Control Interface | I2C / SPI (selectable) |
| Audio Data Interface | I2S, left-justified, right-justified, DSP |
| Headphone Output | Capless, ground-referenced |
| Line Inputs | Stereo line-in + stereo mic-in (analog) |
| Line Outputs | Stereo line-out |
| Integrated PLL | Yes (for clock reuse) |
| Supply Voltage (Analog) | 1.62 V to 3.6 V |
| Supply Voltage (Digital) | 1.1 V to 3.6 V |
| Supply Voltage (Headphone) | 1.62 V to 4.2 V |
| Рабочая температура | -40 C to +85 C |
| Тип монтажа | Surface Mount |
| Статус RoHS | Compliant |
| Lead-Free / Halogen-Free | Yes / Yes |
Конфигурация выводов SGTL5000XNLA3R2
| Контакт 1 | HP_R — Headphone right-channel output |
| Контакт 2 | HP_L — Headphone left-channel output |
| Контакт 3 | HP_VGND — Headphone virtual ground (charge pump output) |
| Контакт 4 | MIC_BIAS — Microphone bias voltage output |
| Контакт 5 | MIC_IN — Microphone input (single-ended or differential) |
| Контакт 6 | LINEIN_L — Line input left channel |
| Контакт 7 | LINEIN_R — Line input right channel |
| Контакт 8 | AVDD — Analog supply (1.62 V to 3.6 V) |
| Контакт 9 | AGND — Analog ground |
| Контакт 10 | LINEOUT_L — Line output left channel |
| Контакт 11 | LINEOUT_R — Line output right channel |
| Контакт 12 | HPVDD — Headphone amplifier supply (1.62 V to 4.2 V) |
| Контакт 13 | DVDD — Digital supply (1.1 V to 3.6 V) |
| Контакт 14 | DGND — Digital ground |
| Контакт 15 | MCLK — Master clock input |
| Контакт 16 | I2S_SCLK — I2S bit clock |
| Контакт 17 | I2S_LRCLK — I2S word-select / left-right clock |
| Контакт 18 | I2S_ADAT — I2S ADC data input (to host) |
| Контакт 19 | I2S_DDAT — I2S DAC data output (from host) |
| Контакт 20 | MODE — Control interface select (GND=I2C, DVDD=SPI) |
| Контакт 21 | EP — Exposed thermal pad (must be soldered to analog ground) |
Типичное применение
SGTL5000XNLA3R2 подходит для 6 применениеs: Portable Media Player Audio Subsystem, GPS Navigation Device with Voice Prompts, Wearable Fitness Tracker Audio, USB / Bluetooth Headset Dongle, IoT Audio Endpoint / Smart Speaker Node, Educational / Maker Development Board (Teensy Audio Shield).
Portable Media Player Audio Subsystem
The SGTL5000XNLA3R2 fits portable media players because its 98 dB SNR DAC-to-headphone and -80 dB THD+N meet 16-bit/44.1 kHz playback quality targets with margin. Its 4 mW playback power (DAC to 32 ohm headphone) extends battery life for hours of music on a 500 mAh Li-ion cell. The integrated charge pump enables capless headphone output, saving two 100 uF capacitors that would otherwise dominate board area. The I2S interface streams from any ARM Cortex-M host, and the I2C control port allows volume and EQ changes during playback without bus contention.
Рекомендуется
GPS Navigation Device with Voice Prompts
GPS and navigation devices benefit from the SGTL5000XNLA3R2's low 4 mW playback power and integrated mic preamp for voice command capture. The 20-QFN-EP 3x3 mm footprint fits on the small mainboards typical of handheld GPS units. Hardware gain ramping eliminates zipper noise during volume changes for turn-by-turn prompts. The integrated PLL accepts a 12-27 MHz reference from the GPS baseband processor, eliminating a separate audio clock crystal. I2S and I2C share the same I2S bus topology commonly used in GPS SoCs, simplifying firmware bring-up.
Рекомендуется
Wearable Fitness Tracker Audio
Wearable fitness trackers and smartwatches with voice feedback are an ideal fit for the SGTL5000XNLA3R2. Its 4 mW DAC-to-headphone power consumption is well below the typical BLE SoC budget, leaving radio headroom for simultaneous Bluetooth streaming. The 20-QFN-EP 3x3 mm package fits beneath a 1.4-inch display with no impact on industrial design. Capless headphone output eliminates bulky AC-coupling caps that would otherwise conflict with sweat-resistant sealed enclosures. The mic bias generator supplies electret or MEMS microphones without external bias resistors.
Рекомендуется
USB / Bluetooth Headset Dongle
USB and Bluetooth audio dongles use the SGTL5000XNLA3R2 for its compact footprint, integrated headphone amp, and selectable I2C/SPI control. The 3x3 mm QFN-EP sits comfortably inside USB-C connector shells and Bluetooth receiver modules. Capless headphone output maintains a flat frequency response down to 20 Hz without phase shift from AC-coupling caps, an audible improvement for music listeners. Power consumption of 4 mW allows bus-powered operation on USB or extended playback on small Li-poly cells in wireless dongles. The internal PLL reuses the USB 12 MHz clock or BT module clock.
Рекомендуется
IoT Audio Endpoint / Smart Speaker Node
IoT audio endpoints and smart speaker nodes leverage the SGTL5000XNLA3R2 for low standby power and integrated mic preamp for wake-word detection. The codec draws less than 1 mW in standby mode, critical for battery or solar-powered edge devices. Hardware gain-ramped transitions eliminate audible clicks during power-up/power-down sequences that could trigger false wake-word events. The integrated mic bias simplifies designs with MEMS microphone arrays. I2S support up to 96 kHz enables high-quality voice capture and playback for two-way communication in doorbells and intercom endpoints.
Рекомендуется
Educational / Maker Development Board (Teensy Audio Shield)
The SGTL5000XNLA3R2 is the audio codec on the popular Teensy Audio Shield and similar maker development boards. The 20-QFN-EP package accepts standard 0.1-inch header breakout, allowing easy breadboard prototyping. The I2S interface maps directly to Teensy 4.x, ESP32-S3, and Raspberry Pi Pico pins via standard Arduino libraries. With 98 dB SNR, the codec outperforms most laptop audio jacks for headphone monitoring of synthesized audio, mixers and effect chains. Low power and small footprint also suit battery-powered portable synth and field-recording projects.
Рекомендуется
Сводка рекомендуемых товаров
Справочные инженерные данные для SGTL5000XNLA3R2 — сравнение, рекомендации по проектированию и информация о соответствии.
Руководство по выбору
Сравнение с аналогами
| Параметр | Этот товар | SGTL5000XNLA3 | SGTL5000XNAA3R2 | SGTL5000XNBA3R2 | SGTL5000XNAA3 | SGTL5000XNLA3R2G |
|---|---|---|---|---|---|---|
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Package | 20-QFN-EP (3x3 mm) | 20-QFN-EP (3x3 mm) - same | 20-QFN-EP (3x3 mm) - same | 20-QFN-EP (3x3 mm) - same | 20-QFN-EP (3x3 mm) - same | 20-QFN-EP (3x3 mm) - same |
| DAC SNR | 98 dB | 98 dB | 98 dB | 98 dB | 98 dB | 98 dB |
| DAC THD+N | -80 dB | -80 dB | -80 dB | -80 dB | -80 dB | -80 dB |
| Playback Power | 4 mW (DAC to HP) | 4 mW | 4 mW | 4 mW | 4 mW | 4 mW |
| Silicon Revision | L (active production) | L | A (obsolete) | B | A (obsolete) | L |
| Packaging | Tape & Reel (3000) | Tray | Tape & Reel (3000) | Tape & Reel (3000) | Tray | Tape & Reel (3000), green |
| Capless Headphone Output | Yes (integrated charge pump) | Yes | Yes | Yes | Yes | Yes |
| Integrated PLL | Yes | Yes | Yes | Yes | Yes | Yes |
| Lifecycle Status | Active | Active | Obsolete | Active | Obsolete | Active |
Ключевые отличия
- Capless headphone with integrated charge pump (против PCM5101A (external DAC requiring TPA6139A2 headphone amp))
- Active production silicon revision (против SGTL5000XNAA3R2 (obsolete 'A' revision))
- Integrated PLL for clock reuse (против TLV320AIC3100 (requires external MCLK crystal))
- Lowest playback power in its class (против AKM AK4633 (typical 12 mW playback))
Заметки по проектированию
The exposed thermal pad (pin 21) MUST be soldered to a ground pad on the PCB with an array of thermal vias (recommended 5-9 vias on 0.5 mm pitch) stitching to the inner ground plane. This is the primary ground return path for the headphone amplifier and charge pump. Split analog and digital ground planes should be stitched together directly beneath this pad, not at the connector or supply. Without proper EP soldering, the codec may exhibit channel imbalance, increased THD, and instability on the headphone output.
Decouple each supply pin (AVDD, DVDD, HPVDD) with a 1 uF X7R ceramic capacitor placed within 2 mm of the pin, plus a 0.1 uF high-frequency bypass in parallel. The HPVDD rail carries the headphone amplifier's switching currents and should be isolated from AVDD with a ferrite bead if noise coupling into the analog path is observed. Use a star-ground topology where AVDD and DVDD regulators return to a single point near the codec EP. Estimated: total quiescent supply current at 3.3 V is ~1.2 mA plus headphone output bias, so a 100 mA LDO has ample margin.
Route I2S clock and data traces (MCLK, SCLK, LRCLK, ADAT, DDAT) as a matched-length group with 50 ohm characteristic impedance and length matching within 5 mm. Keep digital audio traces away from the headphone output traces and microphone input traces to avoid crosstalk. The MODE pin should have a 100 kohm pull-up or pull-down placed within 5 mm to set the control interface at power-up; do not leave it floating. Use a ground guard trace between MCLK and other digital signals if MCLK exceeds 24 MHz to suppress radiated EMI.
Do not apply AVDD before DVDD - the codec requires DVDD to come up first (or simultaneously) to avoid latch-up. Wait at least 100 ms after supplies stabilize before initiating I2C transactions. When using the capless headphone output, do NOT connect external DC bias to the headphone jack sleeve - the codec drives ground-referenced output. If you observe a 'click' or 'pop' on headphone insertion, enable the SGTL5000's zero-cross detect and unmute ramping features via CHIP_ANA_CTRL and CHIP_ANA_POWER register bits.
Информация о соответствии
RoHS and lead-free compliant per NXP product page. Halogen-free per NXP packaging materials declaration. AEC-Q100 not qualified - this is a commercial/industrial grade part. Not recommended for automotive safety applications.
