SPC5516GBMLQ66 - 32-bit Dual-Core 66MHz MCU 1MB Flash | NXP
Teilenummer: SPC5516GBMLQ66 ✓ Aktiv| Menge | Stückpreis | Gesamt |
|---|---|---|
| 1 | $18.5 | $18,50 |
| 10 | $16.2 | $162,00 |
| 100 | $13.85 | $1.385,00 |
| 500 | $11.95 | $5.975,00 |
| 1.000 | $10.4 | $10.400,00 |
SPC5516GBMLQ66 Übersicht
A microcontroller (MCU) is an integrated circuit that combines a CPU core, program memory (Flash/ROM), data memory (RAM), and peripheral interfaces on a single die. The MPC55xx Qorivva family sits within NXP's broader Power Architecture-based automotive MCU portfolio, positioned between 8/16-bit legacy automotive controllers and the higher-performance MPC56/MPC57 multi-core devices, serving body, chassis, and gateway ECUs.
Key differentiating specifications include dual-core e200z0/e200z1 architecture (one core may be a checker or lockstep partner), 66 MHz system clock, 1 MB single-bank Flash with ECC, and AEC-Q100 automotive qualification. The device offers 111 general-purpose I/O, supporting extensive pin mapping for body-control applications. Its peripheral set includes multiple FlexCAN modules, DSPI, eSCI, and an external bus interface.
Internally the device uses a Harvard-style architecture with separate program/data paths and integrated interrupt controller. Hardware ECC protects the Flash array against soft errors, and the device supports background debug mode (BDM) for non-intrusive development. The 144-LQFP package exposes the full address/data bus plus dedicated peripheral pins.
Typical applications include automotive body controllers, gateway ECUs, lighting modules, HVAC control, instrument cluster peripherals, and industrial CAN-connected controllers. The dual-core configuration is well-suited to functional-safety applications where one core runs diagnostic software in lockstep.
When designing with this part, allocate sufficient decoupling (100 nF plus bulk) near each VDD/VSS pair, route the external bus signals with matched impedance if used at high frequency, and verify the JTAG/BDM header follows NXP's recommended 14-pin ribbon layout. AEC-Q100 Grade 3 supports -40C to +125C operation.
This page synthesizes distributor pricing, AEC-Q100 compliance notes, and pin-compatible Qorivva-family alternatives not consolidated in the manufacturer datasheet alone.
Drop-in-Alternativen für SPC5516GBMLQ66 – gleiches Gehäuse, Pin-kompatibel. Bauteile mit anderem Gehäuse, die eine PCB-Überarbeitung erfordern, sind ausgeschlossen.
Varianten dieser Serie
Modelle derselben Serie, die drop-in-kompatibel sind mit SPC5516GBMLQ66 (gleiche Bauform und Footprint) – abweichend in Package, Supply Voltage, Core Size, Operating Temperature, Core Architecture.
Schnellvergleichstool – Wählen Sie Alternativbauteile für den Direktvergleich:
SPC5514GBMLQ66
✅ Drop-In ⚠️ Spezifikationen ungeprüft📋 Referenzalternative (nicht im Katalog)
SPC5515GBMLQ66
✅ Drop-In ⚠️ Spezifikationen ungeprüft📋 Referenzalternative (nicht im Katalog)
SPC5517GBMLQ66
✅ Drop-In ⚠️ Spezifikationen ungeprüft📋 Referenzalternative (nicht im Katalog)
MPC5554MZP132
✅ Drop-In ⚠️ Spezifikationen ungeprüft✓ Auf Lager
$92.3818 / Stück
Datenblatt ansehen →MPC5566MZP132
✅ Drop-In ⚠️ Spezifikationen ungeprüft📋 Referenzalternative (nicht im Katalog)
SPC5516GBMLQ66 Grenzwerte & elektrische Eigenschaften
| Core Processor | e200z0, e200z1 |
| Core Size | 32-Bit Dual-Core |
| Core Architecture | Power Architecture (MPC55xx Qorivva) |
| Maximum Clock Speed | 66 MHz |
| Program Memory Size | 1 MB (1M x 8) FLASH |
| Program Memory Type | Flash with ECC |
| Versorgungsspannung | 4.5 V to 5.25 V |
| Number of I/O | 111 |
| Connectivity | CANbus, EBI/EMI, I2C, SCI, SPI |
| Peripherals | DMA, POR, PWM, WDT |
| Datenbusbreite | 32-bit |
| Gehäuse | 144-LQFP (20 x 20 mm, 1.40 mm height) |
| Montageart | Surface Mount |
| Betriebstemperatur | -40C to +125C (AEC-Q100 Grade 3) |
| AEC-Q100 Qualified | Yes (automotive grade) |
| RoHS-Status | Compliant |
SPC5516GBMLQ66 144-lqfp (20 x 20 mm, 1.40 mm height) Pinbelegungsleitfaden
Pinbelegung für SPC5516GBMLQ66 (144-lqfp (20 x 20 mm, 1.40 mm height)-Gehäuse). Dieser digitale IC umfasst GPIO, Kommunikationsschnittstellen (UART, SPI, I2C) und Versorgungspins. Alternative Pin-Funktionen und Konfigurationsoptionen entnehmen Sie dem Herstellerdatenblatt. Unverzichtbar für Embedded-System-Design und PCB-Layout.
Keine detaillierten Pinbelegungsdaten verfügbar für SPC5516GBMLQ66.
Siehe die Datenblatt für die vollständige Pin-Konfiguration.
Typische Anwendungen
SPC5516GBMLQ66 ist geeignet für 7 Anwendungs: Automotive Body Control Module, Automotive Gateway ECU, HVAC Control Module, Instrument Cluster Peripherals, Industrial CAN-Connected Controller, Lighting Control Module, Powertrain Peripheral Controller.
Automotive Body Control Module
The SPC5516GBMLQ66 is well-suited for body control modules (BCMs) that coordinate lighting, door locks, wipers, and accessory controls. Its 1 MB Flash comfortably holds a CAN/LIN gateway stack plus body-controller firmware with OBD-II diagnostics. The 111 GPIO handle the many switched loads and sensor inputs typical of a BCM, while dual FlexCAN modules support powertrain CAN and body CAN simultaneously. AEC-Q100 Grade 3 qualification and -40C to +125C operation cover under-dash thermal environments. The 5 V supply rail matches conventional automotive battery feeds after reverse-battery protection.
Empfohlen
Automotive Gateway ECU
For in-vehicle network gateways bridging CAN, LIN, and FlexRay domains, the SPC5516GBMLQ66's dual-core e200z0/e200z1 architecture enables one core to handle CAN routing while the other runs diagnostics or network management. The External Bus Interface (EBI/EMI) supports a companion Ethernet or FlexRay controller for high-bandwidth links. Hardware ECC on Flash protects routing tables against soft errors during long vehicle lifetimes. The 144-LQFP package exposes the full peripheral set, and 1 MB Flash is sufficient for AUTOSAR-style stacks with multiple CAN interfaces.
Empfohlen
HVAC Control Module
In HVAC control modules, the SPC5516GBMLQ66 drives stepper motors, reads temperature/pressure sensors, and manages CAN/LIN communication with the body controller. The PWM channels control blower speed and mode doors, while the eSCI handles UART diagnostics during EOL programming. AEC-Q100 qualification and 5 V supply match automotive HVAC environments, and 1 MB Flash supports complex control algorithms with adaptive learning. The 111 GPIO accommodate multiple sensor inputs and actuator outputs typical of climate-control ECUs.
Empfohlen
Instrument Cluster Peripherals
As a peripheral processor in an instrument cluster, the SPC5516GBMLQ66 handles gauge drive signals, telltale indicators, and CAN message filtering while the main display processor renders graphics. Its PWM channels generate dimmable backlight drive signals, and the eSCI provides UART debug. Dual-core lockstep supports ASIL-A decomposition of indicator-control functions. The 144-LQFP package allows PCB co-layout with the main MCU on the same board with shared CAN bus to the gateway.
Empfohlen
Industrial CAN-Connected Controller
Outside automotive, the SPC5516GBMLQ66 serves industrial CANopen or DeviceNet controllers where AEC-Q100 over-qualification provides extra margin for harsh factory environments. Its 5 V supply, 66 MHz clock, and dual CAN interfaces support real-time industrial networking. The e200z1 core handles CANopen stack plus application logic, while the e200z0 core runs safety monitoring. The 1 MB Flash accommodates CANopen profile libraries plus custom application code with field-upgrade capability.
Empfohlen
Lighting Control Module
The SPC5516GBMLQ66 drives LED headlamp controllers, daytime running lights, and adaptive lighting systems requiring CAN communication with the BCM. Its PWM peripherals generate dimming signals for LED strings, and 111 GPIO handle multiple lamp outputs. AEC-Q100 Grade 3 operation ensures reliability in the under-hood thermal envelope near lighting modules. The 1 MB Flash supports complex lighting algorithms including matrix-beam control and welcome-sequence animation.
Empfohlen
Powertrain Peripheral Controller
As a peripheral processor alongside the main powertrain MCU, the SPC5516GBMLQ66 manages sensor acquisition (crank, cam, oxygen sensors) and pre-processing before forwarding to the main ECU via CAN. The dual-core architecture supports sensor diagnostics in lockstep mode. AEC-Q100 Grade 3 qualification and 125C junction temperature support under-hood mounting. The 144-LQFP package's 111 GPIO accommodate multiple sensor inputs and actuator control outputs typical of peripheral powertrain modules.
Empfohlen
Zusammenfassung der empfohlenen Produkte
Technische Referenzdaten für SPC5516GBMLQ66 – Vergleich, Designhinweise und Compliance-Informationen.
Auswahlhilfe
Vergleich mit Alternativen
| Parameter | Dieses Produkt | SPC5514GBMLQ66 | SPC5515GBMLQ66 | SPC5517GBMLQ66 | MPC5554MZP132 | MPC5566MZP132 |
|---|---|---|---|---|---|---|
| Brand | NXP Semiconductors | NXP Semiconductors - same | NXP Semiconductors - same | NXP Semiconductors - same | NXP Semiconductors - same | NXP Semiconductors - same |
| Package | 144-LQFP (20x20) | 144-LQFP (20x20) - same | 144-LQFP (20x20) - same | 144-LQFP (20x20) - same | 144-LQFP (20x20) - same | 144-LQFP (20x20) - same |
| Core Architecture | e200z0/e200z1 dual-core | e200z0/e200z1 dual-core - same | e200z0/e200z1 dual-core - same | e200z0/e200z1 dual-core - same | e200z6 single-core | e200z6 single-core |
| Maximum Clock Speed | 66 MHz | 66 MHz - same | 66 MHz - same | 66 MHz - same | 132 MHz | 132 MHz |
| Flash Memory | 1 MB | 512 KB | 768 KB | 1 MB | 2 MB | 3 MB |
| GPIO Count | 111 | 111 | 111 | 111 | 112 | 112 |
| Supply Voltage | 4.5 V to 5.25 V | 4.5 V to 5.25 V - same | 4.5 V to 5.25 V - same | 4.5 V to 5.25 V - same | 4.5 V to 5.25 V | 4.5 V to 5.25 V |
| AEC-Q100 Grade | Grade 3 (-40C to +125C) | Grade 3 - same | Grade 3 - same | Grade 3 - same | Grade 3 - same | Grade 3 - same |
Wichtigste Unterscheidungsmerkmale
- Dual-core e200z0/e200z1 architecture with lockstep support (vs. MPC5554MZP132)
- Optimal Flash size for body/gateway applications (vs. SPC5514GBMLQ66)
- Mature automotive-grade Qorivva family with proven AEC-Q100 reliability (vs. SPC5517GBMLQ66)
Designhinweise
The SPC5516GBMLQ66 requires multiple supply rails: 5 V on VDD_HV/VSS for I/O and 1.5 V core logic internally derived. Place a 100 nF ceramic decoupling capacitor within 2 mm of each VDD/VSS pair, plus a bulk 10 uF tantalum or ceramic capacitor on each supply rail. The internal voltage regulator needs a stable 5 V input; do not allow input droop below 4.5 V or POR will trigger.
Estimated: At maximum clock (66 MHz) with both cores active, the SPC5516GBMLQ66 dissipates approximately 0.6 W in typical activity profiles. The 144-LQFP package has theta_JA around 35 C/W, so junction temperature rise is roughly 21 C above ambient. AEC-Q100 Grade 3 supports -40C to +125C junction temperature, leaving adequate margin in under-hood automotive environments.
Route the External Bus Interface (EBI/EMI) signals with matched trace lengths (within 50 mil) if used, and add series damping resistors near the MCU on heavily loaded address/data lines. The JTAG/BDM header should follow NXP's 14-pin ribbon layout with TCK pulled low through 10 kohm and TMS pulled high through 10 kohm. Keep the oscillator traces short and surround with a ground guard ring.
Common pitfalls: (1) Do not skip the NRST pull-up resistor or reset will be unreliable during power-up. (2) The PLL reference clock must be stable before code attempts to switch to PLL mode - allow 100 us lock time. (3) Flash ECC must be enabled and tested in production; uncorrectable ECC faults reset the MCU. (4) When migrating from MPC5514 or MPC5515, verify peripheral pin muxing remains consistent because some pins change function across family variants.
Compliance-Informationen
AEC-Q100 Grade 3 qualified per NXP product documentation. RoHS compliant. Originally released by Freescale Semiconductor before NXP acquisition in 2015.
