SPC5516GBMLQ66 - 32-bit Dual-Core 66MHz MCU 1MB Flash | NXP
料号： SPC5516GBMLQ66 ✓ 量产中| 数量 | 单价 | 小计 |
|---|---|---|
| 1 | $18.5 | $18.50 |
| 10 | $16.2 | $162.00 |
| 100 | $13.85 | $1,385.00 |
| 500 | $11.95 | $5,975.00 |
| 1,000 | $10.4 | $10,400.00 |
SPC5516GBMLQ66 概述
A microcontroller (MCU) is an integrated circuit that combines a CPU core, program memory (Flash/ROM), data memory (RAM), and peripheral interfaces on a single die. The MPC55xx Qorivva family sits within NXP's broader Power Architecture-based automotive MCU portfolio, positioned between 8/16-bit legacy automotive controllers and the higher-performance MPC56/MPC57 multi-core devices, serving body, chassis, and gateway ECUs.
Key differentiating specifications include dual-core e200z0/e200z1 architecture (one core may be a checker or lockstep partner), 66 MHz system clock, 1 MB single-bank Flash with ECC, and AEC-Q100 automotive qualification. The device offers 111 general-purpose I/O, supporting extensive pin mapping for body-control applications. Its peripheral set includes multiple FlexCAN modules, DSPI, eSCI, and an external bus interface.
Internally the device uses a Harvard-style architecture with separate program/data paths and integrated interrupt controller. Hardware ECC protects the Flash array against soft errors, and the device supports background debug mode (BDM) for non-intrusive development. The 144-LQFP package exposes the full address/data bus plus dedicated peripheral pins.
Typical applications include automotive body controllers, gateway ECUs, lighting modules, HVAC control, instrument cluster peripherals, and industrial CAN-connected controllers. The dual-core configuration is well-suited to functional-safety applications where one core runs diagnostic software in lockstep.
When designing with this part, allocate sufficient decoupling (100 nF plus bulk) near each VDD/VSS pair, route the external bus signals with matched impedance if used at high frequency, and verify the JTAG/BDM header follows NXP's recommended 14-pin ribbon layout. AEC-Q100 Grade 3 supports -40C to +125C operation.
This page synthesizes distributor pricing, AEC-Q100 compliance notes, and pin-compatible Qorivva-family alternatives not consolidated in the manufacturer datasheet alone.
直接替换替代料： SPC5516GBMLQ66 ——相同封装，引脚兼容。需要 PCB 改动的不同封装料号已排除。
本系列中的变体
可与以下型号直接替换的同系列型号： SPC5516GBMLQ66 （相同外形与封装尺寸） ——差异在于 Package, Supply Voltage, Core Size, Operating Temperature, Core Architecture.
快速对比工具——选择替代料号进行并排对比：
SPC5514GBMLQ66
✅ 直接替换 ⚠️ 规格未核验📋 参考替代料（不在目录中）
SPC5515GBMLQ66
✅ 直接替换 ⚠️ 规格未核验📋 参考替代料（不在目录中）
SPC5517GBMLQ66
✅ 直接替换 ⚠️ 规格未核验📋 参考替代料（不在目录中）
MPC5554MZP132
✅ 直接替换 ⚠️ 规格未核验✓ 有现货
$92.3818 / 个
查看数据手册 →MPC5566MZP132
✅ 直接替换 ⚠️ 规格未核验📋 参考替代料（不在目录中）
SPC5516GBMLQ66 最大额定值与电气特性
| Core Processor | e200z0, e200z1 |
| Core Size | 32-Bit Dual-Core |
| Core Architecture | Power Architecture (MPC55xx Qorivva) |
| Maximum Clock Speed | 66 MHz |
| Program Memory Size | 1 MB (1M x 8) FLASH |
| Program Memory Type | Flash with ECC |
| 电源电压 | 4.5 V to 5.25 V |
| Number of I/O | 111 |
| Connectivity | CANbus, EBI/EMI, I2C, SCI, SPI |
| Peripherals | DMA, POR, PWM, WDT |
| 数据总线宽度 | 32-bit |
| 封装 | 144-LQFP (20 x 20 mm, 1.40 mm height) |
| 安装类型 | Surface Mount |
| 工作温度 | -40C to +125C (AEC-Q100 Grade 3) |
| AEC-Q100 Qualified | Yes (automotive grade) |
| RoHS 状态 | Compliant |
SPC5516GBMLQ66 144-lqfp (20 x 20 mm, 1.40 mm height) 引脚配置指南
SPC5516GBMLQ66（144-lqfp (20 x 20 mm, 1.40 mm height) 封装）的引脚配置。 该数字 IC 包含 GPIO、通信接口（UART、SPI、I2C）和电源引脚。请参阅制造商数据手册以了解复用引脚功能和配置选项。对嵌入式系统设计和 PCB 布局至关重要。
暂无详细引脚数据： SPC5516GBMLQ66.
请参阅 数据手册 以查看完整引脚配置。
典型应用
SPC5516GBMLQ66 适用于 7 应用s: Automotive Body Control Module, Automotive Gateway ECU, HVAC Control Module, Instrument Cluster Peripherals, Industrial CAN-Connected Controller, Lighting Control Module, Powertrain Peripheral Controller.
Automotive Body Control Module
The SPC5516GBMLQ66 is well-suited for body control modules (BCMs) that coordinate lighting, door locks, wipers, and accessory controls. Its 1 MB Flash comfortably holds a CAN/LIN gateway stack plus body-controller firmware with OBD-II diagnostics. The 111 GPIO handle the many switched loads and sensor inputs typical of a BCM, while dual FlexCAN modules support powertrain CAN and body CAN simultaneously. AEC-Q100 Grade 3 qualification and -40C to +125C operation cover under-dash thermal environments. The 5 V supply rail matches conventional automotive battery feeds after reverse-battery protection.
推荐
Automotive Gateway ECU
For in-vehicle network gateways bridging CAN, LIN, and FlexRay domains, the SPC5516GBMLQ66's dual-core e200z0/e200z1 architecture enables one core to handle CAN routing while the other runs diagnostics or network management. The External Bus Interface (EBI/EMI) supports a companion Ethernet or FlexRay controller for high-bandwidth links. Hardware ECC on Flash protects routing tables against soft errors during long vehicle lifetimes. The 144-LQFP package exposes the full peripheral set, and 1 MB Flash is sufficient for AUTOSAR-style stacks with multiple CAN interfaces.
推荐
HVAC Control Module
In HVAC control modules, the SPC5516GBMLQ66 drives stepper motors, reads temperature/pressure sensors, and manages CAN/LIN communication with the body controller. The PWM channels control blower speed and mode doors, while the eSCI handles UART diagnostics during EOL programming. AEC-Q100 qualification and 5 V supply match automotive HVAC environments, and 1 MB Flash supports complex control algorithms with adaptive learning. The 111 GPIO accommodate multiple sensor inputs and actuator outputs typical of climate-control ECUs.
推荐
Instrument Cluster Peripherals
As a peripheral processor in an instrument cluster, the SPC5516GBMLQ66 handles gauge drive signals, telltale indicators, and CAN message filtering while the main display processor renders graphics. Its PWM channels generate dimmable backlight drive signals, and the eSCI provides UART debug. Dual-core lockstep supports ASIL-A decomposition of indicator-control functions. The 144-LQFP package allows PCB co-layout with the main MCU on the same board with shared CAN bus to the gateway.
推荐
Industrial CAN-Connected Controller
Outside automotive, the SPC5516GBMLQ66 serves industrial CANopen or DeviceNet controllers where AEC-Q100 over-qualification provides extra margin for harsh factory environments. Its 5 V supply, 66 MHz clock, and dual CAN interfaces support real-time industrial networking. The e200z1 core handles CANopen stack plus application logic, while the e200z0 core runs safety monitoring. The 1 MB Flash accommodates CANopen profile libraries plus custom application code with field-upgrade capability.
推荐
Lighting Control Module
The SPC5516GBMLQ66 drives LED headlamp controllers, daytime running lights, and adaptive lighting systems requiring CAN communication with the BCM. Its PWM peripherals generate dimming signals for LED strings, and 111 GPIO handle multiple lamp outputs. AEC-Q100 Grade 3 operation ensures reliability in the under-hood thermal envelope near lighting modules. The 1 MB Flash supports complex lighting algorithms including matrix-beam control and welcome-sequence animation.
推荐
Powertrain Peripheral Controller
As a peripheral processor alongside the main powertrain MCU, the SPC5516GBMLQ66 manages sensor acquisition (crank, cam, oxygen sensors) and pre-processing before forwarding to the main ECU via CAN. The dual-core architecture supports sensor diagnostics in lockstep mode. AEC-Q100 Grade 3 qualification and 125C junction temperature support under-hood mounting. The 144-LQFP package's 111 GPIO accommodate multiple sensor inputs and actuator control outputs typical of peripheral powertrain modules.
推荐
推荐产品汇总
工程参考数据： SPC5516GBMLQ66 ——对比、设计指导和合规信息。
选型指南
与替代料对比
| 参数 | 本产品 | SPC5514GBMLQ66 | SPC5515GBMLQ66 | SPC5517GBMLQ66 | MPC5554MZP132 | MPC5566MZP132 |
|---|---|---|---|---|---|---|
| Brand | NXP Semiconductors | NXP Semiconductors - same | NXP Semiconductors - same | NXP Semiconductors - same | NXP Semiconductors - same | NXP Semiconductors - same |
| Package | 144-LQFP (20x20) | 144-LQFP (20x20) - same | 144-LQFP (20x20) - same | 144-LQFP (20x20) - same | 144-LQFP (20x20) - same | 144-LQFP (20x20) - same |
| Core Architecture | e200z0/e200z1 dual-core | e200z0/e200z1 dual-core - same | e200z0/e200z1 dual-core - same | e200z0/e200z1 dual-core - same | e200z6 single-core | e200z6 single-core |
| Maximum Clock Speed | 66 MHz | 66 MHz - same | 66 MHz - same | 66 MHz - same | 132 MHz | 132 MHz |
| Flash Memory | 1 MB | 512 KB | 768 KB | 1 MB | 2 MB | 3 MB |
| GPIO Count | 111 | 111 | 111 | 111 | 112 | 112 |
| Supply Voltage | 4.5 V to 5.25 V | 4.5 V to 5.25 V - same | 4.5 V to 5.25 V - same | 4.5 V to 5.25 V - same | 4.5 V to 5.25 V | 4.5 V to 5.25 V |
| AEC-Q100 Grade | Grade 3 (-40C to +125C) | Grade 3 - same | Grade 3 - same | Grade 3 - same | Grade 3 - same | Grade 3 - same |
关键差异点
- Dual-core e200z0/e200z1 architecture with lockstep support （对比 MPC5554MZP132)
- Optimal Flash size for body/gateway applications （对比 SPC5514GBMLQ66)
- Mature automotive-grade Qorivva family with proven AEC-Q100 reliability （对比 SPC5517GBMLQ66)
设计说明
The SPC5516GBMLQ66 requires multiple supply rails: 5 V on VDD_HV/VSS for I/O and 1.5 V core logic internally derived. Place a 100 nF ceramic decoupling capacitor within 2 mm of each VDD/VSS pair, plus a bulk 10 uF tantalum or ceramic capacitor on each supply rail. The internal voltage regulator needs a stable 5 V input; do not allow input droop below 4.5 V or POR will trigger.
Estimated: At maximum clock (66 MHz) with both cores active, the SPC5516GBMLQ66 dissipates approximately 0.6 W in typical activity profiles. The 144-LQFP package has theta_JA around 35 C/W, so junction temperature rise is roughly 21 C above ambient. AEC-Q100 Grade 3 supports -40C to +125C junction temperature, leaving adequate margin in under-hood automotive environments.
Route the External Bus Interface (EBI/EMI) signals with matched trace lengths (within 50 mil) if used, and add series damping resistors near the MCU on heavily loaded address/data lines. The JTAG/BDM header should follow NXP's 14-pin ribbon layout with TCK pulled low through 10 kohm and TMS pulled high through 10 kohm. Keep the oscillator traces short and surround with a ground guard ring.
Common pitfalls: (1) Do not skip the NRST pull-up resistor or reset will be unreliable during power-up. (2) The PLL reference clock must be stable before code attempts to switch to PLL mode - allow 100 us lock time. (3) Flash ECC must be enabled and tested in production; uncorrectable ECC faults reset the MCU. (4) When migrating from MPC5514 or MPC5515, verify peripheral pin muxing remains consistent because some pins change function across family variants.
合规信息
AEC-Q100 Grade 3 qualified per NXP product documentation. RoHS compliant. Originally released by Freescale Semiconductor before NXP acquisition in 2015.
