SPC5605BK0MLL6R vs SPC5605BK0CLL6 Vergleich
Detaillierter Direktvergleich von SPC5605BK0MLL6R von NXP Semiconductors und SPC5605BK0CLL6 von NXP Semiconductors. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
Spezifikationsvergleich
| Parameter | SPC5605BK0MLL6R | SPC5605BK0CLL6 |
|---|---|---|
| Marke | NXP Semiconductors | NXP Semiconductors |
| Kategorie | Microcontrollers | Microcontrollers |
| Lebenszyklusstatus | Aktiv | Aktiv |
| Lagerstatus | In Stock | In Stock |
| Stückpreis (USD) | $10,60 | $9,12 |
| Core Processor | e200z0h (Power Architecture, MPC56xx Qorivva) | — |
| Core Size | 32-bit | — |
| Maximale Taktfrequenz | 64 MHz | 64 MHz |
| Flash Memory | 768 KB (768K x 8) | — |
| Supply Voltage Range | 3 V to 5.5 V | — |
| Betriebstemperatur | -40C to +125C | -40C to +85C |
| Gehäuse | 100-LQFP (14x14 mm) | 100-LQFP (14x14 mm) |
| Number of Pins / Terminals | 100 | — |
| Montageart | Surface Mount | Surface Mount |
| Grade | Automotive Grade | — |
| RAM | [DATA_NEEDED: SRAM size] | — |
| Communication Interfaces | CAN, LIN, FlexRay-oriented family peripherals | — |
| ADC Resolution | 10-bit, 12-bit (per family data) | — |
| Feuchtigkeitsempfindlichkeitsgrad (MSL) | 3 | — |
| Peak Reflow Temperature | 260 C | — |
| Terminal Finish | Tin (JESD-609 code e3) | — |
| Packaging | Tape and Reel (R suffix) | — |
| RoHS-Status | RoHS Compliant | Compliant |
| Core | — | e200z0h (Power Architecture technology) |
| APU | — | VLE (variable-length encoding) |
| Bit Width | — | 32-bit |
| Program Memory Size | — | 768 KB (768K x 8) Flash |
| RAM Size | — | [DATA_NEEDED: RAM size in KB] |
| Versorgungsspannung | — | 3.3 V / 5 V |
| Automotive Grade | — | AEC-Q100 qualified |
| Family | — | MPC56xx Qorivva |
| MSL-Level | — | 3 (per JEDEC J-STD-020) |
| Lead-Free | — | Yes |
| Tray Quantity | — | Per NXP standard tray |