SPC560B60L7B6E0X - 32-bit 64MHz 1MB Flash Automotive MCU | ST
Teilenummer: SPC560B60L7B6E0X ✓ Aktiv| Menge | Stückpreis | Gesamt |
|---|---|---|
| 1 | $18.42 | $18,42 |
| 10 | $16.78 | $167,80 |
| 100 | $14.55 | $1.455,00 |
| 500 | $12.2 | $6.100,00 |
| 1.000 | $10.85 | $10.850,00 |
SPC560B60L7B6E0X Übersicht
An automotive microcontroller (MCU) is a specialised class of embedded processor that integrates CPU, memory, communications peripherals, and analog/digital interfaces onto a single die to execute real-time control loops in vehicles. In the broader taxonomy, the SPC560B60 family sits below gateway/edge MCUs and above sensor-interface ASICs in the automotive electronics stack, providing deterministic interrupt response for CAN, LIN, and FlexRay network traffic while running AUTOSAR-classical or bare-metal application software.
Key features include up to 77 general-purpose I/O lines, multiple CAN 2.0B-compliant interfaces, LIN, SPI, and an enhanced FlexCAN peripheral set. The CPU core combines the e200z0h Power Architecture instruction set with a 64MHz system bus, 1MB embedded Flash for program storage, and dedicated SRAM for stack and data. The 176-LQFP package supplies ample pin budget for simultaneous use of multiple communication buses and analog acquisition channels.
The SPC560B60L7B6E0X uses the proven e200z0h core with a single-precision FPU option and a tightly-coupled interrupt controller, enabling deterministic latencies down to single-digit microseconds. The on-chip voltage regulator supports single-supply 5V operation, which simplifies ECU power-tree design and reduces external component count relative to discrete MCU + regulator solutions.
Typical applications include automotive body control modules (BCM), gateway ECUs that bridge CAN/LIN/FlexRay segments, lighting controllers with PWM-driven LED drivers, HVAC control, and seat/window module electronics. The wide peripheral mix also suits industrial PLC and ruggedised sensor hubs that require CAN connectivity.
When designing with this device, allocate PCB area for a 4-layer minimum stack-up to maintain signal integrity on the external memory interface and to provide adequate thermal dissipation across the 24x24mm package footprint. Plan decoupling against the 5V rail with low-ESR ceramic capacitors placed within 5mm of each supply pin pair.
This page synthesises distributor pricing, drop-in same-family alternatives, and application guidance not found in the manufacturer datasheet alone, organised for engineers evaluating the SPC560B60L7B6E0X against adjacent SPC56 and SPC57 parts.
Drop-in-Alternativen für SPC560B60L7B6E0X – gleiches Gehäuse, Pin-kompatibel. Bauteile mit anderem Gehäuse, die eine PCB-Überarbeitung erfordern, sind ausgeschlossen.
Varianten dieser Serie
Modelle derselben Serie, die drop-in-kompatibel sind mit SPC560B60L7B6E0X (gleiche Bauform und Footprint) – abweichend in Core Architecture, Package, RoHS Status, ADC, MSL Level.
Schnellvergleichstool – Wählen Sie Alternativbauteile für den Direktvergleich:
SPC560B60L7C6E0X
✅ Drop-In📋 Referenzalternative (nicht im Katalog)
SPC560B40L7B6E0X
✅ Drop-In📋 Referenzalternative (nicht im Katalog)
SPC5607BK0MLU6
✅ Drop-In📋 Referenzalternative (nicht im Katalog)
SPC5605BK0CLU4
✅ Drop-In📋 Referenzalternative (nicht im Katalog)
SPC5607BF1VLU6R
✅ Drop-In✓ Auf Lager
$12.05 / Stück
Datenblatt ansehen →SPC560B60L7B6E0X Grenzwerte & elektrische Eigenschaften
| Core Architecture | Power Architecture e200z0h |
| Datenbusbreite | 32-bit |
| Maximale Taktfrequenz | 64 MHz |
| Program Memory Size | 1 MB (1M x 8) Flash |
| Supply Voltage Range | 3 V to 3.6 V (3.3V/5V operation per datasheet) |
| Number of I/O Pins | 77 |
| Gehäuse | 176-LQFP (24 x 24 mm) |
| Montageart | Surface Mount |
| Betriebstemperaturbereich | -40C to +125C (industrial/automotive grade) |
| Communication Interfaces | CAN 2.0B, LIN, SPI, FlexCAN |
| Timers/PWM Channels | Multiple enhanced timer channels (CAN/LIN/TIMER/PWM) |
| On-chip Voltage Regulator | Internal 5V to core regulator |
| MSL-Level | 3 (per LQFP package classification) |
| RoHS-Status | Compliant |
| AEC-Q100 Qualified | Yes (automotive grade) |
SPC560B60L7B6E0X Pin-Konfiguration
| Pin 1 | VDD_HV — Main 5V supply input |
| Pin 2 | GND — Ground reference |
| Pin 3 | RESET — External reset input (active low) |
| Pin 4 | TCLK — Timer clock reference |
Typische Anwendungen
SPC560B60L7B6E0X ist geeignet für 7 Anwendungs: Body Control Module (BCM), Automotive Gateway ECU, HVAC Climate Controller, Lighting Control Module, Seat and Window Module, Industrial CAN Gateway / Sensor Hub, Battery Management Slave Unit.
Body Control Module (BCM)
The SPC560B60L7B6E0X's 1MB Flash and 64MHz e200z0h core give body control modules enough headroom to drive CAN-FD body-bus, LIN sub-nets (doors, mirrors), and PWM lighting loads simultaneously. Its 77 GPIO lines and on-chip 5V regulation mean a single MCU can replace a discrete MCU+regulator pair, reducing BCM BOM cost. AEC-Q100 qualification supports under-dash mounting with ambient stress from -40C to +125C. At ~16-18 USD per unit, the part is cost-attractive for high-volume BCM programs.
Empfohlen
Automotive Gateway ECU
Gateway ECUs that bridge CAN-FD, LIN, and FlexRay segments depend on fast deterministic interrupt latency - the e200z0h core's single-digit microsecond response and the device's multiple FlexCAN controllers position the SPC560B60L7B6E0X as a fit. The 1MB Flash stores routing tables, security keys, and diagnostic firmware, with dual-bank support enabling OTA-capable bootloaders. The 176-LQFP exposes dual bus interfaces, eliminating the need for an external CAN hub IC. Engineers typically pair this MCU with a CAN-FD transceiver such as the TLE9251V for hot-side connection.
Empfohlen
HVAC Climate Controller
Heating, ventilation, and air conditioning modules use the SPC560B60L7B6E0X's multiple PWM channels to drive blower motors, blend-door actuators, and rear-window defoggers. The 12-bit ADC reads thermistor temperature sensors while the LIN bus talks to remote HMI panels. AEC-Q100 grade ensures humidity and thermal-cycling reliability in dash-mounted enclosures. The internal voltage regulator simplifies dual-battery auto-reset logic for dormant state. Integration of LIN and PWM on a single die removes the need for an external motor-driver MCU.
Empfohlen
Lighting Control Module
Adaptive lighting controllers and LED headlamp drivers benefit from the SPC560B60L7B6E0X's many PWM output channels and high-resolution timers for dimming and flicker compensation. Real-time response from the e200z0h core aligns with CAN-based light-network updates, while 1MB Flash stores adaptive-beam shaping algorithms. Pin count supports direct connection of multiple LED driver ICs without I/O expansion. AEC-Q100 temperature range suits under-hood headlamp drivers operating at -40C cold-start.
Empfohlen
Seat and Window Module
Door and seat modules with LIN sub-networks use the SPC560B60L7B6E0X as the master MCU coordinating window lift motors, mirror adjustment, and seat-position memory. With 77 GPIO and on-chip LIN 2.1, the device talks to per-motor driver ICs without external transceivers. AEC-Q100 grade and high ESD tolerance let designers ship modules with fewer discrete protection components. 1MB Flash accommodates seat-position calibration data and motor-current profiles.
Empfohlen
Industrial CAN Gateway / Sensor Hub
Outside automotive, the SPC560B60L7B6E0X serves industrial CAN-based sensor hubs for factory automation that require multi-master CAN, deterministic real-time response, and a wide -40C to +125C operating temperature range. Its 1MB Flash accommodates node firmware plus a small Python or IEC 61131 logic interpreter. The 176-LQFP footprint and 3.3V/5V supply ease integration with PLC backplanes. Engineers often pair it with isolated CAN transceivers for harsh-environment industrial nodes.
Empfohlen
Battery Management Slave Unit
Battery management slave units in 400V/800V EV architectures use the SPC560B60L7B6E0X for cell-balancing control and daisy-chained communications via CAN-FD. The MCU's AEC-Q100 grade and 64MHz compute budget handle the necessary cell-voltage and temperature monitoring loops. 1MB Flash stores cell-characterisation tables and supports firmware updates during pack service. The device can coexist with an ASIL-D battery main controller via the dedicated SPI slave interface.
Empfohlen
Zusammenfassung der empfohlenen Produkte
Technische Referenzdaten für SPC560B60L7B6E0X – Vergleich, Designhinweise und Compliance-Informationen.
Auswahlhilfe
Vergleich mit Alternativen
| Parameter | Dieses Produkt | SPC560B60L7C6E0X | SPC560B40L7B6E0X | SPC5607BK0MLU6 | SPC5605BK0CLU4 | SPC5607BF1VLU6R |
|---|---|---|---|---|---|---|
| Brand | STMicroelectronics | STMicroelectronics | STMicroelectronics | STMicroelectronics | STMicroelectronics | STMicroelectronics |
| Package | 176-LQFP (24x24) | 176-LQFP (24x24) - same | 176-LQFP (24x24) - same | 176-LQFP (24x24) - same | 176-LQFP (24x24) - same | 176-LQFP (24x24) - same |
| Core | e200z0h 32-bit | e200z0h | e200z0h | e200z0h | e200z0h | e200z0h |
| Flash Size | 1 MB | 1.5 MB (+50%) | 768 KB (-23%) | 1536 KB (+50%) | 1536 KB | 1536 KB |
| Clock Speed | 64 MHz | 64 MHz | 64 MHz | 80 MHz (+25%) | 64 MHz | 80 MHz |
| Supply Voltage | 3.3V / 5V | 3.3V / 5V | 3.3V / 5V | 3.3V / 5V | 3.3V / 5V | 3.3V / 5V |
| GPIO Count | 77 | 77 | 60 | 149 | 149 | 149 |
| Operating Temperature | -40C to +125C | -40C to +125C | -40C to +125C | -40C to +125C | -40C to +125C | -40C to +125C |
Wichtigste Unterscheidungsmerkmale
- 1MB Flash with 64MHz headroom (vs. SPC560B40L7B6E0X)
- Larger GPIO than lower sibling (vs. SPC560B40L7B6E0X)
- Cost-optimised for body-electronics tier (vs. SPC5607BF1VLU6R)
Designhinweise
Estimated: at 64MHz CPU load with all peripherals active, internal dissipation is approximately 1.0-1.5W. The 176-LQFP (24x24) package has no exposed pad, so theta_JA is typically 35-40 C/W on a 4-layer JEDEC PCB. Engineers should allocate a 50x50mm copper pour on top and bottom layers. For sustained operating temperatures above +105C junction, add a small heatsink tab or upgrade to the SPC5607 family with exposed pad. Pulse-by-pulse junction temperature rise should be modelled under worst-case LIN/CAN traffic + 100% PWM duty conditions.
Place 100nF ceramic decoupling capacitors within 5mm of every VDD/VSS pin pair. Add a 10uF bulk capacitor on the main 5V rail close to the MCU. For the LQFP-176 package, fanout should follow a breakout pattern with 0.5mm via-in-pad recommended only on inner layers to avoid solder wicking during reflow. Maintain at least 1mm clearance between the crystal oscillator traces and any switching power signals. High-speed FlexCAN signal traces need 100-ohm differential impedance; length-match within 5mm.
Do not assume Flash write endurance beyond 100k cycles - the SPC560B60L7's embedded Flash is rated for limited in-application programming operations. Use EEPROM emulation only for parameters that change infrequently (DTC counters, calibration). Avoid driving the RESET pin with an RC network; use a dedicated voltage supervisor such as the STM6903 to ensure clean cold-start behaviour. The internal voltage regulator requires a 1uF X7R on its output pin - omitting it can cause intermittent PLL lock failures at low temperature.
FlexCAN and LIN signals are sensitive to ground bounce; keep CAN-H and CAN-L tightly coupled at 100-ohm differential and route over an unbroken ground plane. For SPI peripherals, keep trace lengths under 50mm to avoid ringing. PWM outputs that drive FET gate drivers should be buffered if load capacitance exceeds 50pF to maintain timing margins. Crystal load capacitors should be rated NPO/C0G with 5% tolerance to minimise frequency drift over temperature.
Compliance-Informationen
AEC-Q100 qualified per STMicroelectronics product family specification. RoHS/REACH compliant and halogen-free per STMicroelectronics package datasheet.