SPC560B64L7B6E0X - 32-bit Automotive MCU, 1.5MB Flash, 64MHz | STMicroelectronics
Teilenummer: SPC560B64L7B6E0X ✓ Aktiv| Menge | Stückpreis | Gesamt |
|---|---|---|
| 1 | $14.5 | $14,50 |
| 10 | $13.2 | $132,00 |
| 100 | $11.95 | $1.195,00 |
| 500 | $10.75 | $5.375,00 |
| 1.000 | $9.6 | $9.600,00 |
SPC560B64L7B6E0X Übersicht
An automotive microcontroller is a specialized system-on-chip that integrates a CPU, memory, and mixed-signal peripherals onto a single die to control vehicle body, chassis, and powertrain functions in real time. The SPC560B family targets body and chassis applications such as central body controllers, smart junction boxes, front modules, door modules, seat controllers, body peripherals, and gateway ECUs. As a 32-bit automotive MCU, it sits within the broader microcontroller hierarchy (8-bit -> 16-bit -> 32-bit -> 64-bit) and within the automotive-specific Power Architecture family (e200z0 -> e200z0h -> e200z4 -> e200z6), occupying a low-power, cost-optimized tier for deterministic real-time body control.
Key features include the VLE (variable-length encoding) APU for improved code density, hardware CRC, a 64-channel eDMA controller, a 12-bit ADC, eMIOS timer/pulse generation, and an enhanced modular I/O subsystem. The 176-LQFP exposed-pad package provides a thermal-resistance path for automotive under-hood and cabin environments. The supply range of 3 V to 3.6 V (with 5 V-tolerant I/O on selected pins) and AEC-Q100 qualification make this part suitable for OEM and Tier-1 automotive designs.
The e200z0h core implements the Power Architecture VLE-only subset, trading richer SIMD DSP capability for smaller code footprint and predictable interrupt latency. The SPC560B64x family is a die-shrink revision of the SPC560B40/50x, doubling Flash density while keeping the same LQFP-176 footprint, which simplifies migration for existing designs. The on-chip flash controller supports concurrent read-while-write to simplify boot-loader and OTA workflows.
Typical applications include central body controllers, smart junction boxes, front modules, door and seat controllers, body peripherals such as lighting and wiper control, and CAN/LIN gateway nodes. AEC-Q100 Grade 2 qualification supports deployment under the hood and in harsh cabin environments where thermal stress is significant.
When designing with this MCU, place bulk decoupling within 50 mm of each VDD/VSS pair and route high-speed CAN/LIN traces as 100-ohm differential pairs with impedance matching. Preserve JTAG access on dedicated header pins so boundary-scan and in-circuit flash programming remain available after PCB assembly.
This page synthesizes distributor pricing, AEC-Q100 cross-reference alternatives, and practical automotive design notes not found in the manufacturer datasheet, providing engineers with a single condensed view for body-control MCU selection.
Drop-in-Alternativen für SPC560B64L7B6E0X – gleiches Gehäuse, Pin-kompatibel. Bauteile mit anderem Gehäuse, die eine PCB-Überarbeitung erfordern, sind ausgeschlossen.
Varianten dieser Serie
Modelle derselben Serie, die drop-in-kompatibel sind mit SPC560B64L7B6E0X (gleiche Bauform und Footprint) – abweichend in Core Architecture, Package, RoHS Status.
Schnellvergleichstool – Wählen Sie Alternativbauteile für den Direktvergleich:
SPC560B64L7B6E0Y
✅ Drop-In📋 Referenzalternative (nicht im Katalog)
SPC560B64L7C6E0Y
✅ Drop-In📋 Referenzalternative (nicht im Katalog)
SPC560B64L7C6E0X
✅ Drop-In ⚠️ Spezifikationen ungeprüft📋 Referenzalternative (nicht im Katalog)
SPC560B64L5C6E0X
✅ Drop-In📋 Referenzalternative (nicht im Katalog)
SPC560B60L7B6E0X
✅ Drop-In ⚠️ Spezifikationen ungeprüft✓ Auf Lager
$10.85 / Stück
Datenblatt ansehen →SPC560B64L7B6E0X Grenzwerte & elektrische Eigenschaften
| Core Architecture | Power Architecture e200z0h (32-bit) |
| APU | VLE (Variable-Length Encoding) only |
| Maximum CPU Clock | 64 MHz |
| Program Flash | 1.5 MB (1.5M x 8) |
| SRAM | 96 KB |
| Versorgungsspannung | 3.0 V to 3.6 V |
| I/O Ports | 77 |
| GPIO Count | 149 (alternate count, multi-function pins) |
| Gehäuse | 176-LQFP (24x24 mm) with exposed pad |
| Montageart | Surface Mount |
| Betriebstemperatur | -40C to +125C (AEC-Q100 Grade 1/2) |
| ADC | 12-bit (10/12-bit modes) |
| eDMA Channels | 64 channels |
| RoHS-Status | Compliant (lead-free LFQP) |
| AEC-Q100 Qualification | Qualified |
| Family | SPC560B64x (B54/6x series) |
SPC560B64L7B6E0X 176-lqfp (24x24 mm) with exposed pad Pinbelegungsleitfaden
Pinbelegung für SPC560B64L7B6E0X (176-lqfp (24x24 mm) with exposed pad-Gehäuse). Dieser digitale IC umfasst GPIO, Kommunikationsschnittstellen (UART, SPI, I2C) und Versorgungspins. Alternative Pin-Funktionen und Konfigurationsoptionen entnehmen Sie dem Herstellerdatenblatt. Unverzichtbar für Embedded-System-Design und PCB-Layout.
Keine detaillierten Pinbelegungsdaten verfügbar für SPC560B64L7B6E0X.
Siehe die Datenblatt für die vollständige Pin-Konfiguration.
Typische Anwendungen
SPC560B64L7B6E0X ist geeignet für 6 Anwendungs: Central Body Controller, Smart Junction Box, Door Module Controller, Front Module / Body Peripheral, CAN/LIN Gateway Node, Seat Control Module.
Central Body Controller
The SPC560B64L7B6E0X's 1.5 MB Flash and 96 KB SRAM provide ample headroom for AUTOSAR-class central body controllers managing BCM logic for lighting, wipers, locks, and horn drivers across CAN/LIN networks. The 64 MHz e200z0h core delivers deterministic interrupt latency for body control loops at sub-millisecond periods. Placed as the BCM master, the part aggregates gateway traffic from door modules, front modules, and seat controllers via multiple CAN channels, while the 12-bit ADC reads sensor inputs such as ambient light and humidity. AEC-Q100 Grade 2 qualification and a -40C to +125C operating range enable underhood or cabin mounting without thermal derating. Drop-in same-package variants let engineering teams select smaller Flash density siblings without PCB rework when code shrinks.
Empfohlen
Smart Junction Box
The SPC560B64L7B6E0X is well-suited to smart junction box designs where it owns eFuse control, current monitoring, and load shedding logic for exterior lighting, fog lamps, and turn signals. Its 77 GPIO and 12-bit ADC with multi-channel scan support many high-side driver feedback paths, while the 64-channel eDMA offloads sequential current-sensing conversions from the CPU. The 176-LQFP exposed pad anchors thermal dissipation for continuous load-driver operation at junction temperatures up to 125C. LINFlex interfaces connect to distributed smart actuators and rear-lighting modules through single-wire LIN networks, and CAN interfaces to the body gateway for diagnostics. Pair with external CAN transceivers and high-side switches to realize a complete junction box ECU.
Empfohlen
Door Module Controller
Door module controllers running the SPC560B64L7B6E0X power window regulators, mirror adjust, lock actuators, and puddle/ambient lighting via embedded CAN/LIN node communication. The part's 1.5 MB Flash supports complex door-zone logic including anti-pinch algorithms and welcome animations; 96 KB SRAM handles real-time window current profiles plus a small graphical framebuffer for mirror/LED indication. LINFlex slaves to the central body controller for body-wide status and commands, while local sensors connect via SPI or ADC channels. AEC-Q100 qualification and the 176-LQFP exposed pad satisfy the long-term thermal and vibration stress expected in door-mounted automotive ECUs. Drop-in alternative with identical footprint simplifies tier-1 sourcing.
Empfohlen
Front Module / Body Peripheral
The SPC560B64L7B6E0X serves front module ECUs that aggregate headlamp control, washer pump, front fog, ambient lighting, and ambient-camera interfaces. Its 12-bit ADC and 64-channel eDMA handle multi-zone lighting current monitoring, while eMIOS timer channels generate PWM signals for LED drivers at up to several kHz. The 1.5 MB Flash is sufficient for adaptive front-lighting algorithms and rain/light sensor fusion. Its package exposes a wide GPIO pin budget for front-end actuator drives, and LINFlex slaves keep the front ECU cost-competitive. AEC-Q100 Grade 2 thermal margin supports front-bumper mounting where cabin heat soak is significant.
Empfohlen
CAN/LIN Gateway Node
Engineered as a CAN-to-LIN gateway, the SPC560B64L7B6E0X bridges legacy LIN sub-buses (seat, HVAC, mirror) with body CAN backbones. The e200z0h core at 64 MHz plus 96 KB SRAM routes messages with deterministic latency, while the 64-channel eDMA handles concurrent CAN/LIN transfers without CPU saturation. The 1.5 MB Flash accommodates routing tables, AUTOSAR PduR configuration, and dual-stack communication software. The 176-LQFP exposed pad anchors thermal performance in cabin-mounted gateways near HVAC ducts. AEC-Q100 qualification and 3.0 to 3.6 V supply (with 5 V-tolerant I/O for legacy LIN peripherals) ease integration into existing wiring architectures.
Empfohlen
Seat Control Module
Seat control modules use the SPC560B64L7B6E0X to drive multi-axis seat adjust motors, memory-position storage, and seat-occupancy sensors. The MCU's 12-bit ADC and PWM timer channels concurrently supervise motor current, position encoders, and heating elements. 1.5 MB Flash supports memory seat presets plus massage/ventilation firmware with safety supervision. The 176-LQFP exposed pad anchors thermal dissipation for under-seat mounting where airflow is restricted, and the -40C to +125C operating range covers summer cabin heat soak. LINFlex integrates with the body network for preset recall from a master BCM, and on-chip eDMA offloads repetitive sensor scans to maintain responsive seat adjustments.
Empfohlen
Zusammenfassung der empfohlenen Produkte
Technische Referenzdaten für SPC560B64L7B6E0X – Vergleich, Designhinweise und Compliance-Informationen.
Auswahlhilfe
Vergleich mit Alternativen
| Parameter | Dieses Produkt | SPC560B64L7B6E0Y | SPC560B64L7C6E0Y | SPC560B64L7C6E0X | SPC560B64L5C6E0X | SPC560B60L7B6E0X |
|---|---|---|---|---|---|---|
| Brand | STMicroelectronics | STMicroelectronics | STMicroelectronics | STMicroelectronics | STMicroelectronics | STMicroelectronics |
| Package | 176-LQFP (24x24 mm) | 176-LQFP - same | 176-LQFP - same | 176-LQFP - same | 176-LQFP - same | 176-LQFP - same |
| Program Flash | 1.5 MB | 1.5 MB | 1.5 MB | 1.5 MB | 1 MB (-33%) | 1 MB (-33%) |
| SRAM | 96 KB | 96 KB | 96 KB | 96 KB | 96 KB | 96 KB |
| Maximum CPU Clock | 64 MHz | 64 MHz | 64 MHz | 64 MHz | 64 MHz | 64 MHz |
| Core | e200z0h (Power Architecture) | e200z0h | e200z0h | e200z0h | e200z0h | e200z0h |
| GPIO Count | 77 | 77 | 77 | 77 | 77 | 77 |
| AEC-Q100 Qualification | Yes | Yes | Yes | Yes | Yes | Yes |
| Supply Voltage Range | 3.0 V to 3.6 V | 3.0 V to 3.6 V | 3.0 V to 3.6 V | 3.0 V to 3.6 V | 3.0 V to 3.6 V | 3.0 V to 3.6 V |
Wichtigste Unterscheidungsmerkmale
- Largest Flash density within SPC560B family at 1.5 MB (vs. SPC560B60L7B6E0X)
- Highest-density B6x Flash option in 176-LQFP package (vs. SPC560B64L5C6E0X)
- Revision-letter Y variant is identical silicon in same footprint (vs. SPC560B64L7B6E0Y)
Designhinweise
Route VDD/VSS pins as wide, low-inductance copper pours with at least one 100 nF and one 4.7 uF ceramic decoupling capacitor within 5 mm of each supply pin pair. The 176-LQFP exposes multiple VDD/VSS pairs; place the closest ceramic cap on the same layer rather than under a via. Estimated: at 64 MHz full-load activity, the SPC560B64L7B6E0X core current approaches 100 mA, so total VDD decoupling budget is at least 100 uF aggregate, distributed across the package perimeter.
Solder the exposed pad of the 176-LQFP to a 1 square inch copper pour with at least 8 thermal vias to the inner ground plane. Estimated: with theta_JA around 30 C/W for a properly stitched 4-layer PCB, continuous 64 MHz operation at room ambient keeps junction rise under 25 C, leaving AEC-Q100 Grade 2 headroom to 125 C. Without proper stitching, junction temperatures can exceed the 125 C ceiling in cabin-mounted body modules.
Route the CAN_H and CAN_L lines as a 100 ohm differential pair with matched length within 2 mm, and place the CAN transceiver within 50 mm of the MCU CAN pins. JTAG signals (TCK, TMS, TDO, TDI, and optional TRST_N) should be guarded by a GND trace on each side; failure to do so causes intermittent boundary-scan failures during in-circuit flash programming. Do not share JTAG with high-current motor driver traces on the same layer.
Do not assume all GPIO are 5 V-tolerant - on the SPC560B64L7B6E0X only certain pin groups accept 5 V input, while others clamp at 3.3 V. Apply 3.3 V-tolerant I/O to LIN bus wiring with external level shifters if legacy LIN sensors supply 5 V. Pin-mux configuration must be finalized before enabling peripherals in software; half-configured peripherals can source contention that perturbs the ADC reference and corrupts sensor readings.
Compliance-Informationen
LFQP package designation confirms RoHS / lead-free status per ST product page; AEC-Q100 Grade 2 qualification supports automotive body electronics applications from -40C to +125C. Halogen-free status not explicitly confirmed in provided data - set to unknown per data authenticity rule.
