SPC5744PK1AMMM8 - Dual-Core 180MHz 2.5MB MCU | NXP
Teilenummer: SPC5744PK1AMMM8 ✓ Aktiv| Menge | Stückpreis | Gesamt |
|---|---|---|
| 1 | $7.73 | $7,73 |
| 10 | $7.15 | $71,50 |
| 100 | $6.62 | $662,00 |
| 500 | $6.15 | $3.075,00 |
| 1.000 | $5.72 | $5.720,00 |
SPC5744PK1AMMM8 Übersicht
A microcontroller (MCU) is a single integrated circuit that combines a processor core, program memory, data memory, and peripherals into one chip, forming the compute heart of an embedded system. Within the powertrain hierarchy, the MPC57xx/SPC57xx family sits above basic 8-bit and 16-bit MCUs, serving as a power-management-level, safety-oriented device for electronic control units (ECUs) in vehicles and industrial machinery.
Key features include the dual-core e200z4 32-bit Power Architecture capable of lockstep or parallel operation for functional-safety designs, 2.5 MB (2.5M x 8) of program Flash, and a rich connectivity set: CAN bus, Ethernet, FlexRay, LIN bus, SPI, and UART/USART. On-chip peripherals include DMA, low-voltage detect (LVD), power-on reset (POR), and a watchdog timer (WDT), all of which are essential for robust automotive ECU operation.
Architecturally, the e200z4 core implements the Power Architecture instruction set with a 7-stage pipeline, and the dual-core configuration allows one core to supervise the other for safety integrity in ASIL-rated systems. The 3.15 V to 5.5 V supply range simplifies integration into 5 V automotive rails.
Typical applications include engine management ECUs, transmission and gearbox control, electric power steering, and industrial motor control where CAN, FlexRay, and Ethernet networking converge on a single processing node.
When designing with this device, confirm the FlexRay and Ethernet transceiver compatibility and plan power sequencing for the 5 V rail early in the schematic phase.
This page synthesizes distributor pricing, drop-in alternatives, and practical design notes not found in the manufacturer datasheet.
Drop-in-Alternativen für SPC5744PK1AMMM8 – gleiches Gehäuse, Pin-kompatibel. Bauteile mit anderem Gehäuse, die eine PCB-Überarbeitung erfordern, sind ausgeschlossen.
Varianten dieser Serie
Modelle derselben Serie, die drop-in-kompatibel sind mit SPC5744PK1AMMM8 (gleiche Bauform und Footprint) – abweichend in Connectivity, Core Size.
Schnellvergleichstool – Wählen Sie Alternativbauteile für den Direktvergleich:
SPC5746BSK1MKU2
✅ Drop-In ⚠️ Spezifikationen ungeprüft✓ Auf Lager
$17.25 / Stück
Datenblatt ansehen →SPC5744PK1AMMM8
✅ Drop-In✓ Auf Lager
$5.72 / Stück
Datenblatt ansehen →SPC5744PK1AMMM8 Grenzwerte & elektrische Eigenschaften
| Core Processor | e200z4 (Power Architecture) |
| Core Size | 32-Bit Dual-Core |
| Maximum Clock Speed | 180 MHz |
| Program Memory Size | 2.5 MB (2.5M x 8) Flash |
| SRAM Size | 384 KB |
| Supply Voltage Range | 3.15 V to 5.5 V |
| Betriebstemperatur | -40C to +125C |
| Connectivity | CANbus, Ethernet, FlexRay, LINbus, SPI, UART/USART |
| Peripherals | DMA, LVD, POR, WDT |
| Gehäuse | 257-LFBGA (MAPBGA 257), 14 x 14 mm |
| Montageart | Surface Mount |
| Series | MPC57xx / SPC57xx |
| Datenbusbreite | 32 bit |
| Part Status | Active |
| RoHS-Status | RoHS (per distributor listings) |
SPC5744PK1AMMM8 257-lfbga (mapbga 257), 14 x 14 mm Pinbelegungsleitfaden
Pinbelegung für SPC5744PK1AMMM8 (257-lfbga (mapbga 257), 14 x 14 mm-Gehäuse). Dieser digitale IC umfasst GPIO, Kommunikationsschnittstellen (UART, SPI, I2C) und Versorgungspins. Alternative Pin-Funktionen und Konfigurationsoptionen entnehmen Sie dem Herstellerdatenblatt. Unverzichtbar für Embedded-System-Design und PCB-Layout.
Keine detaillierten Pinbelegungsdaten verfügbar für SPC5744PK1AMMM8.
Siehe die Datenblatt für die vollständige Pin-Konfiguration.
Typische Anwendungen
SPC5744PK1AMMM8 ist geeignet für 6 Anwendungs: Engine Management ECU, Transmission Control Unit, Gateway and Body Control Module, Industrial Motor Control, Chassis and Safety Domain Control, Test and Measurement / ECU Development Platforms.
Engine Management ECU
The SPC5744PK1AMMM8 fits engine management ECUs because its dual e200z4 cores at 180 MHz deliver the deterministic compute headroom required for crank-angle-synchronous combustion control loops, while 2.5 MB of Flash accommodates calibration data sets and OBD diagnostics stacks. The -40C to +125C automotive temperature grade survives under-hood thermal profiles, and the 3.15 V to 5.5 V supply range connects directly to automotive 5 V rails. In a typical topology the MCU drives injector and ignition pre-drivers over SPI, reads sensor inputs through its ADCs, and communicates with the vehicle over CAN and FlexRay. Its watchdog timer, LVD, and POR peripherals provide the fault monitoring demanded in powertrain safety concepts, and DMA offloads peripheral transfers so both cores stay available for control computation.
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Transmission Control Unit
In transmission control, the SPC5744PK1AMMM8's 2.5 MB Flash holds shift-strategy maps and adaptive-learning code, while 384 KB of SRAM buffers pressure-control and speed-sensor data in real time. The dual-core lockstep capability supports safety supervision of torque-path interrupts, and the 180 MHz clock executes solenoid current-control loops at the kilohertz rates needed for smooth gear engagement. CAN and LIN interfaces link the TCU to the engine ECU and shift lever, and Ethernet supports future diagnostics architectures. Because solenoid drivers and position sensors connect directly through the MCU's peripheral set, board count stays low. Designers should budget Flash for end-of-line calibration data and confirm the 257-ball MAPBGA footprint thermal design for continuous 125C transmission-fluid-adjacent environments.
Empfohlen
Gateway and Body Control Module
The integrated Ethernet, CAN, FlexRay, and LIN controllers make the SPC5744PK1AMMM8 a natural vehicle network gateway: it can bridge legacy CAN/LIN domains to newer Ethernet backbones without external protocol chips, and the dual-core architecture lets one core run routing while the other executes firewall and diagnostic services. The 2.5 MB Flash stores multiple protocol stacks and OTA-update images; 384 KB SRAM buffers message queues during bus load peaks. At 180 MHz, the device sustains gateway filtering latency well within automotive timing budgets. The -40C to +125C range covers cockpit and engine-bay mounting, and the watchdog supports ISO-style supervision of the routing application. Designers should validate Ethernet PHY compatibility and magnetics choice early in the layout.
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Industrial Motor Control
For industrial drives, the SPC5744PK1AMMM8's dual e200z4 cores at 180 MHz execute field-oriented control of PMSM and induction motors while a supervisory core handles safety and communication. The 2.5 MB Flash stores motion profiles and parameter tables, and 384 KB SRAM supports fast current-loop variables. CAN and Ethernet interfaces integrate the drive into factory automation networks, while SPI connects gate drivers and encoder interfaces. The 3.15 V to 5.5 V input simplifies the control-side power supply from standard industrial rails, and the LVD/POR/WDT peripherals protect against brown-out-induced misfiring of inverter stages. Its automotive temperature rating also covers cabinet environments with elevated ambient temperatures, reducing derating concerns compared with commercial-grade MCUs.
Empfohlen
Chassis and Safety Domain Control
Electric power steering, brake, and stability-control ECUs benefit from the SPC5744PK1AMMM8's dual-core architecture, where one e200z4 core runs the control algorithm and the second monitors it - a pattern used in ASIL-oriented designs. The 180 MHz performance closes steering assist loops with the sub-millisecond latency these systems require, and 2.5 MB Flash hosts fault-management and calibration code. FlexRay provides the deterministic chassis communication some platforms mandate, while CAN serves mainstream topologies. The watchdog, LVD, and POR peripherals feed the safety concept's supervision chain. The 257-ball MAPBGA's 14 x 14 mm footprint fits dense ECU boards, though the fine ball pitch requires careful PCB stackup and inspection planning during manufacturing.
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Test and Measurement / ECU Development Platforms
Development and HIL (hardware-in-the-loop) platforms for powertrain calibration use the SPC5744PK1AMMM8 because it matches production ECU silicon, ensuring that calibration results transfer directly to the vehicle. The 2.5 MB Flash and 384 KB SRAM support full application images plus instrumentation hooks, while Ethernet and CAN links stream measurement data to host PCs at 180 MHz-driven throughput. NXP's SPC5 software ecosystem and supported debug probes give access to both cores during development. The -40C to +125C rating allows environmental chamber testing without device swaps. For bench setups, designers should provide the 3.15 V to 5.5 V supply via a benchtop regulator with current limiting and add JTAG/SWD headers on the 257-ball MAPBGA fanout.
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Zusammenfassung der empfohlenen Produkte
Technische Referenzdaten für SPC5744PK1AMMM8 – Vergleich, Designhinweise und Compliance-Informationen.
Auswahlhilfe
Vergleich mit Alternativen
| Parameter | Dieses Produkt | SPC5746BSK1MKU2 |
|---|---|---|
| Package | 257-LFBGA (MAPBGA 257), 14 x 14 mm | MAPBGA 257 class |
| Brand | NXP Semiconductors | NXP Semiconductors |
| Core Architecture | Dual-core e200z4 Power Architecture | Dual-core Power Architecture (SPC57xx) |
| Clock Speed | 180 MHz | 180 MHz |
| Connectivity | CAN, Ethernet, FlexRay, LIN, SPI, UART/USART | CAN, Ethernet, FlexRay, LIN, SPI (family level) |
Wichtigste Unterscheidungsmerkmale
- Dual-core e200z4 safety architecture (vs. MPC565CVR40 (legacy single-core Powertrain MCU))
- Native FlexRay plus Ethernet on-chip (vs. MC9S12XEQ384CAG (16-bit S12X family))
- 2.5 MB Flash in a compact 14 x 14 mm BGA (vs. SPC5644AF0MLU2 (SPC56x generation))
Designhinweise
Design the 5 V power tree for the SPC5744PK1AMMM8 with an automotive system basis chip (SBC) such as the MC33907 family, which provides the sequencing, monitoring, and reset supervision this MPC57xx-class MCU expects. The device accepts 3.15 V to 5.5 V, so a protected automotive 5 V rail with load-dump clamping is sufficient; Estimated: budget several hundred milliamps peak for core plus I/O at 180 MHz, but confirm exact current figures from the NXP datasheet electrical tables rather than this estimate.
The 257-ball MAPBGA in a 14 x 14 mm body uses a fine ball pitch requiring controlled PCB stackup. Use via-in-pad or dog-bone fanout on the outer ball rows, keep via fill and plating consistent, and verify the fabricator's BGA capability before release. Follow the NXP MPC57xx hardware design guide for power-plane segmentation: separate solid planes for core and I/O supplies, with dense decoupling capacitor placement directly under the BGA on the opposite layer.
Do not assume SPC57xx family members share identical 257-ball maps: the SPC5744P and SPC5746B differ in memory configuration and some ball functions. Before any second-source or family swap, diff the ball-map tables of both NXP datasheets and revalidate boot configuration pins. Also confirm whether your supply source is NXP direct or Rochester Electronics continuation stock to align lot and date-code expectations in automotive PPAP documentation.
FlexRay and Ethernet interfaces on the SPC5744PK1AMMM8 demand controlled-impedance differential routing to their transceivers (e.g., MC33664 for FlexRay, a 100BASE-T1-class PHY for Ethernet). Keep differential pairs length-matched, reference an unbroken ground plane, and place the transceivers within a few centimeters of the MCU balls. Route CAN/LIN lines with common-mode chokes and ESD protection at the connector to survive automotive transient testing.
Compliance-Informationen
Distributor listings (LCSC, Lisleapex) mark the part as ROHS compliant and lead-free. REACH, AEC-Q100 qualification, halogen-free, and conflict-minerals status should be confirmed from the official NXP compliance documentation.
