SPC5744PK1AMMM8 - Dual-Core 180MHz 2.5MB MCU | NXP
부품 번호: SPC5744PK1AMMM8 ✓ 활성| 수량 | 단가 | 합계 |
|---|---|---|
| 1 | $7.73 | $7.73 |
| 10 | $7.15 | $71.50 |
| 100 | $6.62 | $662.00 |
| 500 | $6.15 | $3,075.00 |
| 1,000 | $5.72 | $5,720.00 |
SPC5744PK1AMMM8 개요
A microcontroller (MCU) is a single integrated circuit that combines a processor core, program memory, data memory, and peripherals into one chip, forming the compute heart of an embedded system. Within the powertrain hierarchy, the MPC57xx/SPC57xx family sits above basic 8-bit and 16-bit MCUs, serving as a power-management-level, safety-oriented device for electronic control units (ECUs) in vehicles and industrial machinery.
Key features include the dual-core e200z4 32-bit Power Architecture capable of lockstep or parallel operation for functional-safety designs, 2.5 MB (2.5M x 8) of program Flash, and a rich connectivity set: CAN bus, Ethernet, FlexRay, LIN bus, SPI, and UART/USART. On-chip peripherals include DMA, low-voltage detect (LVD), power-on reset (POR), and a watchdog timer (WDT), all of which are essential for robust automotive ECU operation.
Architecturally, the e200z4 core implements the Power Architecture instruction set with a 7-stage pipeline, and the dual-core configuration allows one core to supervise the other for safety integrity in ASIL-rated systems. The 3.15 V to 5.5 V supply range simplifies integration into 5 V automotive rails.
Typical applications include engine management ECUs, transmission and gearbox control, electric power steering, and industrial motor control where CAN, FlexRay, and Ethernet networking converge on a single processing node.
When designing with this device, confirm the FlexRay and Ethernet transceiver compatibility and plan power sequencing for the 5 V rail early in the schematic phase.
This page synthesizes distributor pricing, drop-in alternatives, and practical design notes not found in the manufacturer datasheet.
드롭인 대체품: SPC5744PK1AMMM8 — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
이 시리즈의 변형
다음과 드롭인 호환되는 동일 시리즈 모델: SPC5744PK1AMMM8 (동일 폼 팩터 및 풋프린트) — 차이점: Connectivity, Core Size.
빠른 비교 도구 — 나란히 비교할 대체 부품을 선택하십시오:
SPC5746BSK1MKU2
✅ 드롭인 ⚠️ 사양 미검증✓ 재고 있음
$17.25 / 개
데이터시트 보기 →SPC5744PK1AMMM8
✅ 드롭인✓ 재고 있음
$5.72 / 개
데이터시트 보기 →SPC5744PK1AMMM8 최대 정격 & 전기적 특성
| Core Processor | e200z4 (Power Architecture) |
| Core Size | 32-Bit Dual-Core |
| Maximum Clock Speed | 180 MHz |
| Program Memory Size | 2.5 MB (2.5M x 8) Flash |
| SRAM Size | 384 KB |
| Supply Voltage Range | 3.15 V to 5.5 V |
| 동작 온도 | -40C to +125C |
| Connectivity | CANbus, Ethernet, FlexRay, LINbus, SPI, UART/USART |
| Peripherals | DMA, LVD, POR, WDT |
| 패키지 | 257-LFBGA (MAPBGA 257), 14 x 14 mm |
| 실장 유형 | Surface Mount |
| Series | MPC57xx / SPC57xx |
| 데이터 버스 폭 | 32 bit |
| Part Status | Active |
| RoHS 상태 | RoHS (per distributor listings) |
SPC5744PK1AMMM8 257-lfbga (mapbga 257), 14 x 14 mm 핀 구성 가이드
SPC5744PK1AMMM8(257-lfbga (mapbga 257), 14 x 14 mm 패키지)의 핀 구성입니다. 이 디지털 IC에는 GPIO, 통신 인터페이스(UART, SPI, I2C), 전원 핀이 포함되어 있습니다. 대체 핀 기능과 구성 옵션은 제조사 데이터시트를 참조하십시오. 임베디드 시스템 설계와 PCB 레이아웃에 필수적입니다.
다음에 대한 상세 핀아웃 데이터 없음: SPC5744PK1AMMM8.
다음을 참조하십시오: 데이터시트 전체 핀 구성은 다음을 참조하십시오.
일반적인 애플리케이션
SPC5744PK1AMMM8 적합 용도: 6 애플리케이션s: Engine Management ECU, Transmission Control Unit, Gateway and Body Control Module, Industrial Motor Control, Chassis and Safety Domain Control, Test and Measurement / ECU Development Platforms.
Engine Management ECU
The SPC5744PK1AMMM8 fits engine management ECUs because its dual e200z4 cores at 180 MHz deliver the deterministic compute headroom required for crank-angle-synchronous combustion control loops, while 2.5 MB of Flash accommodates calibration data sets and OBD diagnostics stacks. The -40C to +125C automotive temperature grade survives under-hood thermal profiles, and the 3.15 V to 5.5 V supply range connects directly to automotive 5 V rails. In a typical topology the MCU drives injector and ignition pre-drivers over SPI, reads sensor inputs through its ADCs, and communicates with the vehicle over CAN and FlexRay. Its watchdog timer, LVD, and POR peripherals provide the fault monitoring demanded in powertrain safety concepts, and DMA offloads peripheral transfers so both cores stay available for control computation.
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Transmission Control Unit
In transmission control, the SPC5744PK1AMMM8's 2.5 MB Flash holds shift-strategy maps and adaptive-learning code, while 384 KB of SRAM buffers pressure-control and speed-sensor data in real time. The dual-core lockstep capability supports safety supervision of torque-path interrupts, and the 180 MHz clock executes solenoid current-control loops at the kilohertz rates needed for smooth gear engagement. CAN and LIN interfaces link the TCU to the engine ECU and shift lever, and Ethernet supports future diagnostics architectures. Because solenoid drivers and position sensors connect directly through the MCU's peripheral set, board count stays low. Designers should budget Flash for end-of-line calibration data and confirm the 257-ball MAPBGA footprint thermal design for continuous 125C transmission-fluid-adjacent environments.
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Gateway and Body Control Module
The integrated Ethernet, CAN, FlexRay, and LIN controllers make the SPC5744PK1AMMM8 a natural vehicle network gateway: it can bridge legacy CAN/LIN domains to newer Ethernet backbones without external protocol chips, and the dual-core architecture lets one core run routing while the other executes firewall and diagnostic services. The 2.5 MB Flash stores multiple protocol stacks and OTA-update images; 384 KB SRAM buffers message queues during bus load peaks. At 180 MHz, the device sustains gateway filtering latency well within automotive timing budgets. The -40C to +125C range covers cockpit and engine-bay mounting, and the watchdog supports ISO-style supervision of the routing application. Designers should validate Ethernet PHY compatibility and magnetics choice early in the layout.
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Industrial Motor Control
For industrial drives, the SPC5744PK1AMMM8's dual e200z4 cores at 180 MHz execute field-oriented control of PMSM and induction motors while a supervisory core handles safety and communication. The 2.5 MB Flash stores motion profiles and parameter tables, and 384 KB SRAM supports fast current-loop variables. CAN and Ethernet interfaces integrate the drive into factory automation networks, while SPI connects gate drivers and encoder interfaces. The 3.15 V to 5.5 V input simplifies the control-side power supply from standard industrial rails, and the LVD/POR/WDT peripherals protect against brown-out-induced misfiring of inverter stages. Its automotive temperature rating also covers cabinet environments with elevated ambient temperatures, reducing derating concerns compared with commercial-grade MCUs.
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Chassis and Safety Domain Control
Electric power steering, brake, and stability-control ECUs benefit from the SPC5744PK1AMMM8's dual-core architecture, where one e200z4 core runs the control algorithm and the second monitors it - a pattern used in ASIL-oriented designs. The 180 MHz performance closes steering assist loops with the sub-millisecond latency these systems require, and 2.5 MB Flash hosts fault-management and calibration code. FlexRay provides the deterministic chassis communication some platforms mandate, while CAN serves mainstream topologies. The watchdog, LVD, and POR peripherals feed the safety concept's supervision chain. The 257-ball MAPBGA's 14 x 14 mm footprint fits dense ECU boards, though the fine ball pitch requires careful PCB stackup and inspection planning during manufacturing.
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Test and Measurement / ECU Development Platforms
Development and HIL (hardware-in-the-loop) platforms for powertrain calibration use the SPC5744PK1AMMM8 because it matches production ECU silicon, ensuring that calibration results transfer directly to the vehicle. The 2.5 MB Flash and 384 KB SRAM support full application images plus instrumentation hooks, while Ethernet and CAN links stream measurement data to host PCs at 180 MHz-driven throughput. NXP's SPC5 software ecosystem and supported debug probes give access to both cores during development. The -40C to +125C rating allows environmental chamber testing without device swaps. For bench setups, designers should provide the 3.15 V to 5.5 V supply via a benchtop regulator with current limiting and add JTAG/SWD headers on the 257-ball MAPBGA fanout.
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추천 제품 요약
엔지니어링 참조 데이터: SPC5744PK1AMMM8 — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
대체품과의 비교
| 파라미터 | 이 제품 | SPC5746BSK1MKU2 |
|---|---|---|
| Package | 257-LFBGA (MAPBGA 257), 14 x 14 mm | MAPBGA 257 class |
| Brand | NXP Semiconductors | NXP Semiconductors |
| Core Architecture | Dual-core e200z4 Power Architecture | Dual-core Power Architecture (SPC57xx) |
| Clock Speed | 180 MHz | 180 MHz |
| Connectivity | CAN, Ethernet, FlexRay, LIN, SPI, UART/USART | CAN, Ethernet, FlexRay, LIN, SPI (family level) |
주요 차별점
- Dual-core e200z4 safety architecture (vs MPC565CVR40 (legacy single-core Powertrain MCU))
- Native FlexRay plus Ethernet on-chip (vs MC9S12XEQ384CAG (16-bit S12X family))
- 2.5 MB Flash in a compact 14 x 14 mm BGA (vs SPC5644AF0MLU2 (SPC56x generation))
설계 노트
Design the 5 V power tree for the SPC5744PK1AMMM8 with an automotive system basis chip (SBC) such as the MC33907 family, which provides the sequencing, monitoring, and reset supervision this MPC57xx-class MCU expects. The device accepts 3.15 V to 5.5 V, so a protected automotive 5 V rail with load-dump clamping is sufficient; Estimated: budget several hundred milliamps peak for core plus I/O at 180 MHz, but confirm exact current figures from the NXP datasheet electrical tables rather than this estimate.
The 257-ball MAPBGA in a 14 x 14 mm body uses a fine ball pitch requiring controlled PCB stackup. Use via-in-pad or dog-bone fanout on the outer ball rows, keep via fill and plating consistent, and verify the fabricator's BGA capability before release. Follow the NXP MPC57xx hardware design guide for power-plane segmentation: separate solid planes for core and I/O supplies, with dense decoupling capacitor placement directly under the BGA on the opposite layer.
Do not assume SPC57xx family members share identical 257-ball maps: the SPC5744P and SPC5746B differ in memory configuration and some ball functions. Before any second-source or family swap, diff the ball-map tables of both NXP datasheets and revalidate boot configuration pins. Also confirm whether your supply source is NXP direct or Rochester Electronics continuation stock to align lot and date-code expectations in automotive PPAP documentation.
FlexRay and Ethernet interfaces on the SPC5744PK1AMMM8 demand controlled-impedance differential routing to their transceivers (e.g., MC33664 for FlexRay, a 100BASE-T1-class PHY for Ethernet). Keep differential pairs length-matched, reference an unbroken ground plane, and place the transceivers within a few centimeters of the MCU balls. Route CAN/LIN lines with common-mode chokes and ESD protection at the connector to survive automotive transient testing.
규정 준수 정보
Distributor listings (LCSC, Lisleapex) mark the part as ROHS compliant and lead-free. REACH, AEC-Q100 qualification, halogen-free, and conflict-minerals status should be confirmed from the official NXP compliance documentation.
