STM32F413ZHJ6 - 100MHz Cortex-M4 MCU, 1.5MB Flash | STMicroelectronics
Teilenummer: STM32F413ZHJ6 ✓ Aktiv| Menge | Stückpreis | Gesamt |
|---|---|---|
| 1 | $18.5 | $18,50 |
| 10 | $16.2 | $162,00 |
| 100 | $13.85 | $1.385,00 |
| 500 | $12.1 | $6.050,00 |
| 1.000 | $10.75 | $10.750,00 |
| 3.000 | $9.4 | $28.200,00 |
STM32F413ZHJ6 Übersicht
A microcontroller (MCU) is a system-on-chip that integrates a CPU core, program and data memory, peripherals and I/O on a single die. The Cortex-M4 core from Arm adds a single-precision IEEE 754 floating-point unit and DSP extensions such as SIMD and MAC instructions, making STM32F4 devices suitable for mixed control plus signal-processing workloads. Within ST's broader portfolio, STM32F4 sits between the Cortex-M3 STM32F1 series and the Cortex-M7 STM32F7 series, targeting motor control, audio, industrial connectivity and HMI applications.
Key features of the STM32F413ZHJ6 include a 12-bit ADC sampling up to 2.4 MSPS with up to 16 channels, two 12-bit DACs, six general-purpose 16-bit timers plus two watchdogs, a real-time clock and a true random-number generator for crypto acceleration. Communication peripherals include three I2C, five SPI/I2S, two UART/USART, one USB OTG FS, two CAN 2.0B and an SDIO interface, while the integrated crypto/hash block accelerates AES-128/256, DES/TDES, SHA-1/SHA-256 and HMAC in hardware.
The architecture is built on ST's 90 nm embedded Flash process with an adaptive real-time ART Accelerator, allowing the Cortex-M4 to fetch from Flash with zero-wait-state performance at the full 100 MHz clock. A separate 4 KB backup SRAM and a VBAT domain keep the RTC and backup registers alive across main power loss, and the internal SMPS step-down converter reduces core current draw at elevated voltages.
Typical applications include industrial HMI panels, motor control inverters, USB audio interfaces, point-of-sale terminals, smart metering gateways, barcode scanners and medical instrumentation. The combination of USB OTG FS, CAN, SDMMC, crypto/hash and external SDRAM support also makes it well suited for IoT edge gateways and connected sensor hubs.
When designing with this part, plan for a 3.3 V rail with decoupling near each VDD/VSS pair, and ensure unused I/O are set to analog or pulldown to avoid leakage. Confirm BSP support for the UFBGA-144 package in your chosen toolchain (STM32CubeIDE, IAR EWARM, Keil MDK) before committing layout, since UFBGA requires microvia-friendly stackups.
This page combines verified distributor pricing, drop-in 144-pin alternatives, application-specific design notes and a parametric comparison matrix - context that goes well beyond the standalone datasheet.
Drop-in-Alternativen für STM32F413ZHJ6 – gleiches Gehäuse, Pin-kompatibel. Bauteile mit anderem Gehäuse, die eine PCB-Überarbeitung erfordern, sind ausgeschlossen.
Varianten dieser Serie
Modelle derselben Serie, die drop-in-kompatibel sind mit STM32F413ZHJ6 (gleiche Bauform und Footprint) – abweichend in ADC, Communication Interfaces, Core, DAC, Package.
Schnellvergleichstool – Wählen Sie Alternativbauteile für den Direktvergleich:
STM32F413ZHJ6TR
✅ Drop-In📋 Referenzalternative (nicht im Katalog)
STM32F413ZIY6TR
✅ Drop-In📋 Referenzalternative (nicht im Katalog)
STM32F412ZHJ6
✅ Drop-In📋 Referenzalternative (nicht im Katalog)
STM32F413ZHJ6 Grenzwerte & elektrische Eigenschaften
| Core | ARM Cortex-M4 with FPU and DSP instructions |
| Maximale Taktfrequenz | 100 MHz |
| Program Memory (Flash) | 1.5 MB (1536 KB) |
| SRAM | 320 KB (256 KB SRAM1 + 64 KB CCM SRAM) |
| Operating Voltage | 1.7 V to 3.6 V |
| CoreMark / DMIPS | 273 CoreMark / 125 DMIPS |
| Gehäuse | 144-ball UFBGA (10x10 mm, ZHJ suffix) |
| I/O Pins | 114 (approximate, depends on alternate functions) |
| ADC | 12-bit, up to 16 channels, 2.4 MSPS |
| DAC | 2x 12-bit |
| Timers | 6x general-purpose 16-bit, 2x watchdog, SysTick |
| Communication Interfaces | 3x I2C, 5x SPI/I2S, 2x USART/UART, USB OTG FS, 2x CAN 2.0B, SDIO |
| Crypto / Hash Accelerator | AES-128/256, DES/TDES, SHA-1, SHA-256, HMAC |
| External Memory Controller | SRAM, NOR/NAND Flash, SDRAM (8-bit bus) |
| Betriebstemperaturbereich | -40 C to +85 C |
| Montageart | Surface Mount (BGA) |
| MSL-Level | Level 3 |
| RoHS-Status | Compliant |
STM32F413ZHJ6 144-ball ufbga (10x10 mm, zhj suffix) Pinbelegungsleitfaden
Pinbelegung für STM32F413ZHJ6 (144-ball ufbga (10x10 mm, zhj suffix)-Gehäuse). Dieser digitale IC umfasst GPIO, Kommunikationsschnittstellen (UART, SPI, I2C) und Versorgungspins. Alternative Pin-Funktionen und Konfigurationsoptionen entnehmen Sie dem Herstellerdatenblatt. Unverzichtbar für Embedded-System-Design und PCB-Layout.
Keine detaillierten Pinbelegungsdaten verfügbar für STM32F413ZHJ6.
Siehe die Datenblatt für die vollständige Pin-Konfiguration.
Typische Anwendungen
STM32F413ZHJ6 ist geeignet für 7 Anwendungs: Industrial HMI Touch Panels, USB Audio Interfaces and DACs, IoT Edge Gateways and Sensor Hubs, Motor Control and BLDC Inverters, Medical Instrumentation and Patient Monitors, Point-of-Sale (POS) Terminals, Smart Metering Gateways.
Industrial HMI Touch Panels
The STM32F413ZHJ6 is well matched to industrial HMI panels because its 100 MHz Cortex-M4 with FPU drives LVDS/8080 TFT controllers, supports external SDRAM via the FSMC bus, and runs USB host stacks for USB-HID touchscreens. The 1.5 MB Flash holds graphical assets, fonts and the touch coordinate filter library; the AES/SHA block secures signed firmware updates on the factory floor. Estimated power budget per panel is under 250 mW at full CPU load thanks to the internal SMPS step-down, simplifying thermal design in sealed enclosures.
Empfohlen
USB Audio Interfaces and DACs
The on-chip USB OTG full-speed controller with internal PHY paired with five SPI/I2S ports makes the STM32F413ZHJ6 ideal for USB audio interfaces, headset dongles and external DACs. Audio streaming runs on I2S while control/feedback uses USB, all managed by the Cortex-M4 FPU for sample-rate conversion and equalization in real time. Estimated audio latency of 8-16 ms at 48 kHz is achievable thanks to DMA double-buffering and zero-wait-state Flash execution at 100 MHz.
Empfohlen
IoT Edge Gateways and Sensor Hubs
The combined Wi-Fi/Sub-GHz gateway, the STM32F413ZHJ6 aggregates Modbus/CAN field sensors, performs local edge analytics using the FPU/DSP, and publishes to the cloud via a connected ESP host processor. The hardware AES-128/256 and SHA accelerators enable TLS-1.2 sessions without burdening the Cortex-M4; SRPOTA-style secure boot is straightforward via ST's bootloader and SBSFU libraries. Estimated headroom for protocol stack plus edge analytics: ~700 KB Flash, ~180 KB RAM at 100 MHz.
Empfohlen
Motor Control and BLDC Inverters
For sensorless FOC motor drives the STM32F413ZHJ6 fits well: the Cortex-M4 FPU computes the Park/Clarke transforms, the six timer PWMs drive a three-phase inverter, and five SPI ports read resolver or Hall encoders. CAN 2.0B supports CiA 402 / 402-2 motion profiles on industrial servo networks, and the 12-bit ADC at 2.4 MSPS enables sub-microsecond current shunt sampling. Estimated PWM frequency of 20 kHz with current loop execution under 12 us on this MCU per ST's PMSM SDK benchmarks.
Empfohlen
Medical Instrumentation and Patient Monitors
Patient-side monitors benefit from the STM32F413ZHJ6's 12-bit ADC at 2.4 MSPS for ECG/EEG front-end conditioning, USB OTG FS for tethered PC data links, and the hardware AES block for HIPAA/secure clinical data hashing. The Cortex-M4 FPU accelerates FFT-based heart-rate variability calculations while leaving CPU cycles for display control and button polling. Estimated power budget is well under 500 mW during continuous monitoring, allowing battery-powered portable designs.
Empfohlen
Point-of-Sale (POS) Terminals
POS terminals combining a touch display, secure PIN entry and NFC card readers rely on the STM32F413ZHJ6's hardware AES/SHA accelerators for PCI-PTS-friendly key storage, plus USB OTG FS for peripheral expansion (barcode scanners, printers). The 1.5 MB Flash accommodates payment stacks and GUI libraries, while the dual CAN ports support fuel-pump or kiosk backplane networking. Estimated boot time to payment-app ready state: under 1.5 s with the ST secure-bootloader chain on a 100 MHz core.
Empfohlen
Smart Metering Gateways
Concentrator devices for electricity/gas AMI networks use the STM32F413ZHJ6 to aggregate DLMS/COSEM telegrams from a fleet of meters over RS-485 or PLC, plus Sub-GHz radio via SPI. The Cortex-M4 handles Modbus/TCP bridging and pushes aggregated data to a back office via the on-chip USB or external Ethernet. Estimated concurrent connection budget for 16 meter slaves and one uplink at 100 MHz exceeds 30 frames/s with buffer headroom.
Empfohlen
Zusammenfassung der empfohlenen Produkte
Technische Referenzdaten für STM32F413ZHJ6 – Vergleich, Designhinweise und Compliance-Informationen.
Auswahlhilfe
Vergleich mit Alternativen
| Parameter | Dieses Produkt | STM32F413ZHJ6TR | STM32F413ZIY6TR | STM32F412ZHJ6 |
|---|---|---|---|---|
| Core | Cortex-M4F (FPU + DSP) | Cortex-M4F (FPU + DSP) | Cortex-M4F (FPU + DSP) | Cortex-M4F (FPU + DSP) |
| Maximum Clock Frequency | 100 MHz | 100 MHz | 100 MHz | 100 MHz |
| Flash Memory | 1.5 MB | 1.5 MB | 2 MB (+33%) | 1 MB (-33%) |
| SRAM | 320 KB | 320 KB | 320 KB | 256 KB (-20%) |
| Package | 144-ball UFBGA (10x10) | 144-ball UFBGA (10x10) - same | 144-ball UFBGA - same | 144-ball UFBGA (10x10) - same |
| Brand | STMicroelectronics | STMicroelectronics | STMicroelectronics | STMicroelectronics |
| Crypto/Hash Hardware | AES, DES, SHA, HMAC | AES, DES, SHA, HMAC | AES, DES, SHA, HMAC | AES only |
| USB OTG FS | Yes | Yes | Yes | Yes |
| CAN 2.0B Controllers | 2 | 2 | 2 | 2 |
| 1-Piece Price (USD, as of 2026-10-10) | 18.50 | 18.50 | 20.10 | 16.40 |
Wichtigste Unterscheidungsmerkmale
- Largest Flash density in 144-ball UFBGA F4 family at this footprint (vs. STM32F412ZHJ6)
- Full crypto/hash accelerator (AES, DES, SHA-1, SHA-256, HMAC) (vs. STM32F412ZHJ6)
- Higher total SRAM vs F412 at the same footprint (vs. STM32F412ZHJ6)
Designhinweise
The 144-ball UFBGA package has a 0.8 mm ball pitch and requires a 4-6 layer PCB with microvias. Route the inner row of balls to inner signal layers using laser-drilled microvias per IPC-6012 class 3 tolerances; ST's AN2581 application note provides the recommended landing pattern. Plan for backup-ground stitching vias under the package (BGA-PGA-style via-in-pad or tented vias) to keep power-return loops short.
The STM32F413ZHJ6 integrates an internal SMPS step-down (LDO/HSM mode), which reduces core current at elevated VDD. According to the datasheet, place a 4.7 uF X5R ceramic on VDDA, a 100 nF on each VDD/VSS pair, and 1 uF on VBAT, keeping traces <= 5 mm and on a clean ground island. Do not power the SMPS inductor (L1) and the analog ground from the same copper pour.
Mistakenly configuring the SWD/JTMS pins after programming leaves the MCU unable to be re-flashed via the debugger. Ensure unused I/Os are set to analog mode in the GPIO initialization, and hold NRST low during power-up to force a clean boot. The UFBGA-144 part is MSL-3 (1 week floor life) - reflow within 168 hours of opening the sealed bag or rebake per J-STD-033.
Estimated: at 100 MHz CPU load on industrial workload, the UFBGA-144 power dissipation is ~250 mW, which on a 4-layer board with 2 oz copper yields approximately +12 C junction rise. For closed enclosures provide at least 1 square inch of copper stitching under the package to keep Tj below 100 C at 85 C ambient.
Compliance-Informationen
RoHS / REACH compliant per ST product declaration. Lead-free Pb-free UFBGA-144 package. MSL-3 floor life per J-STD-033. AEC-Q100 grades require separate automotive ordering codes; the standard STM32F413ZHJ6 is not automotive-qualified.
