STM32F413ZHJ6 - 100MHz Cortex-M4 MCU, 1.5MB Flash | STMicroelectronics
부품 번호: STM32F413ZHJ6 ✓ 활성| 수량 | 단가 | 합계 |
|---|---|---|
| 1 | $18.5 | $18.50 |
| 10 | $16.2 | $162.00 |
| 100 | $13.85 | $1,385.00 |
| 500 | $12.1 | $6,050.00 |
| 1,000 | $10.75 | $10,750.00 |
| 3,000 | $9.4 | $28,200.00 |
STM32F413ZHJ6 개요
A microcontroller (MCU) is a system-on-chip that integrates a CPU core, program and data memory, peripherals and I/O on a single die. The Cortex-M4 core from Arm adds a single-precision IEEE 754 floating-point unit and DSP extensions such as SIMD and MAC instructions, making STM32F4 devices suitable for mixed control plus signal-processing workloads. Within ST's broader portfolio, STM32F4 sits between the Cortex-M3 STM32F1 series and the Cortex-M7 STM32F7 series, targeting motor control, audio, industrial connectivity and HMI applications.
Key features of the STM32F413ZHJ6 include a 12-bit ADC sampling up to 2.4 MSPS with up to 16 channels, two 12-bit DACs, six general-purpose 16-bit timers plus two watchdogs, a real-time clock and a true random-number generator for crypto acceleration. Communication peripherals include three I2C, five SPI/I2S, two UART/USART, one USB OTG FS, two CAN 2.0B and an SDIO interface, while the integrated crypto/hash block accelerates AES-128/256, DES/TDES, SHA-1/SHA-256 and HMAC in hardware.
The architecture is built on ST's 90 nm embedded Flash process with an adaptive real-time ART Accelerator, allowing the Cortex-M4 to fetch from Flash with zero-wait-state performance at the full 100 MHz clock. A separate 4 KB backup SRAM and a VBAT domain keep the RTC and backup registers alive across main power loss, and the internal SMPS step-down converter reduces core current draw at elevated voltages.
Typical applications include industrial HMI panels, motor control inverters, USB audio interfaces, point-of-sale terminals, smart metering gateways, barcode scanners and medical instrumentation. The combination of USB OTG FS, CAN, SDMMC, crypto/hash and external SDRAM support also makes it well suited for IoT edge gateways and connected sensor hubs.
When designing with this part, plan for a 3.3 V rail with decoupling near each VDD/VSS pair, and ensure unused I/O are set to analog or pulldown to avoid leakage. Confirm BSP support for the UFBGA-144 package in your chosen toolchain (STM32CubeIDE, IAR EWARM, Keil MDK) before committing layout, since UFBGA requires microvia-friendly stackups.
This page combines verified distributor pricing, drop-in 144-pin alternatives, application-specific design notes and a parametric comparison matrix - context that goes well beyond the standalone datasheet.
드롭인 대체품: STM32F413ZHJ6 — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
이 시리즈의 변형
다음과 드롭인 호환되는 동일 시리즈 모델: STM32F413ZHJ6 (동일 폼 팩터 및 풋프린트) — 차이점: ADC, Communication Interfaces, Core, DAC, Package.
빠른 비교 도구 — 나란히 비교할 대체 부품을 선택하십시오:
STM32F413ZHJ6TR
✅ 드롭인📋 참조 대체품 (카탈로그에 없음)
STM32F413ZIY6TR
✅ 드롭인📋 참조 대체품 (카탈로그에 없음)
STM32F412ZHJ6
✅ 드롭인📋 참조 대체품 (카탈로그에 없음)
STM32F413ZHJ6 최대 정격 & 전기적 특성
| Core | ARM Cortex-M4 with FPU and DSP instructions |
| 최대 클록 주파수 | 100 MHz |
| Program Memory (Flash) | 1.5 MB (1536 KB) |
| SRAM | 320 KB (256 KB SRAM1 + 64 KB CCM SRAM) |
| Operating Voltage | 1.7 V to 3.6 V |
| CoreMark / DMIPS | 273 CoreMark / 125 DMIPS |
| 패키지 | 144-ball UFBGA (10x10 mm, ZHJ suffix) |
| I/O Pins | 114 (approximate, depends on alternate functions) |
| ADC | 12-bit, up to 16 channels, 2.4 MSPS |
| DAC | 2x 12-bit |
| Timers | 6x general-purpose 16-bit, 2x watchdog, SysTick |
| Communication Interfaces | 3x I2C, 5x SPI/I2S, 2x USART/UART, USB OTG FS, 2x CAN 2.0B, SDIO |
| Crypto / Hash Accelerator | AES-128/256, DES/TDES, SHA-1, SHA-256, HMAC |
| External Memory Controller | SRAM, NOR/NAND Flash, SDRAM (8-bit bus) |
| 동작 온도 범위 | -40 C to +85 C |
| 실장 유형 | Surface Mount (BGA) |
| MSL 레벨 | Level 3 |
| RoHS 상태 | Compliant |
STM32F413ZHJ6 144-ball ufbga (10x10 mm, zhj suffix) 핀 구성 가이드
STM32F413ZHJ6(144-ball ufbga (10x10 mm, zhj suffix) 패키지)의 핀 구성입니다. 이 디지털 IC에는 GPIO, 통신 인터페이스(UART, SPI, I2C), 전원 핀이 포함되어 있습니다. 대체 핀 기능과 구성 옵션은 제조사 데이터시트를 참조하십시오. 임베디드 시스템 설계와 PCB 레이아웃에 필수적입니다.
다음에 대한 상세 핀아웃 데이터 없음: STM32F413ZHJ6.
다음을 참조하십시오: 데이터시트 전체 핀 구성은 다음을 참조하십시오.
일반적인 애플리케이션
STM32F413ZHJ6 적합 용도: 7 애플리케이션s: Industrial HMI Touch Panels, USB Audio Interfaces and DACs, IoT Edge Gateways and Sensor Hubs, Motor Control and BLDC Inverters, Medical Instrumentation and Patient Monitors, Point-of-Sale (POS) Terminals, Smart Metering Gateways.
Industrial HMI Touch Panels
The STM32F413ZHJ6 is well matched to industrial HMI panels because its 100 MHz Cortex-M4 with FPU drives LVDS/8080 TFT controllers, supports external SDRAM via the FSMC bus, and runs USB host stacks for USB-HID touchscreens. The 1.5 MB Flash holds graphical assets, fonts and the touch coordinate filter library; the AES/SHA block secures signed firmware updates on the factory floor. Estimated power budget per panel is under 250 mW at full CPU load thanks to the internal SMPS step-down, simplifying thermal design in sealed enclosures.
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USB Audio Interfaces and DACs
The on-chip USB OTG full-speed controller with internal PHY paired with five SPI/I2S ports makes the STM32F413ZHJ6 ideal for USB audio interfaces, headset dongles and external DACs. Audio streaming runs on I2S while control/feedback uses USB, all managed by the Cortex-M4 FPU for sample-rate conversion and equalization in real time. Estimated audio latency of 8-16 ms at 48 kHz is achievable thanks to DMA double-buffering and zero-wait-state Flash execution at 100 MHz.
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IoT Edge Gateways and Sensor Hubs
The combined Wi-Fi/Sub-GHz gateway, the STM32F413ZHJ6 aggregates Modbus/CAN field sensors, performs local edge analytics using the FPU/DSP, and publishes to the cloud via a connected ESP host processor. The hardware AES-128/256 and SHA accelerators enable TLS-1.2 sessions without burdening the Cortex-M4; SRPOTA-style secure boot is straightforward via ST's bootloader and SBSFU libraries. Estimated headroom for protocol stack plus edge analytics: ~700 KB Flash, ~180 KB RAM at 100 MHz.
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Motor Control and BLDC Inverters
For sensorless FOC motor drives the STM32F413ZHJ6 fits well: the Cortex-M4 FPU computes the Park/Clarke transforms, the six timer PWMs drive a three-phase inverter, and five SPI ports read resolver or Hall encoders. CAN 2.0B supports CiA 402 / 402-2 motion profiles on industrial servo networks, and the 12-bit ADC at 2.4 MSPS enables sub-microsecond current shunt sampling. Estimated PWM frequency of 20 kHz with current loop execution under 12 us on this MCU per ST's PMSM SDK benchmarks.
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Medical Instrumentation and Patient Monitors
Patient-side monitors benefit from the STM32F413ZHJ6's 12-bit ADC at 2.4 MSPS for ECG/EEG front-end conditioning, USB OTG FS for tethered PC data links, and the hardware AES block for HIPAA/secure clinical data hashing. The Cortex-M4 FPU accelerates FFT-based heart-rate variability calculations while leaving CPU cycles for display control and button polling. Estimated power budget is well under 500 mW during continuous monitoring, allowing battery-powered portable designs.
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Point-of-Sale (POS) Terminals
POS terminals combining a touch display, secure PIN entry and NFC card readers rely on the STM32F413ZHJ6's hardware AES/SHA accelerators for PCI-PTS-friendly key storage, plus USB OTG FS for peripheral expansion (barcode scanners, printers). The 1.5 MB Flash accommodates payment stacks and GUI libraries, while the dual CAN ports support fuel-pump or kiosk backplane networking. Estimated boot time to payment-app ready state: under 1.5 s with the ST secure-bootloader chain on a 100 MHz core.
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Smart Metering Gateways
Concentrator devices for electricity/gas AMI networks use the STM32F413ZHJ6 to aggregate DLMS/COSEM telegrams from a fleet of meters over RS-485 or PLC, plus Sub-GHz radio via SPI. The Cortex-M4 handles Modbus/TCP bridging and pushes aggregated data to a back office via the on-chip USB or external Ethernet. Estimated concurrent connection budget for 16 meter slaves and one uplink at 100 MHz exceeds 30 frames/s with buffer headroom.
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추천 제품 요약
엔지니어링 참조 데이터: STM32F413ZHJ6 — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
대체품과의 비교
| 파라미터 | 이 제품 | STM32F413ZHJ6TR | STM32F413ZIY6TR | STM32F412ZHJ6 |
|---|---|---|---|---|
| Core | Cortex-M4F (FPU + DSP) | Cortex-M4F (FPU + DSP) | Cortex-M4F (FPU + DSP) | Cortex-M4F (FPU + DSP) |
| Maximum Clock Frequency | 100 MHz | 100 MHz | 100 MHz | 100 MHz |
| Flash Memory | 1.5 MB | 1.5 MB | 2 MB (+33%) | 1 MB (-33%) |
| SRAM | 320 KB | 320 KB | 320 KB | 256 KB (-20%) |
| Package | 144-ball UFBGA (10x10) | 144-ball UFBGA (10x10) - same | 144-ball UFBGA - same | 144-ball UFBGA (10x10) - same |
| Brand | STMicroelectronics | STMicroelectronics | STMicroelectronics | STMicroelectronics |
| Crypto/Hash Hardware | AES, DES, SHA, HMAC | AES, DES, SHA, HMAC | AES, DES, SHA, HMAC | AES only |
| USB OTG FS | Yes | Yes | Yes | Yes |
| CAN 2.0B Controllers | 2 | 2 | 2 | 2 |
| 1-Piece Price (USD, as of 2026-10-10) | 18.50 | 18.50 | 20.10 | 16.40 |
주요 차별점
- Largest Flash density in 144-ball UFBGA F4 family at this footprint (vs STM32F412ZHJ6)
- Full crypto/hash accelerator (AES, DES, SHA-1, SHA-256, HMAC) (vs STM32F412ZHJ6)
- Higher total SRAM vs F412 at the same footprint (vs STM32F412ZHJ6)
설계 노트
The 144-ball UFBGA package has a 0.8 mm ball pitch and requires a 4-6 layer PCB with microvias. Route the inner row of balls to inner signal layers using laser-drilled microvias per IPC-6012 class 3 tolerances; ST's AN2581 application note provides the recommended landing pattern. Plan for backup-ground stitching vias under the package (BGA-PGA-style via-in-pad or tented vias) to keep power-return loops short.
The STM32F413ZHJ6 integrates an internal SMPS step-down (LDO/HSM mode), which reduces core current at elevated VDD. According to the datasheet, place a 4.7 uF X5R ceramic on VDDA, a 100 nF on each VDD/VSS pair, and 1 uF on VBAT, keeping traces <= 5 mm and on a clean ground island. Do not power the SMPS inductor (L1) and the analog ground from the same copper pour.
Mistakenly configuring the SWD/JTMS pins after programming leaves the MCU unable to be re-flashed via the debugger. Ensure unused I/Os are set to analog mode in the GPIO initialization, and hold NRST low during power-up to force a clean boot. The UFBGA-144 part is MSL-3 (1 week floor life) - reflow within 168 hours of opening the sealed bag or rebake per J-STD-033.
Estimated: at 100 MHz CPU load on industrial workload, the UFBGA-144 power dissipation is ~250 mW, which on a 4-layer board with 2 oz copper yields approximately +12 C junction rise. For closed enclosures provide at least 1 square inch of copper stitching under the package to keep Tj below 100 C at 85 C ambient.
규정 준수 정보
RoHS / REACH compliant per ST product declaration. Lead-free Pb-free UFBGA-144 package. MSL-3 floor life per J-STD-033. AEC-Q100 grades require separate automotive ordering codes; the standard STM32F413ZHJ6 is not automotive-qualified.
