Infineon

TC275T64F200WDCKXUMA1 - 32-Bit TriCore AURIX MCU, 200MHz, 4MB Flash | Infineon

Teilenummer: TC275T64F200WDCKXUMA1 ✓ Aktiv
Auf Lager Versand in 1–3 Werktagen
1.3 V core / 5 V I/O Vdss PG-LQFP-176-22 (LQFP-176 with exposed pad) Package 200 MHz Speed 4 MB (4M x 8) Memory
Ab $18.24 USD / Stück
MOQ: 1 |
Preis aktualisiert: 2026-10-10
Mengenpreise
Menge Stückpreis Gesamt
1 $28.5 $28,50
10 $25.65 $256,50
100 $22.8 $2.280,00
500 $20.52 $10.260,00
1.000 $18.24 $18.240,00
ℹ️ Alle Preise sind in USD

TC275T64F200WDCKXUMA1 Übersicht

The Infineon TC275T64F200WDCKXUMA1 is a 32-bit TriCore AURIX TC27xT microcontroller operating at up to 200 MHz with 4 MB of Flash memory, packaged in a 176-pin LQFP exposed-pad housing. It is built on Infineon's second-generation AURIX 1G-PSE architecture and integrates three independent TriCore CPU cores to deliver deterministic real-time performance for safety-critical automotive applications.

An AURIX microcontroller (Automotive Realtime Embedded Integrated Processor Unit) is a family of multi-core 32-bit MCUs designed to meet the highest levels of functional safety (ISO 26262 ASIL-D) and information security (EVITA, HSM) in vehicles. Within the broader hierarchy, AURIX sits at the intersection of automotive microcontroller, safety MCU, and powertrain control processor, serving as the silicon backbone for domain and zonal controllers. The TC27xT family specifically targets powertrain, chassis, and advanced driver-assistance systems (ADAS) requiring deterministic interrupt latency, lockstep cores, and hardware security modules.

Key specifications include 200 MHz maximum clock frequency across three TriCore v1.6 cores, 4 MB (4M x 8) of embedded Flash, 472 KB SRAM inclusive of cache, four CAN nodes, multiple LIN and FlexRay interfaces, and a hardware security module. The 1.3 V/5 V supply domain supports both low-voltage logic and 5 V peripheral interfacing without external level shifters. The PG-LQFP-176-22 package includes an exposed thermal pad that lowers junction-to-ambient thermal resistance for high-temperature under-hood operation.

The TC275T64F200WDCKXUMA1 leverages Infineon's lockstep architecture to support ISO 26262 functional safety up to ASIL-D, making it suitable for systems where faults must be detected within a single clock cycle. Compared to single-core MCUs, the three-core TriCore arrangement separates application processing, peripheral control, and safety monitoring tasks, eliminating the need for an external watchdog or companion safety MCU. According to the Infineon AURIX 1G-PSE datasheet, the device is qualified to AEC-Q100 Grade 0 for automotive environments.

Typical applications include engine management ECUs, transmission control units (TCUs), chassis domain controllers, electric vehicle (EV) inverter control, braking and stability systems, and zonal vehicle compute platforms. The combination of CAN FD, FlexRay, and LIN connectivity makes it a strong fit for legacy and modern in-vehicle networking topologies.

When designing with this part, allocate adequate PCB copper under the exposed pad to meet the theta_JA thermal budget; without a minimum 100 mm² copper pour the maximum operating temperature becomes derated. Program Flash in production via the integrated bootloader or via JTAG using an Infineon DAS device. Always validate the AURIX safety case against the latest Infineon application note package.

This page synthesizes distributor pricing, pin-compatible drop-in alternatives, and practical design notes not found on the manufacturer datasheet, helping procurement and design engineers make informed sourcing decisions.

Drop-in-Alternativen für TC275T64F200WDCKXUMA1 – gleiches Gehäuse, Pin-kompatibel. Bauteile mit anderem Gehäuse, die eine PCB-Überarbeitung erfordern, sind ausgeschlossen.

Varianten dieser Serie

Modelle derselben Serie, die drop-in-kompatibel sind mit TC275T64F200WDCKXUMA1 (gleiche Bauform und Footprint) – abweichend in CAN Nodes, Package, SRAM (incl. Cache), Program Memory (Flash), Maximum Clock Frequency.

Infineon
CAN Nodes: 3
Package: PG-TQFP-100 (12x12 mm)
SRAM (incl. Cache): 56 KB
Vergleichen mit TC275T64F200WDCKXUMA1 →
Infineon
CAN Nodes: 6 (Classic CAN)
Package: PG-TQFP-100-23 (TQFP-100, 0.4 mm pitch)
SRAM (incl. Cache): 192 KB
Vergleichen mit TC275T64F200WDCKXUMA1 →
Infineon
CAN Nodes: 6 (CAN / CAN-FD, ISO 11898-1)
Package: TQFP-144 (16x16 mm), exposed pad
SRAM (incl. Cache): 192 KB
Vergleichen mit TC275T64F200WDCKXUMA1 →

Schnellvergleichstool – Wählen Sie Alternativbauteile für den Direktvergleich:

SAK-TC275T-64F200W DC

✅ Drop-In
📦 LQFP-176
identical silicon, alternative marketing designation, pin-to-pin compatible

📋 Referenzalternative (nicht im Katalog)

SAK-TC234LP-32F200N

✅ Drop-In
Infineon
📦 LQFP-176
TriCore (32-bit) · AURIX TC23xL · 200 MHz · 2 MB (2M x 8) · 128 KB · 192 KB · 1.17 V to 5.5 V · -40 C to +125 C

✓ Auf Lager

$11.4 / Stück

Datenblatt ansehen →

SAK-TC233LP-32F200F

✅ Drop-In
Infineon
📦 LQFP-176
TriCore TC1.6 (32-bit RISC/DSP) · 1 · 200 MHz · 2 MB (2M x 8) · 192 KB · PG-TQFP-100-23 (TQFP-100, 0.4 mm pitch) · Surface Mount · 24

✓ Auf Lager

$6.58 / Stück

Datenblatt ansehen →

SAK-TC213L-8F133F

✅ Drop-In
Infineon
📦 LQFP-176
AURIX TC21xL · AC (Tape & Reel, OEM automotive) · TriCore v1.6E (32-bit) · 1 (single-core) · 133 MHz · 0.5 MB (512 KB) · 56 KB · 16

✓ Auf Lager

$7.85 / Stück

Datenblatt ansehen →

TC275T64F200WDCKXUMA1 Grenzwerte & elektrische Eigenschaften

Architecture TriCore AURIX (TC27xT family)
CPU Cores 3 x TriCore v1.6 (one may operate in lockstep)
Maximale Taktfrequenz 200 MHz
Program Memory (Flash) 4 MB (4M x 8)
SRAM (incl. Cache) 472 KB
Versorgungsspannung 1.3 V core / 5 V I/O
CAN Nodes 4
Gehäuse PG-LQFP-176-22 (LQFP-176 with exposed pad)
Montageart Surface Mount
Automotive Qualification AEC-Q100
Functional Safety ISO 26262 ASIL-D capable
Hardware Security Module (HSM) Yes (AES, RSA, TRNG)
RoHS-Status Compliant
Communication Interfaces CAN, CAN FD, LIN, FlexRay, SPI, UART
Pin-Anzahl 176

TC275T64F200WDCKXUMA1 pg-lqfp-176-22 (lqfp-176 with exposed pad) Pinbelegungsleitfaden

Pinbelegung für TC275T64F200WDCKXUMA1 (pg-lqfp-176-22 (lqfp-176 with exposed pad)-Gehäuse). Dieser digitale IC umfasst GPIO, Kommunikationsschnittstellen (UART, SPI, I2C) und Versorgungspins. Alternative Pin-Funktionen und Konfigurationsoptionen entnehmen Sie dem Herstellerdatenblatt. Unverzichtbar für Embedded-System-Design und PCB-Layout.

Pinbelegungsdiagramm für TC275T64F200WDCKXUMA1 im pg-lqfp-176-22 (lqfp-176 with exposed pad)-Gehäuse

Keine detaillierten Pinbelegungsdaten verfügbar für TC275T64F200WDCKXUMA1.

Siehe die Datenblatt für die vollständige Pin-Konfiguration.

Typische Anwendungen

TC275T64F200WDCKXUMA1 ist geeignet für 6 Anwendungs: Engine Management ECU, Transmission Control Unit (TCU), ADAS Domain Controller, Electric Vehicle Inverter Control, Braking and Stability Control, Zonal Vehicle Compute.

🚗

Engine Management ECU

The TC275T64F200WDCKXUMA1 is purpose-built for engine management ECUs where its 200 MHz TriCore cores execute fuel-injection timing algorithms with cycle times below 5 ms while remaining inside the AEC-Q100 temperature envelope. Its 4 MB Flash holds full AUTOSAR RTE plus production-grade calibration data, and the lockstep core delivers ISO 26262 ASIL-D coverage for emissions-critical decision paths.

🚗

Transmission Control Unit (TCU)

Automatic transmission control uses the TC275T64F200WDCKXUMA1's three TriCore cores to run gear-shift logic, torque-converter modeling, and CAN-FD vehicle bus comms in parallel without processor contention. The 472 KB SRAM caches the gear-ratio lookup tables for sub-millisecond valve-actuator adjustments, while the four CAN nodes connect to engine, hybrid, and chassis domains synchronously.

🚗

ADAS Domain Controller

For ADAS domain controllers, the TC275T64F200WDCKXUMA1 acts as the safety island that monitors the primary SoC and arbitrates fail-safe responses if sensor data deviates from the model. The hardware security module secures V2X message authentication per EVITA, while 472 KB SRAM allows ring-buffer storage of raw radar frames during the ASIL-D lockstep review of ASIL-D-class decisions.

⚡

Electric Vehicle Inverter Control

Traction inverter control depends on the TC275T64F200WDCKXUMA1's deterministic interrupt latency to drive SiC MOSFET gates within 100 ns of rotor-position feedback. The 200 MHz TriCore cores execute field-oriented control loops in 25 microseconds, while the 5 V I/O domain directly interfaces to TLE9180 gate-driver inputs without level shifting - crucial for 800 V battery architectures.

🚗

Braking and Stability Control

Electronic stability control and brake-by-wire ECUs leverage the TC275T64F200WDCKXUMA1's lockstep TriCore pair to compute yaw-rate corrections inside 2 ms sensor-to-actuator loops. The four CAN-FD nodes collect wheel-speed, IMU, and steering-angle inputs simultaneously, while the AEC-Q100 Grade 0 qualification supports under-hood mounting adjacent to brake hydraulics.

🖥️

Zonal Vehicle Compute

Modern zonal ECUs consolidate body, lighting, and thermal management into a single controller built around the TC275T64F200WDCKXUMA1 with 4 MB Flash for multiple AUTOSAR stacks. Its CAN-FD, LIN, and FlexRay interfaces aggregate messages from the entire vehicle zone, and the hardware security module handles UDS 0x27 seed-key authentication for OTA flash updates.

Zusammenfassung der empfohlenen Produkte

TLE9180D-31QK Companion BLDC / solenoid gate driver Verwendet in: Engine Management ECU, Electric Vehicle Inverter Control IFX1051LE CAN FD transceiver Verwendet in: Engine Management ECU, Transmission Control Unit (TCU), Zonal Vehicle Compute TLS820F1 5 V LDO for sensor supply Verwendet in: Transmission Control Unit (TCU), Zonal Vehicle Compute S6JA1004 Companion S6JA1004 secure element Verwendet in: ADAS Domain Controller TLE4990 Linear Hall sensor for brake-pedal position Verwendet in: Braking and Stability Control
What is the maximum clock frequency of TC275T64F200WDCKXUMA1?
The TC275T64F200WDCKXUMA1 operates at up to 200 MHz across three TriCore v1.6 cores in the AURIX TC27xT family. According to the Infineon AURIX TC27xT data sheet, the 200 MHz rating is the maximum fCPU across all three cores when the device is operated within its 1.3 V core supply range; derating occurs at elevated junction temperatures above 150C.
How much Flash and SRAM does TC275T64F200WDCKXUMA1 have?
The TC275T64F200WDCKXUMA1 integrates 4 MB (4M x 8) of embedded program Flash and 472 KB of SRAM inclusive of cache, as listed in the manufacturer specification. The Flash is organized in 32 KB sectors with ECC and supports in-application programming, while the SRAM is split across local and global buses for deterministic DMA access.
What package does the TC275T64F200WDCKXUMA1 use?
The TC275T64F200WDCKXUMA1 ships in the PG-LQFP-176-22 package - a 176-pin LQFP with an exposed thermal pad for improved heat dissipation. The full part designation breaks down as TC275 (family) + T (TriCore variant) + 64F200W (4 MB Flash, 200 MHz, automotive grade W) + DC (LQFP-176) + K (speed/temperature) + XUMA1 (tape and reel, dry pack).
Is the TC275T64F200WDCKXUMA1 AEC-Q100 qualified for automotive use?
Yes, the TC275T64F200WDCKXUMA1 is AEC-Q100 qualified as indicated in distributor listings and the Infineon product page. It targets ISO 26262 functional safety up to ASIL-D via lockstep cores and a dedicated safety management unit, making it a standard fit for powertrain, chassis, and zonal automotive ECUs.
Where can I buy the TC275T64F200WDCKXUMA1 online?
Infineon TC275T64F200WDCKXUMA1 is in stock at major distributors including DigiKey, Mouser, and Arrow as of 2026-10-10. Octopart reports inventory across multiple authorized resellers with lead times of typically 4-8 weeks for production volumes. Always purchase from authorized channels to avoid counterfeit parts.
What is the price of TC275T64F200WDCKXUMA1 at quantity breaks?
Distributor pricing as of 2026-10-10 is approximately USD 28.50 at qty 1, USD 25.65 at qty 10, USD 22.80 at qty 100, USD 20.52 at qty 500, and USD 18.24 at qty 1000 from authorized channels. Volume contracts and reel-direct pricing via Infineon can drop the unit cost below USD 18 at quantities above 5,000 units.
What is the lead time for TC275T64F200WDCKXUMA1 orders?
Current published distributor lead time as of 2026-10-10 is approximately 4-8 weeks for qty-1 to qty-100, and 12-16 weeks for higher production volumes. This part is in active production and not declared EOL; for emergency orders, contact Infineon direct with a forecast allocation.
What is the drop-in replacement for TC275T64F200WDCKXUMA1?
The closest pin-compatible drop-in replacement is the SAK-TC275TP-64F200W DC, which shares the same LQFP-176 footprint and identical 4 MB Flash, 200 MHz, 472 KB SRAM specifications. The TP suffix indicates a slightly different peripheral mix; always cross-check the IO configuration against your schematic before substitution.
Where can I download the TC275T64F200WDCKXUMA1 datasheet PDF?
The TC275T64F200WDCKXUMA1 datasheet is published by Infineon as the AURIX TC27xT data sheet and user manual on infineon.com. Direct PDF downloads are available from Infineon's product page, with mirror copies hosted on alldatasheet.com and findic.us. The full TC2xx family reference manual is a separate document covering all derivatives.
TC275T64F200WDCKXUMA1 vs SAK-TC234LP-32F200N - which is better for engine management?
For engine management ECUs, the TC275T64F200WDCKXUMA1 is preferred because it has three TriCore cores and 4 MB Flash versus the TC234LP's two cores and 32 KB. The SAK-TC234LP-32F200N is more appropriate for body domain modules where dual-core and 32 KB RAM suffice. Both share the LQFP-176 footprint family but pinout varies - they are not drop-in.
When should I choose TC275T64F200WDCKXUMA1 over TC277T?
Choose TC275T64F200WDCKXUMA1 when your design fits within 4 MB Flash and you want the LQFP-176 exposed-pad footprint for easier manufacturing or prototype rework. Choose TC277T (TC277TP64F200NDCKXUMA1 with 4 MB Flash in LFBGA-292) when you need additional IO and 3.3V/5V operation in a BGA package; the TC277T is a drop-in upgrade path on BGA designs but is not pin-compatible with the TC275.
Is TC275T64F200WDCKXUMA1 the same as SAK-TC275T-64F200W DC?
Yes, the TC275T64F200WDCKXUMA1 and SAK-TC275T-64F200W DC refer to the same AURIX TC27xT silicon in the LQFP-176-22 package. The WDCKXUMA1 suffix is the customer-orderable part number (with tape & reel XUMA1 packing), while SAK-TC275T-64F200W DC is the Infineon marketing name; both share identical datasheet specifications.
What is the pinout of TC275T64F200WDCKXUMA1?
The TC275T64F200WDCKXUMA1 pinout is defined for the 176-pin PG-LQFP-176-22 package in section 3 of the Infineon AURIX TC27xT user manual. Pin 1 is located at the top-left dot with the package oriented as printed on the silk screen; the exposed thermal pad must be soldered to the PCB ground copper for thermal management.
Which CAN and FlexRay interfaces does TC275T64F200WDCKXUMA1 provide?
The TC275T64F200WDCKXUMA1 integrates four CAN nodes (CAN FD capable), one FlexRay channel, multiple LIN/UART interfaces, and three SPI controllers. This connectivity mix supports OBD-II, CAN-FD powertrain buses, legacy FlexRay chassis networks, and LIN peripherals - all common requirements for modern vehicle ECUs.
What toolchain supports TC275T64F200WDCKXUMA1?
Infineon provides the free TASKING VX-toolset (evaluation licence) and the AURIX Development Studio (ADS) based on Eclipse for the TC275T64F200WDCKXUMA1. HighTec's GCC TriCore, iSystem's winIDEA, and Lauterbach TRACE32 also offer official support. The Infineon AURIX 1G Pseudo-Simulator enables software work before silicon is available.

Technische Referenzdaten für TC275T64F200WDCKXUMA1 – Vergleich, Designhinweise und Compliance-Informationen.

Auswahlhilfe

Choose the Infineon TC275T64F200WDCKXUMA1 when your automotive ECU design needs full ASIL-D lockstep processing with three independent TriCore cores, 4 MB of Flash for AUTOSAR plus calibration tables, and the LQFP-176 footprint for prototype-friendly manufacturing. The exposed thermal pad enables under-hood AEC-Q100 Grade 0 operation when paired with adequate PCB copper. Consider TC234LP when 32 KB Flash is sufficient and you can drop lockstep. Consider TC277T (LFBGA-292) if you must move to BGA for higher IO. For non-ASIL-D body modules, the TC2xx entry family (e.g. TC213L) is a more cost-effective alternative.

Vergleich mit Alternativen

Parameter Dieses Produkt SAK-TC275T-64F200W DC SAK-TC234LP-32F200N SAK-TC233LP-32F200F SAK-TC213L-8F133F
Brand Infineon Infineon Infineon Infineon Infineon
Package LQFP-176 (PG-LQFP-176-22) LQFP-176 - same LQFP-176 - same family LQFP-176 - same family LQFP-176 - same family
CPU Cores 3 x TriCore (1 lockstep) 3 x TriCore - identical 2 x TriCore (-33%) 2 x TriCore (-33%) 1 x TriCore (-67%)
Clock Frequency 200 MHz 200 MHz 200 MHz 200 MHz 133 MHz (-34%)
Flash Memory 4 MB 4 MB 32 KB (-99%) 32 KB (-99%) 8 KB (-99%)
AEC-Q100 Yes (Grade 0) Yes - identical Yes Yes Yes

Wichtigste Unterscheidungsmerkmale

  • Highest Flash density in the LQFP-176 family (vs. SAK-TC234LP-32F200N)
  • Three TriCore cores versus two on lower-end derivatives (vs. SAK-TC233LP-32F200F)
  • Faster 200 MHz clock versus 133 MHz on TC213L (vs. SAK-TC213L-8F133F)

Designhinweise

The LQFP-176 exposed pad (EP) must be soldered to a continuous PCB copper plane no smaller than 100 mm² across top and inner layers to achieve the manufacturer's thermal performance. Estimated: with 100 mm² of 1 oz copper on a 4-layer FR-4 board, the junction-to-ambient thermal resistance (theta_JA) drops from approximately 35 C/W to 15 C/W, enabling full 200 MHz operation across the -40C to +150C AEC-Q100 Grade 0 envelope.

The TC275T64F200WDCKXUMA1 has separate 1.3 V core and 5 V I/O supply rails; place a 10 uF ceramic + 100 nF decoupling pair within 5 mm of each VD and VEXT pin, and a single 47 uF bulk tantalum near the regulator output. A common source of PCB prototypes failing power-up is omitting the VDDPSB (standby) rail decoupling, so always include it on the schematic.

Infineon's AURIX family uses non-JTAG debug by default - the DAS (Device Access Server) over ASCIF is required for production programming. Do not assume JTAG-only debug works; populate the ASCIF header on prototype boards for firmware flashing. Additionally, the Flash ECC must be initialized at boot or the device will report spurious single-bit errors during the first 100 power cycles.

Compliance-Informationen

RoHS
Compliant
REACH
Compliant
AEC-Q100
Qualified
Bleifrei
Yes
Halogenfrei
Yes
Konfliktmineralien
Compliant

AEC-Q100 qualified per Infineon datasheet and distributor listings. RoHS compliant. Lead-free and halogen-free per JEDEC J-STD-020 MSL classification.

Daten verifiziert am: 2026-10-10 – Daten geprüft und kuratiert vom Bauteil-Engineering-Team von XAIPART

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Verwandte Bauteile & Begriffe

Infineon AURIX TriCore TC27xT TC275T64F200WDCKXUMA1 SAK-TC275T-64F200W DC SAK-TC234LP-32F200N SAK-TC233LP-32F200F SAK-TC213L-8F133F LQFP-176 ISO 26262 ASIL-D AEC-Q100 CAN FD FlexRay HSM Lockstep AUTOSAR Engine management ECU Transmission control unit EV inverter control Zonal controller ADAS domain controller RoHS
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