XC3S100E-5TQ144C - Spartan-3E 100K FPGA | AMD
Teilenummer: XC3S100E-5TQ144C ✗ AbgekündigtXC3S100E-5TQ144C Übersicht
A field-programmable gate array is a configurable digital semiconductor whose logic, memory, and I/O can be programmed after fabrication. The FPGA hierarchy extends from configurable logic blocks and look-up tables through the Spartan-3E family to the broader FPGA and programmable-logic-device categories. This flexibility allows one physical package to support multiple interfaces, control functions, and signal-processing implementations.
Key device resources include 2,160 logic cells, 240 logic array blocks, 108 user I/O pins, and 73,728 RAM bits. The 144-lead surface-mount package provides substantially more I/O than the smaller Spartan-3E package options. The listed operating temperature range of 0°C to 85°C suits commercial equipment, while the C designation identifies the commercial product grade.
The Spartan-3E architecture combines programmable logic, dedicated block RAM, and configurable I/O in a single CMOS device. Its 90 nm CMOS implementation is identified in the manufacturer-family documentation, while the -5 suffix denotes the performance grade used in the ordering code. Engineers should distinguish the device's maximum characterized clock frequency from the frequency actually achievable by a specific design, because routing, timing constraints, logic utilization, and I/O requirements determine the final operating point.
Typical uses include industrial control, embedded instrumentation, communication interfaces, digital signal conditioning, and compact embedded systems. The 108 available user I/O positions are especially useful for parallel buses, status and control signals, counters, and multi-channel acquisition systems. The 73,728 RAM bits also permit local buffering, packet storage, counters, and small state-machine implementations without depending entirely on external memory.
A critical design consideration is the limited I/O voltage relationship of this legacy FPGA family. Confirm the bank-specific supply requirements, decoupling, clock topology, configuration source, and termination network against the Spartan-3E datasheet before layout release. A 144-pin TQFP also demands careful escape routing between its 0.5 mm pitch leads, so a stable multilayer stack-up and adequate ground-plane continuity are important.
This product page combines verified device parameters, same-package replacement options, application guidance, and design-focused comparison information. It also highlights which characteristics are confirmed for the exact XC3S100E-5TQ144C ordering code and which engineering details must be checked in the Spartan-3E documentation before a new board is released.
Drop-in-Alternativen für XC3S100E-5TQ144C – gleiches Gehäuse, Pin-kompatibel. Bauteile mit anderem Gehäuse, die eine PCB-Überarbeitung erfordern, sind ausgeschlossen.
XC3S100E-5TQG144C
✅ Drop-In📋 Referenzalternative (nicht im Katalog)
XC3S100E-4TQG144C
✅ Drop-In📋 Referenzalternative (nicht im Katalog)
XC3S100E-5PQ144C
✅ Drop-In📋 Referenzalternative (nicht im Katalog)
XC3S100E-5TQ144C Grenzwerte & elektrische Eigenschaften
| Device Type | Field Programmable Gate Array (FPGA) |
| FPGA Family | Spartan-3E |
| System Gates | 100,000 gates |
| Logic Cells | 2,160 logic cells |
| Logic Array Blocks | 240 LABs/CLBs |
| User I/O Pins | 108 I/O |
| Block RAM | 73,728 bits |
| Maximum Device Frequency | 657 MHz |
| Process Technology | 90 nm CMOS |
| Core Supply Voltage | 1.14 V to 1.26 V |
| Nominal Core Voltage | 1.2 V |
| Betriebstemperatur | 0°C to 85°C |
| Gehäuse | 144-pin TQFP |
| Terminal Count | 144 terminals |
| Montageart | Surface mount |
| Package Code | LFQFP |
| Package Shape | Square |
| Lead-Free Package | Lead-free |
XC3S100E-5TQ144C lead-free Pinbelegungsleitfaden
Pinbelegung für XC3S100E-5TQ144C (lead-free-Gehäuse). Dieser digitale IC umfasst GPIO, Kommunikationsschnittstellen (UART, SPI, I2C) und Versorgungspins. Alternative Pin-Funktionen und Konfigurationsoptionen entnehmen Sie dem Herstellerdatenblatt. Unverzichtbar für Embedded-System-Design und PCB-Layout.
Keine detaillierten Pinbelegungsdaten verfügbar für XC3S100E-5TQ144C.
Siehe die Datenblatt für die vollständige Pin-Konfiguration.
Typische Anwendungen
XC3S100E-5TQ144C ist geeignet für 6 Anwendungs: Industrial Control Systems, Digital Instrumentation, Communication Interfaces, Embedded Data Acquisition, Embedded Security and Access Control, LED Lighting Control.
Industrial Control Systems
The AMD XC3S100E-5TQ144C fits industrial controllers that require deterministic parallel logic, flexible I/O, and modest local data storage. Its 108 user I/O pins can accommodate digital sensors, actuator drivers, interlocks, counters, and communication signaling, while 2,160 logic cells support control sequencing and peripheral bridges. The 73,728 RAM bits can implement counters, status histories, and data buffers without adding external memory. Use the 144-pin TQFP footprint when the system has ample connector density but limited board area. Confirm the 0°C to 85°C commercial range against enclosure conditions and keep clock and I/O timing margins consistent with the -5 grade.
Empfohlen
Digital Instrumentation
The XC3S100E-5TQ144C is useful in digital instrumentation that combines acquisition control, calibration logic, display multiplexing, and status reporting. The 108 I/O pins provide parallel channels for measurement triggers, front-panel controls, communications, and instrument buses. Its 2,160 logic cells are suitable for state machines and data-format conversion, while 73,728 RAM bits can hold samples, calibration tables, or rolling measurement records. The 657 MHz characterized device frequency provides substantial timing margin for common control logic, although actual clock rates depend on the implemented path and timing constraints. Use separate clock-routing and I/O planning in the FPGA design, and verify every voltage bank against the selected board architecture.
Empfohlen
Communication Interfaces
The AMD XC3S100E-5TQ144C can serve as the programmable interface controller in communication equipment that needs parallel bus handling, framing, buffering, and protocol conversion. Its 108 user I/O pins support receive and transmit lanes, flow control, clocking, and status signals, while the dedicated block RAM resources can implement packet buffers or dual-port storage. The 2,160-cell architecture is appropriate for fixed-format protocols and embedded control rather than processor-heavy workloads. A 144-pin TQFP provides enough pin count for multi-bus systems while keeping the package within moderate board-size constraints. Confirm supported I/O standards, clock input arrangement, and configuration interface before assigning pins.
Empfohlen
Embedded Data Acquisition
The XC3S100E-5TQ144C is appropriate for small embedded acquisition systems that coordinate multiple converters, trigger signals, and local data processing. The 108 user I/O pins allow parallel ADC and DAC interfaces to be combined with control outputs, and the 73,728 RAM bits can buffer bursts or support channel multiplexing. The -5 grade provides a 657 MHz characterized maximum frequency, leaving room for control and data-path logic when timing constraints are met. Because performance depends on routing and utilization, obtain the post-route timing report rather than relying on the headline frequency. In a mixed-signal design, keep analog routing separate from digital FPGA edges and follow the package-specific decoupling and unused-pin guidance.
Empfohlen
Embedded Security and Access Control
The XC3S100E-5TQ144C can implement compact access-control, credential-processing, and event-management functions where flexible logic and a moderate I/O count are valuable. Its 108 user I/O pins can support readers, lock relays, keypads, indicators, and supervisory contacts, while the on-chip RAM supports token records, counters, and transaction buffers. The 2,160 logic cells allow parallel protocol handling and control-logic integration without an external FPGA. For connected equipment, implement serial interfaces as explicit I/O constraints and isolate external signal paths to reduce coupling. Validate reset behavior, configuration security, and operating-temperature requirements at the system level rather than assuming the generic Spartan-3E family guarantees cover every implementation.
Empfohlen
LED Lighting Control
The XC3S100E-5TQ144C can control multi-channel LED lighting systems where sequencing, dimming, monitoring, and fault handling benefit from programmable logic. Its 108 user I/O pins support multiple LED drive channels, switch inputs, and status outputs, while 73,728 RAM bits can hold animation patterns, timing sequences, or calibration values. The device's 2,160 logic cells are more than adequate for deterministic sequencing and fault interlocks. Use the -5 grade when the design includes timing-sensitive multiplexing or communication tasks, and ensure that the selected package and PCB allow clean routing from FPGA outputs to driver circuitry. Validate current limits and drive topology outside the FPGA, because the package specifications do not define the external LED load capability.
Empfohlen
Zusammenfassung der empfohlenen Produkte
Technische Referenzdaten für XC3S100E-5TQ144C – Vergleich, Designhinweise und Compliance-Informationen.
Auswahlhilfe
Vergleich mit Alternativen
| Parameter | Dieses Produkt | XC3S100E-5TQG144C | XC3S100E-4TQG144C | XC3S100E-5PQ144C |
|---|---|---|---|---|
| Brand | AMD | AMD | AMD | AMD |
| Package | TQFP-144 | TQFP-144 | TQFP-144 | TQFP-144 |
| FPGA Family | Spartan-3E | Spartan-3E | Spartan-3E | Spartan-3E |
| Performance Suffix | -5 | -5 | -4 | -5 |
Wichtigste Unterscheidungsmerkmale
- Exact -5 commercial-grade ordering code with 108 user I/O pins (vs. XC3S100E-4TQG144C)
- Full 144-pin TQFP interface for multi-bus and multi-channel designs (vs. XC3S100E-5PQ144C)
- 657 MHz characterized maximum frequency (vs. XC3S100E-5TQG144C)
Designhinweise
Route the 144-pin TQFP with a layout that supports its 0.5 mm lead pitch and preserves continuous ground-plane return paths. Assign FPGA pins only after checking the package-specific pin-description table, including dedicated configuration, clock, power, and ground contacts. For high-speed or sensitive inputs, avoid long parallel routes beneath switching nodes and place the associated termination close to the receiving pin.
Use separate, low-impedance supply paths for the core and each required I/O bank, following the manufacturer's decoupling recommendations. Estimate the average and worst-case supply demand from the selected I/O state and configured logic rather than using the nominal 1.2 V core voltage alone. Provide local bulk and high-frequency decoupling at the package supply pins and validate startup sequencing, voltage tolerance, and power-source impedance in the final board design.
Create constraints for every clock, serial interface, and source-synchronous path, then confirm timing with the post-route report. The 657 MHz value is a characterized device-frequency reference, not a guaranteed operating frequency for every arbitrary logic path. Apply input buffers, output timing, and I/O-standard settings directly in the project so the implemented design reflects the physical pin roles and board-level loading assumptions.
Do not substitute a device merely because its logic-cell count and package lead count appear similar. Compare the exact ordering suffix, temperature grade, speed grade, configuration interface, bank supplies, and user I/O assignments. Also verify that the replacement bitstream is compatible with the selected device identifier and that unused pins are handled according to the family pin table. This avoids a mechanically compatible but functionally unsuitable substitution.
Compliance-Informationen
The device summary identifies a lead-free 144-pin package. Specific RoHS, REACH, AEC-Q100, halogen-free, and conflict-minerals statements require confirmation from the manufacturer's material or product documentation.
