XC3S1600E-5FGG320C - Spartan-3E FPGA 1.6M Gates | AMD/Xilinx
Teilenummer: XC3S1600E-5FGG320C ✗ Abgekündigt| Menge | Stückpreis | Gesamt |
|---|---|---|
| 1 | $255.64 | $255,64 |
| 10 | $242.86 | $2.428,60 |
| 100 | $230.08 | $23.008,00 |
| 500 | $217.29 | $108.645,00 |
| 1.000 | $204.51 | $204.510,00 |
XC3S1600E-5FGG320C Übersicht
An FPGA (Field-Programmable Gate Array) is a semiconductor device containing a fabric of configurable logic blocks (CLBs), embedded memory, and programmable interconnects that designers configure via a hardware description language such as Verilog or VHDL. Within the semiconductor hierarchy, an FPGA sits under programmable logic devices, alongside CPLDs and ASICs, and is used to implement custom digital logic without fabricating a custom chip.
Key features of the XC3S1600E include a large 1.6M-gate fabric for mid-density designs, 250 user I/Os supporting multiple I/O standards, Spartan-3E cost-optimized architecture, and availability of configuration via platform flash devices such as the XCF32P. The Spartan-3E family was widely adopted in telecommunications, industrial control, and consumer electronics, per Microchip USA product data.
Architecturally, the Spartan-3E fabric uses 4-input look-up tables (LUTs), dedicated carry logic, block RAM, and embedded multipliers, enabling DSP datapaths, glue logic consolidation, bus interfaces, and control sequencing on a single chip.
Typical applications include industrial control systems, telecommunications line cards, test equipment, motor control interfaces, and legacy system sustenance where a proven mid-density FPGA is already designed in.
Design consideration: this part is officially obsolete and no longer manufactured, per DigiKey lifecycle data, so new designs should evaluate AMD 7-series (Spartan-7, Artix-7) or cross-brand alternatives; existing designs should secure stock or a qualified migration path.
This page synthesizes distributor pricing, drop-in alternatives, lifecycle status, and practical design notes not consolidated in the manufacturer datasheet.
Drop-in-Alternativen für XC3S1600E-5FGG320C – gleiches Gehäuse, Pin-kompatibel. Bauteile mit anderem Gehäuse, die eine PCB-Überarbeitung erfordern, sind ausgeschlossen.
Schnellvergleichstool – Wählen Sie Alternativbauteile für den Direktvergleich:
XC3S1600E-4FGG320C
✅ Drop-In📋 Referenzalternative (nicht im Katalog)
XC3S1600E-4FG320C
✅ Drop-In📋 Referenzalternative (nicht im Katalog)
XC3S1600E-5FG320C
✅ Drop-In📋 Referenzalternative (nicht im Katalog)
XC3S1600E-4FG320I
✅ Drop-In📋 Referenzalternative (nicht im Katalog)
XC3S1600E-5FGG320C Grenzwerte & elektrische Eigenschaften
| Device Type | FPGA (Field Programmable Gate Array) |
| Family | Spartan-3E |
| System Gates | 1.6M |
| Logic Cells | 33192 |
| User I/O | 250 |
| Gehäuse | 320-Ball FBGA (FGG320, 19x19 mm) |
| Core Supply Voltage | 1.2 V (1.14 V to 1.26 V) |
| Process Technology | 90 nm CMOS |
| Speed Grade | -5 |
| Betriebs-Sperrschichttemperatur | 0C to +85C (commercial) |
| Montageart | Surface Mount |
| Lebenszyklusstatus | Obsolete - no longer manufactured (per DigiKey) |
XC3S1600E-5FGG320C 320-ball fbga (fgg320, 19x19 mm) Pinbelegungsleitfaden
Pinbelegung für XC3S1600E-5FGG320C (320-ball fbga (fgg320, 19x19 mm)-Gehäuse). Dieser digitale IC umfasst GPIO, Kommunikationsschnittstellen (UART, SPI, I2C) und Versorgungspins. Alternative Pin-Funktionen und Konfigurationsoptionen entnehmen Sie dem Herstellerdatenblatt. Unverzichtbar für Embedded-System-Design und PCB-Layout.
Keine detaillierten Pinbelegungsdaten verfügbar für XC3S1600E-5FGG320C.
Siehe die Datenblatt für die vollständige Pin-Konfiguration.
Typische Anwendungen
XC3S1600E-5FGG320C ist geeignet für 6 Anwendungs: Industrial Control Systems, Telecommunications Line Cards, Test and Measurement Equipment, Motor Control Interfaces, Legacy System Sustenance / EOL Replacement, Consumer Electronics Baseband Logic.
Industrial Control Systems
The XC3S1600E-5FGG320C fits industrial control platforms that need a mid-density programmable fabric for sequencer logic, fieldbus interfaces, and sensor aggregation. Its 33,192 logic cells and 250 user I/Os allow a single device to consolidate PLC glue logic, encoder counters, and safety interlock logic that would otherwise occupy several CPLDs and discrete devices. The 1.2V core with 90nm CMOS keeps static power manageable in always-on control cabinets, while the 0C to 85C commercial rating suits enclosed cabinets with controlled temperature. Used between backplane connectors and I/O transceivers, the FPGA provides flexible bank voltages and hot-configurable logic. For deployments outside commercial temperature, pair with the industrial XC3S1600E-4FG320I variant, which is a pin-compatible drop-in.
Empfohlen
Telecommunications Line Cards
Telecom line cards historically used the Spartan-3E family for framing, elastic buffers, and backplane interfacing, and the XC3S1600E-5FGG320C is the mid-density member for these designs. With 250 user I/Os in a 19x19 mm 320-ball FBGA, it supports dense per-bank I/O standards common in T1/E1 and legacy backplane environments, and the 1.6M-gate fabric implements multiple channels of framer logic plus embedded multipliers for line-rate DSP pre-processing. Embedded block RAM absorbs jitter-elasticity buffers without external SRAM. In sustaining designs, the same-footprint XC3S1600E-4FGG320C restores supply when -5 stock is exhausted, provided timing closes at -4. Configuration is typically loaded from Platform Flash (XCF32P) at power-up with a 2.5V auxiliary rail supervising the sequence.
Empfohlen
Test and Measurement Equipment
Bench and automated test instruments use the XC3S1600E-5FGG320C for pattern generation, timing control, and data capture between host processors and analog front ends. The fabric's dedicated carry chains and embedded multipliers implement counters, CRC engines, and digital filters at predictable timing, while 33,192 logic cells leave headroom for evolving test sequences delivered as updated bitstreams. The 250 I/Os interface ADCs, DACs, relay matrices, and USB/Ethernet bridge chips across multiple voltage banks. Because instruments typically operate in 0C to 85C ambient-controlled environments, the commercial temperature grade is appropriate. Designers should reserve a JTAG chain combining the FPGA and its Platform Flash for in-system updates, and verify -5 timing closure for any clock-domain-crossing logic above the family's stated fabric limits.
Empfohlen
Motor Control Interfaces
The XC3S1600E-5FGG320C implements multi-axis PWM generation, quadrature encoder decoding, and field-oriented control datapaths in motor drive interfaces. Embedded hardware multipliers execute the PI and park/clarke transform arithmetic each control cycle, while the block RAM holds commutation tables; 250 I/Os connect gate drivers, encoder inputs, and host communication in one device. The -5 speed grade provides timing margin for switching frequencies in the tens of kilohertz with sub-microsecond control-loop determinism, and the 1.2V core reduces dissipation in enclosed drive enclosures. Commercial-grade temperature suits enclosed drives; use the industrial XC3S1600E-4FG320I drop-in for -40C to +100C sites. Isolate the FPGA bank I/O from gate-driver transients with appropriate series resistors and verify bank voltage compliance in the DS312 DC characteristics.
Empfohlen
Legacy System Sustenance / EOL Replacement
A primary ongoing role for the XC3S1600E-5FGG320C is sustaining deployed systems designed around Spartan-3E: avionics test rigs, medical instrument backplanes, and factory automation controllers whose firmware and PCB cannot be redesigned. As AMD has marked the family obsolete, sourcing requires careful date-code and authenticity screening from trusted distributors and brokers. Drop-in candidates include the XC3S1600E-4FGG320C (same package, -4 speed) and the industrial XC3S1600E-4FG320I; both preserve the existing bitstream if timing closes at -4. Buyers should perform last-time-buy analysis now, verify JTAG configuration compatibility with existing Platform Flash devices, and plan a staged migration to 7-series FPGAs (Spartan-7/Artix-7) for the next hardware revision.
Empfohlen
Consumer Electronics Baseband Logic
Mid-2000s consumer platforms (set-top boxes, display controllers, kiosks) used the Spartan-3E XC3S1600E for bus bridging, display timing generation, and custom peripheral logic. The 90nm fabric with embedded multipliers handles video pipeline pre-processing, while 250 user I/Os bridge legacy interfaces (LVDS banks, parallel buses) to host processors. The 19x19 mm 320-ball FBGA fits dense two-sided consumer boards, and the 1.2V core supply reduced power against earlier 3.3V CPLD solutions. For repair and refurbishment of such hardware, the same-footprint XC3S1600E-5FG320C and -4FGG320C variants maintain supply. Designers servicing these products should re-verify configuration flash contents and use matched programming files, since bitstream formats are family-specific and not portable to newer AMD devices.
Empfohlen
Zusammenfassung der empfohlenen Produkte
Technische Referenzdaten für XC3S1600E-5FGG320C – Vergleich, Designhinweise und Compliance-Informationen.
Auswahlhilfe
Vergleich mit Alternativen
| Parameter | Dieses Produkt | XC3S1600E-4FGG320C | XC3S1600E-4FG320C | XC3S1600E-5FG320C | XC3S1600E-4FG320I |
|---|---|---|---|---|---|
| Package | 320-Ball FBGA (FGG320, 19x19 mm) | 320-Ball FBGA (FGG320) - same | 320-Ball FBGA (FG320) - same footprint | 320-Ball FBGA (FG320) - same footprint | 320-Ball FBGA (FG320) - same footprint |
| Brand | AMD (Xilinx) | AMD (Xilinx) | AMD (Xilinx) | AMD (Xilinx) | AMD (Xilinx) |
| System Gates | 1.6M | 1.6M | 1.6M | 1.6M | 1.6M |
| Logic Cells | 33192 | 33192 | 33192 | 33192 | 33192 |
| User I/O | 250 | 250 | 250 | 250 | 250 |
| Speed Grade | -5 | -4 (slower) | -4 (slower) | -5 (same) | -4 (slower) |
| Core Supply Voltage | 1.2 V (1.14-1.26 V) | 1.2 V (1.14-1.26 V) | 1.2 V (1.14-1.26 V) | 1.2 V (1.14-1.26 V) | 1.2 V (1.14-1.26 V) |
| Temperature Range | 0C to +85C (commercial) | 0C to +85C (commercial) | 0C to +85C (commercial) | 0C to +85C (commercial) | -40C to +100C (industrial) |
| Lifecycle Status | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete |
Wichtigste Unterscheidungsmerkmale
- Fastest commercial speed grade in the family (vs. XC3S1600E-4FGG320C)
- Identical 33,192 logic cells / 250 I/O across all drop-in variants (vs. XC3S1600E-4FG320I)
- Obsolete status drives supply risk, not technical inferiority (vs. XC3S1600E-5FG320C)
Designhinweise
The XC3S1600E-5FGG320C requires a 1.2V core rail regulated to 1.14V-1.26V plus auxiliary (2.5V) and I/O bank rails per Microchip USA data. Core current depends on toggle rate; perform power estimation with the Xilinx power tools using your actual design rather than assuming worst-case. Add bulk capacitance (e.g., 100 uF) plus distributed 0.1 uF ceramics at each VCC ball pair, and confirm power-up sequencing per the DS312 configuration module to avoid configuration failures.
The part is obsolete: any drop-in to speed grade -4 (XC3S1600E-4FGG320C or -4FG320I) must be re-verified for timing closure because -4 fabric and I/O timing is roughly 10% slower than -5. Re-run the timing analysis of your existing bitstream constraints before ordering. Also confirm the bitstream format matches the Spartan-3E family - bitstreams are not portable across FPGA generations, and the FG vs FGG ball-finish variants require the same bitstream but differ in ordering codes.
The 320-ball 19x19 mm FBGA uses approximately 0.8 mm ball pitch with fine-geometry escape routing; plan via-in-pad or dogbone escapes for the inner ball rows and follow IPC-recommended BGA land patterns. Group same-bank I/O by voltage standard to minimize bank count, and keep configuration pins (DIN, CCLK, DONE, PROG) routed with series termination per the DS312 pinout module. Reserve a JTAG header connecting the FPGA and its Platform Flash device for in-system updates.
Compliance-Informationen
Compliance data not present in verified web data; confirm RoHS/REACH status via AMD product pages before procurement.
