XC6SLX100-3FG676I - 101261-Cell Spartan-6 LX FPGA | AMD
Teilenummer: XC6SLX100-3FG676I ✓ AktivXC6SLX100-3FG676I Übersicht
A field-programmable gate array, or FPGA, is a programmable digital logic device that combines configurable logic blocks, programmable interconnect, block RAM, and digital input/output resources. Within the semiconductor hierarchy, an FPGA belongs to programmable-logic ICs and complements fixed-function logic, microcontrollers, and DSP devices. Spartan-6 devices are commonly used where parallel hardware processing, high I/O density, reconfigurable logic, or deterministic control are valuable.
Key features include 7,911 adaptive logic modules, 4,939,776 RAM bits, 480 I/O, and 101,261 logic cells according to the manufacturer product listing. The -3 grade identifies the highest-performance Spartan-6 LX speed option. The 676-BGA package provides a 27 mm by 27 mm body with a 1 mm ball pitch, supporting dense PCB routing while requiring careful escape-routing and thermal-design practices.
The XC6SLX100 combines a large programmable logic fabric with on-chip memory resources and a large pin count. This combination supports parallel image processing, control-plane aggregation, protocol bridging, test equipment, and embedded communications systems. Programming uses the AMD/Xilinx FPGA configuration flow, allowing logic, memory, and I/O behavior to be updated through a configuration bitstream after manufacturing.
Typical uses include industrial vision, high-speed data acquisition, communications infrastructure, instrumentation, embedded processing, and signal-processing subsystems. In each case, the 480-I/O count can reduce external multiplexing, while the large logic-cell and RAM resources permit multiple parallel pipelines. Designers should match external memory interfaces, clocking, and high-speed I/O requirements to the selected Spartan-6 architecture and board constraints.
A critical implementation consideration is that the 676-BGA footprint demands multilayer PCB construction, fine-pitch escape routing, and careful power and ground-plane management. Follow AMD's Spartan-6 package pinout files when assigning balls and verify the selected design's pin constraints against the exact device variant. Configuration startup, clocking, decoupling, and signal-integrity requirements must also be reviewed before fabrication.
This page organizes the verified device specifications, package details, same-footprint alternatives, comparison parameters, and practical design guidance for engineers evaluating the XC6SLX100-3FG676I. It also provides focused guidance for distinguishing speed-grade, temperature-grade, and device-density options before selecting a drop-in replacement.
Drop-in-Alternativen für XC6SLX100-3FG676I – gleiches Gehäuse, Pin-kompatibel. Bauteile mit anderem Gehäuse, die eine PCB-Überarbeitung erfordern, sind ausgeschlossen.
Varianten dieser Serie
Modelle derselben Serie, die drop-in-kompatibel sind mit XC6SLX100-3FG676I (gleiche Bauform und Footprint) – abweichend in Logic Cells, Mounting Type, Speed Grade, Ball Pitch, Core Supply Voltage.
XC6SLX100-3FGG676I
✅ Drop-In📋 Referenzalternative (nicht im Katalog)
XC6SLX100-3FGG676C
✅ Drop-In📋 Referenzalternative (nicht im Katalog)
XC6SLX100-2FG676I
✅ Drop-InPreis auf Anfrage
Datenblatt ansehen →XC6SLX100-2FGG676C
✅ Drop-InPreis auf Anfrage
Datenblatt ansehen →XC6SLX100T-3FG676I
✅ Drop-In📋 Referenzalternative (nicht im Katalog)
XC6SLX100-3FG676I Grenzwerte & elektrische Eigenschaften
| Device Type | Spartan-6 LX Field Programmable Gate Array |
| Logic Cells | 101,261 cells |
| Adaptive Logic Modules | 7,911 CLBs |
| Total RAM Bits | 4,939,776 bits |
| Maximum I/O | 480 I/O |
| Process Technology | 45 nm CMOS |
| Core Supply Voltage | 1.2 V nominal |
| Speed Grade | -3 performance grade |
| Temperature Grade | Industrial grade |
| Package Type | 676-ball BGA |
| Package Family | FBGA |
| Package Dimensions | 27 mm x 27 mm |
| Ball Pitch | 1 mm |
| Terminal Count | 676 terminals |
| Terminal Type | Ball |
| Montageart | Surface-mount BGA |
| Lead-Free Status | Lead-free package |
| RoHS-Status | Compliant |
| Maximum Internal Frequency | 862 MHz |
| Programming | AMD/Xilinx configuration bitstream |
XC6SLX100-3FG676I 27 mm x 27 mm Pinbelegungsleitfaden
Pinbelegung für XC6SLX100-3FG676I (27 mm x 27 mm-Gehäuse). Dieser digitale IC umfasst GPIO, Kommunikationsschnittstellen (UART, SPI, I2C) und Versorgungspins. Alternative Pin-Funktionen und Konfigurationsoptionen entnehmen Sie dem Herstellerdatenblatt. Unverzichtbar für Embedded-System-Design und PCB-Layout.
Keine detaillierten Pinbelegungsdaten verfügbar für XC6SLX100-3FG676I.
Siehe die Datenblatt für die vollständige Pin-Konfiguration.
Typische Anwendungen
XC6SLX100-3FG676I ist geeignet für 6 Anwendungs: Industrial Machine Vision, High-Speed Data Acquisition, Communications Infrastructure, Test and Measurement Instrumentation, Industrial Control and Automation, Embedded Signal Processing.
Industrial Machine Vision
The XC6SLX100-3FG676I is suitable for parallel image-processing systems that must capture, transform, and transfer multiple video streams. Its 101,261 logic cells and 7,911 adaptive logic modules can host parallel pixel pipelines, while 4,939,776 RAM bits support line buffers and frame-stage storage. The 480-I/O device reduces the need for external multiplexing around cameras and digital sensors. Use the -3 speed grade for timing-sensitive image processing and implement acquisition, exposure control, and data transmission as separate clocked pipelines.
Empfohlen
High-Speed Data Acquisition
The AMD XC6SLX100-3FG676I can support parallel ADC capture, digital filtering, and real-time analysis because it combines 480 I/O with 101,261 programmable logic cells. A practical design can use the programmable fabric to implement parallel converters, clock-domain crossing, digital filters, and a buffer interface to external memory. The -3 grade is the highest-performance Spartan-6 LX option, while the industrial temperature designation supports factory-floor environments. Interface timing, acquisition-clock jitter, and trace-length matching remain key constraints.
Empfohlen
Communications Infrastructure
The XC6SLX100-3FG676I is appropriate for communications equipment requiring parallel packet processing, high-speed I/O, and reconfigurable hardware. Its large logic fabric can implement protocol termination, lane alignment, scrambling, framing, and traffic classification, while the 4,939,776 RAM bits support packet buffering. The 480-I/O count is useful where multiple narrow interfaces must converge on a common fabric. A production design should use clocking resources appropriate to the selected -3 speed grade and verify each high-speed interface against the device characterization and board-level timing budget.
Empfohlen
Test and Measurement Instrumentation
The Spartan-6 LX fabric in the XC6SLX100-3FG676I can implement parallel stimulus generation, response capture, timing checks, and data reduction within one instrument. Its 101,261 logic cells and 480 I/O allow multiple instrument channels to share a common control architecture without implementing every function in fixed logic. The 4,939,776 RAM bits can buffer capture records and implement deeper sample histories. For precision analog measurement, pair the FPGA with dedicated converters and low-noise analog front ends, then constrain clocks and high-speed traces for repeatable acquisition.
Empfohlen
Industrial Control and Automation
The XC6SLX100-3FG676I can consolidate deterministic motion, sequencing, safety-adjacent monitoring, and communications logic in a single programmable device. Its large number of I/O is useful for connecting encoders, discrete sensors, actuators, and field buses, while the FPGA fabric supports concurrent state machines and parallel control tasks. The industrial temperature grade suits equipment operating beyond commercial environmental limits. Designers should partition real-time and safety functions according to system requirements and retain any required independent monitoring rather than relying solely on general-purpose programmable logic.
Empfohlen
Embedded Signal Processing
The XC6SLX100-3FG676I is suitable for parallel DSP, filtering, modulation, and spectral-processing systems because its configurable logic fabric can implement multiple arithmetic pipelines while on-chip RAM supports working storage. The -3 speed grade favors timing-critical pipelines, and 480 I/O provides substantial connectivity for parallel data sources and memory interfaces. Engineers can map fixed datapaths with the AMD/Xilinx FPGA toolchain and use block RAM for buffering. Power, clock distribution, and simultaneous-activity effects should be evaluated so that high utilization does not compromise timing or thermal performance.
Empfohlen
Zusammenfassung der empfohlenen Produkte
Technische Referenzdaten für XC6SLX100-3FG676I – Vergleich, Designhinweise und Compliance-Informationen.
Auswahlhilfe
Vergleich mit Alternativen
| Parameter | Dieses Produkt | XC6SLX100-3FGG676I | XC6SLX100-3FGG676C | XC6SLX100-2FG676I | XC6SLX100-2FGG676C | XC6SLX100T-3FG676I |
|---|---|---|---|---|---|---|
| Brand | AMD | AMD | AMD | AMD | AMD | AMD |
| Package | 676-BGA, 27 mm x 27 mm, 1 mm pitch | 676-BGA | 676-BGA | 676-BGA | 676-BGA | 676-BGA |
| Logic Cells | 101,261 cells | 101,261 cells | 101,261 cells | 101,261 cells | 101,261 cells | 101,261 cells |
| Adaptive Logic Modules | 7,911 CLBs | 7,911 CLBs | 7,911 CLBs | 7,911 CLBs | 7,911 CLBs | 7,911 CLBs |
| Total RAM Bits | 4,939,776 bits | 4,939,776 bits | 4,939,776 bits | 4,939,776 bits | 4,939,776 bits | 4,939,776 bits |
| Speed Grade | -3 | -3 | -3 | -2 | -2 | -3 |
| Temperature Grade | Industrial | Industrial | Commercial | Industrial | Commercial | Industrial |
| Process Technology | 45 nm CMOS | 45 nm CMOS | 45 nm CMOS | 45 nm CMOS | 45 nm CMOS | 45 nm CMOS |
| Family Variant | Spartan-6 LX | Spartan-6 LX | Spartan-6 LX | Spartan-6 LX | Spartan-6 LX | Spartan-6 LXT |
Wichtigste Unterscheidungsmerkmale
- Highest Spartan-6 LX speed class (vs. XC6SLX100-2FG676I)
- Industrial temperature qualification (vs. XC6SLX100-3FGG676C)
- Explicit 676-ball package identification (vs. XC6SLX100-2FG676I)
- Base LX configuration rather than enhanced LXT variant (vs. XC6SLX100T-3FG676I)
Designhinweise
Use the official AMD Spartan-6 package pinout file as the controlling source for every ball assignment. The 676-BGA package uses a 1 mm pitch, so the PCB footprint, solder-mask and paste layers, component spacing, and via-in-pad or escape-routing strategy must be reviewed together. Do not derive the footprint solely from a generic 676-ball library.
Apply the manufacturer's recommended decoupling and power-distribution topology for the selected Spartan-6 LX device. Separate clean core supply distribution from switching-supply return paths, use dense ground planes, and minimize loop area between supply and ground vias. Validate voltage tolerances, startup sequencing, and auxiliary-supply requirements against the exact ordering code before schematic release.
The -3 grade is the highest-performance Spartan-6 LX option, leaving less timing margin than lower speed grades. Constrain clock and high-speed interfaces appropriately, control skew through a deliberate clocking topology, and route sensitive nets over continuous reference planes. Re-run timing analysis after any PCB-level length adjustment or alternative device speed-grade change.
Do not treat XC6SLX100-2FG676I, XC6SLX100-2FGG676C, or XC6SLX100T-3FG676I as unconditional replacements. The first two reduce the speed grade, while the T variant changes the Spartan-6 family variant. Also distinguish the industrial I suffix from the commercial C suffix and verify the 676-ball ordering code before purchasing or releasing PCB artwork.
Compliance-Informationen
The comparison listings identify the device as RoHS compliant and use a lead-free package. No specific REACH, halogen-free, conflict-minerals, or automotive qualification declaration is included for this exact ordering code.