XC6SLX9-2CSG225I - 9152-Cell Spartan-6 FPGA | AMD
Teilenummer: XC6SLX9-2CSG225I ✓ Aktiv| Menge | Stückpreis | Gesamt |
|---|---|---|
| 1 | $7.3831 | $7,38 |
| 10 | $7.3831 | $73,83 |
| 100 | $7.3831 | $738,31 |
| 500 | $7.3831 | $3.691,55 |
| 1.000 | $7.3831 | $7.383,10 |
XC6SLX9-2CSG225I Übersicht
An FPGA is a semiconductor whose digital logic, interconnects, memory resources, and I/O behavior are configured after manufacture. The Spartan-6 family belongs to the FPGA and CPLD hierarchy and is commonly used where parallel logic, embedded block RAM, programmable interfaces, and deterministic control must be consolidated into one configurable device. Unlike a fixed-function microcontroller, this device does not execute software as its primary operating model; it implements a hardware circuit defined by a bitstream.
Verified listings report 160 I/O, 589,824 total RAM bits, 9,152 logic cells, and 715 CLBs. This resource mix makes the part suitable for control logic, protocol bridging, data acquisition, preprocessing, industrial automation, and embedded signal-processing systems. The -2 suffix denotes the device speed grade, while the I suffix identifies the industrial-grade ordering variant. Its CSPBGA-225 package measures 13 mm by 13 mm according to the supplied comparison data.
The XC6SLX9 device combines programmable logic with dedicated block RAM and user I/O in one package. Exact I/O standards, supported interfaces, pin functions, clocking limits, configuration requirements, and AC timing values are not provided in the verified excerpts and must therefore be confirmed against AMD documentation before schematic capture or PCB release. The package is a complex BGA device requiring careful escape routing and controlled assembly.
Typical installations include industrial controllers, sensor and measurement interfaces, communications equipment, video or imaging control, and compact embedded systems requiring deterministic parallel behavior. Designers should select I/O standards and voltage domains supported by the selected bank, preserve configuration access, validate pin assignments, and confirm timing against the design’s clock and interface requirements.
A critical integration concern is BGA layout quality: layer count, via strategy, solder-mask definition, pad-to-mask ratios, and assembly capability should be reviewed early because the CSPBGA-225 footprint is difficult to inspect visually after assembly. Use AMD’s package and pinout resources rather than inferring ball assignments from the commercial suffix.
This page consolidates verified distributor specifications, source availability, cross-reference findings, and engineering-oriented cautions that are not presented as one unified block in the original product snippets. It distinguishes confirmed values from missing technical data rather than estimating pinout, timing, or performance parameters.
Drop-in-Alternativen für XC6SLX9-2CSG225I – gleiches Gehäuse, Pin-kompatibel. Bauteile mit anderem Gehäuse, die eine PCB-Überarbeitung erfordern, sind ausgeschlossen.
Varianten dieser Serie
Modelle derselben Serie, die drop-in-kompatibel sind mit XC6SLX9-2CSG225I (gleiche Bauform und Footprint) – abweichend in Logic Cells, Package, RoHS Status.
Schnellvergleichstool – Wählen Sie Alternativbauteile für den Direktvergleich:
XC6SLX9-2CSG225C
✅ Drop-In✓ Auf Lager
$19.4 / Stück
Datenblatt ansehen →XC6SLX9-2CSG225I Grenzwerte & elektrische Eigenschaften
| Device Type | Spartan-6 LX FPGA |
| Logic Cells | 9,152 cells |
| Configurable Logic Blocks | 715 CLBs |
| Total RAM Bits | 589,824 bits |
| User I/O | 160 I/O |
| Betriebsversorgungsspannung | 1.14 V to 1.26 V |
| Speed Grade | -2 |
| Temperature Classification | Industrial grade |
| Gehäuse | 225-ball CSPBGA |
| Package Dimensions | 13 mm x 13 mm |
| Ball Pitch | 0.8 mm |
| Process Technology | CMOS |
| Manufacturer Pack Quantity | 160 units |
| Moisture Sensitivity Level | MSL 3, 168 hours |
| Montageart | Surface mount |
| Lead-Free Status | Lead free |
| RoHS-Status | RoHS compliant |
XC6SLX9-2CSG225I 13 mm x 13 mm Pinbelegungsleitfaden
Pinbelegung für XC6SLX9-2CSG225I (13 mm x 13 mm-Gehäuse). Dieser digitale IC umfasst GPIO, Kommunikationsschnittstellen (UART, SPI, I2C) und Versorgungspins. Alternative Pin-Funktionen und Konfigurationsoptionen entnehmen Sie dem Herstellerdatenblatt. Unverzichtbar für Embedded-System-Design und PCB-Layout.
Keine detaillierten Pinbelegungsdaten verfügbar für XC6SLX9-2CSG225I.
Siehe die Datenblatt für die vollständige Pin-Konfiguration.
Typische Anwendungen
XC6SLX9-2CSG225I ist geeignet für 6 Anwendungs: Industrial Control and Automation, Sensor and Measurement Data Acquisition, Communications Protocol Bridging, Video and Imaging Control, Test and Measurement Front Ends, Embedded Signal Preprocessing.
Industrial Control and Automation
XC6SLX9-2CSG225I fits compact machine-control logic where deterministic parallel processing is more useful than software-loop flexibility. Its verified 9,152 logic cells, 715 CLBs, and 160 I/O provide resources for sequencing, interlocks, signal conditioning, and multiple field-bus interfaces. The industrial-grade ordering suffix supports an industrial design direction, although the exact I-grade temperature limits must be confirmed in AMD documentation. Place the FPGA beside the controlled power and interface circuitry, assign each bank to a supported voltage, and validate timing against the worst-case clock and I/O conditions. The 225-ball CSPBGA also requires an assembly process capable of handling its 0.8 mm pitch.
Empfohlen
Sensor and Measurement Data Acquisition
The FPGA can consolidate parallel sampling, filtering, calibration, and packet formatting in one programmable device. With 589,824 RAM bits and 9,152 logic cells, XC6SLX9-2CSG225I offers more hardware-side flexibility than a fixed pipeline and allows acquisition logic to change through bitstream updates. Its 160 I/O can connect digital sensors, counters, triggers, and status signals, while supported I/O standards must be matched bank by bank. Engineers should define timing constraints for each clock domain, budget interface timing, and avoid inferring analog capability from the digital I/O count. Power, ground, and high-speed return paths should be planned together to keep switching noise away from sensitive measurement circuits.
Empfohlen
Communications Protocol Bridging
XC6SLX9-2CSG225I is suitable for protocol conversion, framing, buffering, and interface timing compensation in embedded communications equipment. The verified 589,824 RAM bits can support packet buffering, while 160 I/O and 9,152 logic cells allow parallel and serial interface blocks to coexist. A practical implementation assigns clocks, serial transceivers, and enable or reset signals to suitable banks, then applies static timing constraints for every clock domain. The -2 suffix identifies a defined speed grade, but the supplied excerpts do not provide maximum transceiver or I/O timing values; those must be established from the official AMD data. Firmware and HDL changes may still be needed even when the PCB footprint matches.
Empfohlen
Video and Imaging Control
The Spartan-6 LX device can implement pixel timing, interface deinterlacing, overlay generation, and preprocessing before a processor performs higher-level image work. The verified 160 I/O count is useful for parallel or multiplexed camera and display interfaces, while 9,152 logic cells and 589,824 RAM bits provide configurable pipeline and line-buffer resources. Bank voltage and supported interface standards must be checked before connecting a sensor or display. Timing closure depends on the actual pixel clock and source synchronization method, neither of which is provided in the verified excerpts. Keep video traces length-matched where required, provide continuous clean clocking, and verify the CSPBGA escape-routing stack-up before fabrication.
Empfohlen
Test and Measurement Front Ends
XC6SLX9-2CSG225I can implement sequencing, trigger correlation, pattern generation, and acquisition control for a programmable test front end. Its configurable logic replaces rigid interconnections among counters, registers, and interface controllers, while its RAM supports temporary result and trace storage. The verified 160 I/O permits multiple instrument-control and trigger signals, subject to bank-level electrical limits. For high-precision measurements, separate analog or sensitive signal paths from FPGA switching activity and use controlled clock distribution. Because the supplied source does not state differential-I/O rates, clock specifications, or supported standards, engineers must verify them in the manufacturer documentation before committing to an acquisition architecture.
Empfohlen
Embedded Signal Preprocessing
XC6SLX9-2CSG225I can execute fixed-function filtering, decimation, correlation, feature extraction, or data conditioning ahead of a processor. The verified 715 CLBs and 589,824 RAM bits make parallel pipelines practical, while programmable connectivity helps connect multiple stages without a fixed datapath. Engineers should partition the design into independently timed clock domains, add pipeline registers where required by timing analysis, and document resource utilization against the 9,152-cell capacity. The supplied excerpts do not provide DSP slice counts, block-RAM organization, or clock maximums, so arithmetic throughput and memory mapping must be confirmed from AMD resources. Use registered boundaries and disciplined clocking to prevent data-dependent timing failures in the surrounding digital system.
Empfohlen
Zusammenfassung der empfohlenen Produkte
Technische Referenzdaten für XC6SLX9-2CSG225I – Vergleich, Designhinweise und Compliance-Informationen.
Auswahlhilfe
Vergleich mit Alternativen
| Parameter | Dieses Produkt | XC6SLX9-2CSG225C |
|---|---|---|
| Brand | AMD | AMD |
| Package | 225-ball CSPBGA | CSBGA-225 — same package class |
| Logic Cells | 9,152 cells | 9,152 cells |
| Configurable Logic Blocks | 715 CLBs | 715 CLBs |
| Total RAM Bits | 589,824 bits | 589,824 bits |
| Operating Supply Voltage | 1.14 V to 1.26 V | 1.14 V to 1.26 V |
| Speed Grade | -2 | -2 |
| Temperature Classification | Industrial-grade I suffix | Commercial C suffix; listed 0°C to 85°C junction temperature |
| Package Dimensions | 13 mm x 13 mm | 13 mm x 13 mm |
Wichtigste Unterscheidungsmerkmale
- Industrial-grade ordering designation (vs. XC6SLX9-2CSG225C)
- Confirmed core-resource parity (vs. XC6SLX9-2CSG225C)
- Established CSG225 package integration (vs. XC6SLX9-2CSG225C)
Designhinweise
AMD lists Spartan-6 package device pinout files as ASCII resources. Use those files with the exact XC6SLX9 device and CSG225 package rather than reconstructing ball assignments from a generic Spartan-6 schematic. The verified package is 13 mm by 13 mm with 0.8 mm pitch, so escape routing, via-in-pad policy, pad and mask dimensions, and assembly capability should be reviewed before schematic release. A footprint that appears electrically similar can still be mechanically unsuitable for the selected assembly process.
The verified core-supply range is 1.14 V to 1.26 V, but the supplied excerpts do not identify every supply rail, regulator tolerance, sequencing rule, or current budget. Determine those values from the AMD device documentation and the selected design’s utilization before choosing power components. Decouple each required rail according to the manufacturer guidance, preserve current-return continuity, and avoid routing noisy switching-regulator paths through sensitive FPGA areas. Do not infer a complete power tree from the single listed voltage range.
The FPGA has 160 I/O, but supported standards and timing limits are not supplied in the verified excerpts. Assign banks according to voltage and interface requirements, then constrain every clock and interface path in the implementation tools. Use controlled-impedance routing, continuous reference planes, and appropriate return paths for high-speed signals. Review source-synchronous interfaces, clock jitter, and pin changes only after obtaining the official package and timing information.
The -2 suffix is a speed grade, and the I suffix is a temperature-grade ordering designation; neither should be ignored during substitution. XC6SLX9-2CSG225C has the same verified core resources and package class but is listed only from 0°C to 85°C junction temperature, making it unsuitable as an automatic replacement for every industrial application. XC6SLX9-3CSG225I changes the speed class. Validate the full ordering code, timing, thermal environment, configuration, and qualification before any board swap.
Compliance-Informationen
The verified component listing reports lead-free and RoHS-compliant status. REACH, automotive qualification, halogen-free, and conflict-minerals information were not supplied and remain unknown.
