XC7A15T-1CSG324C - 16.6K Logic Cell Artix-7 FPGA | AMD
Teilenummer: XC7A15T-1CSG324C ✓ AktivXC7A15T-1CSG324C Übersicht
An FPGA is a reconfigurable digital semiconductor containing programmable logic blocks, block RAM, digital signal processing resources, and programmable I/O. Artix-7 FPGAs occupy the low-power and cost-sensitive level of the AMD FPGA hierarchy, combining programmable hardware with serial transceiver, DSP, and general-purpose logic throughput. The XC7A15T therefore serves as a compact hardware platform for parallel data acquisition, protocol conversion, control, and embedded signal-processing functions.
The XC7A15T-1CSG324C provides 1,300 configurable logic blocks, 900 KB of block RAM, 210 I/Os, and integrated DSP resources. Its nominal 1 V core supply allows implementation on a 0.95 V to 1.05 V power rail. MMCM and PLL resources support clock generation and management, while the high I/O count permits interfaces to external memory, converters, network transceivers, and industrial peripherals.
The device combines configurable logic with dedicated hard resources for high-throughput digital processing. Block RAM can buffer sampled data or store lookup tables, while DSP slices accelerate multiply-and-accumulate operations commonly required by filtering and waveform transformations. The -1 performance designation establishes the device's timing class; implementation timing must still be checked against the selected AMD toolchain, pin constraints, clocking plan, and system-level I/O timing requirements.
Typical uses include industrial automation, machine-vision image processing, communications protocol bridging, low-cost test equipment, and embedded real-time signal processing. Its 210-I/O footprint is especially useful when a design requires numerous parallel connections while retaining programmable logic and DSP capability in one device.
Board design should follow the AMD Artix-7 package pinout files and UG475 guidance, particularly for power, ground, configuration, clock, and high-speed I/O connections. Decoupling, signal-integrity checks, thermal planning, configuration-interface design, and bank-specific voltage constraints should be completed before layout release.
This page combines manufacturer and distributor data with the supplied cross-reference results to summarize device identity, procurement considerations, verified alternatives, and practical FPGA design guidance. The listed LCSC price is a product-page reference rather than a guaranteed quotation, so availability and volume pricing should be reconfirmed before purchase.
Drop-in-Alternativen für XC7A15T-1CSG324C – gleiches Gehäuse, Pin-kompatibel. Bauteile mit anderem Gehäuse, die eine PCB-Überarbeitung erfordern, sind ausgeschlossen.
Varianten dieser Serie
Modelle derselben Serie, die drop-in-kompatibel sind mit XC7A15T-1CSG324C (gleiche Bauform und Footprint) – abweichend in Logic Cells, Mounting Type, Operating Temperature Range, Package.
XC7A15T-1CSG324I
✅ Drop-InPreis auf Anfrage
Datenblatt ansehen →XC7A15T-2CSG324C
✅ Drop-In ⚠️ Spezifikationen ungeprüft📋 Referenzalternative (nicht im Katalog)
XC7A15T-2CSG324I
✅ Drop-In ⚠️ Spezifikationen ungeprüft📋 Referenzalternative (nicht im Katalog)
XC7A15T-1CSG324E
✅ Drop-In ⚠️ Spezifikationen ungeprüft📋 Referenzalternative (nicht im Katalog)
XC7A15T-2CSG324E
✅ Drop-In ⚠️ Spezifikationen ungeprüft📋 Referenzalternative (nicht im Katalog)
XC7A15T-1CSG324C Grenzwerte & elektrische Eigenschaften
| Product Type | Artix-7 field-programmable gate array (FPGA) |
| Logic Cells | 16,640 cells |
| Configurable Logic Blocks | 1,300 CLBs |
| User I/O | 210 I/Os |
| Block RAM | 900 KB |
| Maximum Data Rate | 1.464 Gb/s |
| Maximum Operating Frequency | 464 MHz |
| Core Supply Voltage Range | 0.95 V to 1.05 V |
| Nominal Core Supply Voltage | 1 V |
| Process Technology | 28 nm |
| DSP Resources | Integrated DSP slices |
| Clock Management | MMCM and PLL resources |
| Gehäuse | 324-ball CSPBGA, 15 mm x 15 mm |
| Terminal Count | 324 terminals |
| Betriebstemperaturbereich | 0 °C to 85 °C |
| Montageart | Surface-mount chip-scale BGA |
XC7A15T-1CSG324C 324-ball cspbga, 15 mm x 15 mm Pinbelegungsleitfaden
Pinbelegung für XC7A15T-1CSG324C (324-ball cspbga, 15 mm x 15 mm-Gehäuse). Dieser digitale IC umfasst GPIO, Kommunikationsschnittstellen (UART, SPI, I2C) und Versorgungspins. Alternative Pin-Funktionen und Konfigurationsoptionen entnehmen Sie dem Herstellerdatenblatt. Unverzichtbar für Embedded-System-Design und PCB-Layout.
Keine detaillierten Pinbelegungsdaten verfügbar für XC7A15T-1CSG324C.
Siehe die Datenblatt für die vollständige Pin-Konfiguration.
Typische Anwendungen
XC7A15T-1CSG324C ist geeignet für 6 Anwendungs: Industrial Automation and Control, Machine Vision Image Processing, Communications Protocol Bridging, Data Acquisition and Test Equipment, Embedded Real-Time Signal Processing, Programmable Logic and Custom Acceleration.
Industrial Automation and Control
The XC7A15T-1CSG324C fits industrial control designs that need programmable logic, numerous digital connections, and compact hardware integration. Its 16,640 logic cells and 210 I/Os can support sequencing logic, machine interlocks, status aggregation, counters, and communication logic while the 900 KB of block RAM supports buffered data and parameter storage. The 324-ball CSPBGA occupies a 15 mm by 15 mm footprint, helping reduce board area when the design also needs MMCM, PLL, and DSP resources. Commercial-grade operation is listed as 0 °C to 85 °C, so the enclosure thermal design must stay inside that range. An industrial system needing wider temperature coverage should evaluate the documented -I ordering option and verify its complete electrical and qualification requirements before replacing the target.
Empfohlen
Machine Vision Image Processing
The XC7A15T-1CSG324C can implement machine-vision preprocessing and pixel-stream management where parallel data throughput and programmable logic are more important than a large general-purpose processor. The 210-I/O interface can connect camera or image-sensor data interfaces, while 900 KB of block RAM provides line buffers, lookup tables, and working storage. Integrated DSP resources are suitable for multiply-and-accumulate operations used in filtering and pixel transformations. Its 28 nm Artix-7 implementation combines this processing capability with low-power and cost-sensitive positioning. Engineers should use the AMD pinout files to assign the correct high-speed banks, and should validate timing against the selected image sensor's clocking and data-valid requirements rather than treating the listed 464 MHz maximum as a guaranteed system-level throughput.
Empfohlen
Communications Protocol Bridging
XC7A15T-1CSG324C is suitable for protocol conversion and link adaptation between systems using different data formats. Programmable logic can bridge parallel and serial interfaces, maintain frame and packet boundaries, and implement state machines, while 210 I/Os provide substantial connectivity to transceivers and processors. The 900 KB of block RAM can absorb short buffering bursts and support descriptor or lookup storage. Its MMCM and PLL resources assist with clock generation where the system requires a defined relationship between an incoming reference and an outgoing interface. Practical implementations should include reset synchronization, clock-domain crossing, and protocol-specific error handling. The supplied results identify protocol bridging as a target application, but they do not specify individual transceiver lane ratings, so those interfaces must be validated against the selected Artix-7 I/O and clocking documentation.
Empfohlen
Data Acquisition and Test Equipment
The XC7A15T-1CSG324C can serve as the digital control and data-acquisition fabric in compact test and measurement equipment. Its 210 I/Os support parallel sensors, status lines, triggers, displays, and interface converters, while the DSP resources and block RAM support sample buffering and digital signal transformations. The 324-ball CSPBGA makes the device practical for instruments where several acquisition channels, timing logic, and a communications interface must coexist in a compact board area. Engineers should partition acquisition, processing, and communication into distinct clock domains and use the MMCM or PLL resources according to the AMD clocking methodology. The commercial-grade 0 °C to 85 °C listing also requires thermal-margin planning in enclosed instruments. Final timing closure must include board-level clock jitter, external converter latency, and trigger-path skew.
Empfohlen
Embedded Real-Time Signal Processing
The XC7A15T-1CSG324C supports embedded real-time filtering and waveform-processing designs that need deterministic programmable logic without a separate processor for every data path. Dedicated DSP slices can perform multiply-and-accumulate operations, while 900 KB of block RAM can support circular buffers, sample histories, and coefficient storage. The 464 MHz maximum operating frequency identified for this -1 grade provides a timing basis for initial architecture studies, though final performance depends on routing, clocking, and design complexity. A practical implementation should pipeline data operations to avoid long combinational paths, constrain clock-related paths correctly, and test worst-case timing after all modules are placed. Because the exact DSP-slice count is not present in the retrieved snippets, resource budgeting should use the current AMD device data rather than relying on the general 16,640-logic-cell figure.
Empfohlen
Programmable Logic and Custom Acceleration
The XC7A15T-1CSG324C is appropriate for custom hardware accelerators that combine parallel datapaths, local memory, and board-level control in one FPGA. Its 1,300 configurable logic blocks provide the stated structural basis for datapath construction, and the integrated DSP, block RAM, MMCM, and PLL resources avoid requiring separate implementation blocks for common real-time functions. The 210-I/O count allows acceleration logic to sit close to external data sources and destinations, reducing board-level traffic when the physical design supports short routing. Engineers should partition the accelerator into independently timed clock domains, add pipeline registers at module boundaries, and preserve deterministic interfaces between reusable cores. Because this device is identified as cost-sensitive and power-efficient, utilization and power results from the selected toolchain should be checked after synthesis and implementation rather than estimated from nominal device counts.
Empfohlen
Zusammenfassung der empfohlenen Produkte
Technische Referenzdaten für XC7A15T-1CSG324C – Vergleich, Designhinweise und Compliance-Informationen.
Auswahlhilfe
Vergleich mit Alternativen
| Parameter | Dieses Produkt | XC7A15T-1CSG324I | XC7A15T-2CSG324C | XC7A15T-2CSG324I | XC7A15T-1CSG324E | XC7A15T-2CSG324E |
|---|---|---|---|---|---|---|
| Package | 324-ball CSPBGA, 15 mm x 15 mm | 324-ball CSPBGA, 15 mm x 15 mm | 324-ball CSPBGA, 15 mm x 15 mm | 324-ball CSPBGA, 15 mm x 15 mm | 324-ball CSPBGA, 15 mm x 15 mm | 324-ball CSPBGA, 15 mm x 15 mm |
| Brand | AMD | AMD | AMD | AMD | AMD | AMD |
| Speed Designation | -1 | -1 | -2 | -2 | -1 | -2 |
| Ordering Grade | C | I | C | I | E | E |
Wichtigste Unterscheidungsmerkmale
- Provides a verified direct distributor reference (vs. XC7A15T-1CSG324I)
- Combines compact packaging with extensive connectivity (vs. XC7A15T-2CSG324C)
- Integrates programmable logic, memory, DSP, and clock management (vs. XC7A15T-2CSG324E)
Designhinweise
Design the core rail around the verified 0.95 V to 1.05 V range and 1 V nominal condition, but determine the exact source impedance, transient response, and decoupling network from the AMD datasheet for the selected Artix-7 device. I/O banks may require separate supplies according to the chosen standards. Keep sensitive reference and clock connections short, and validate power sequencing and startup behavior against the configuration requirements rather than relying on the core voltage alone.
Use AMD's official Artix-7 package pinout files and UG475 for all 324 ball assignments. Preserve the BGA escape-routing geometry, place decoupling capacitance close to the relevant power balls, and provide a low-impedance ground reference under the device. Because the package is only 15 mm by 15 mm but contains 324 terminals, inspect the completed PCB stack-up for via density, ball-to-ball clearance, assembly capability, and X-ray inspection requirements before fabrication.
Assign high-speed interfaces to banks whose voltage and I/O standards support them, and check both chip-edge and board-level timing. For clocked interfaces, constrain source and destination registers, budget external jitter and skew, and avoid routing clocks adjacent to high-agility switching nets. The stated 464 MHz maximum frequency is a device-level reference and does not guarantee that every 324-ball design will close timing at that frequency.
Do not treat same-package suffix variants as unconditional replacements. A change in speed designation can alter timing closure, while a change in ordering suffix can alter temperature range or qualification requirements. Generate the appropriate bitstream, rerun synthesis and implementation, verify all pin constraints, and compare configuration behavior and power estimates. Also do not use the 16,640-logic-cell headline value as a substitute for a resource report when DSP or block-RAM utilization drives the design.
Compliance-Informationen
The supplied verified data does not explicitly state RoHS, REACH, AEC-Q100, lead-free, halogen-free, or conflict-minerals status. No compliance claim was inferred from the package or ordering code.
