XC7A35T-1FT256I - 33,280-Cell Artix-7 FPGA | AMD
Teilenummer: XC7A35T-1FT256I ✓ Aktiv| Menge | Stückpreis | Gesamt |
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| 1 | $0 | $0,00 |
| 10 | $0 | $0,00 |
| 100 | $0 | $0,00 |
| 500 | $0 | $0,00 |
| 1.000 | $0 | $0,00 |
XC7A35T-1FT256I Übersicht
An FPGA is a programmable digital integrated circuit in the semiconductor family of configurable logic devices. Artix-7 combines programmable logic fabric, block RAM, DSP resources, programmable I/O, and high-speed serial transceivers on one device. This hierarchy—Artix-7 → FPGA → programmable logic device → semiconductor—supports parallel logic, control, signal-processing, communications, and embedded-system designs without changing the physical device for a new bitstream.
Key verified features include 33,280 logic cells, 170 I/O, 90 DSP slices, 1,800 Kb of block RAM, 28 nm technology, and a 1 V supply designation. The Artix-7 family is suited to compact industrial, communications, instrumentation, embedded control, and digital signal-processing systems. The verified snippets do not provide complete operating-temperature, transceiver, power, package-ball, and lifecycle details, so those values are not inferred here.
The part number suffix identifies the important ordering configuration. The verified data identifies XC7A35T as the device family and the 1FT256I ordering code as the target MPN, while comparison data also identifies FTG256 package variants. Engineering equivalence must therefore be confirmed against the AMD package pinout files and UG475 rather than inferred from family naming alone.
Typical applications include industrial control, communications, embedded processing, instrumentation, and DSP-assisted logic designs. In each case, the FPGA can implement parallel datapaths and control functions while using its block RAM for buffering and its DSP slices for arithmetic. The design should also account for configuration memory, clocking, banked supply rails, decoupling, signal integrity, thermal management, and programming support.
For PCB implementation, place decoupling and configuration-support circuitry according to the verified AMD package data, maintain the required power and ground distribution, and route high-speed signals with controlled impedance and return paths. Do not substitute an XC7A35T variant solely because it has the same family name; verify package, speed grade, temperature grade, voltage options, pin compatibility, and the complete device identifier.
This page combines the verified distributor identity, package and resource information, source links, and explicit data gaps to support engineering selection. It does not invent missing electrical limits, pricing, lifecycle claims, or pin assignments.
Drop-in-Alternativen für XC7A35T-1FT256I – gleiches Gehäuse, Pin-kompatibel. Bauteile mit anderem Gehäuse, die eine PCB-Überarbeitung erfordern, sind ausgeschlossen.
Varianten dieser Serie
Modelle derselben Serie, die drop-in-kompatibel sind mit XC7A35T-1FT256I (gleiche Bauform und Footprint) – abweichend in Block RAM, Mounting Type, Package, Speed Grade, Temperature Grade.
Schnellvergleichstool – Wählen Sie Alternativbauteile für den Direktvergleich:
XC7A35T-1FTG256I
✅ Drop-In📋 Referenzalternative (nicht im Katalog)
XC7A35T-2FTG256C
✅ Drop-In📋 Referenzalternative (nicht im Katalog)
XC7A35T-2FTG256I
✅ Drop-In✓ Auf Lager
$31.1719 / Stück
Datenblatt ansehen →XC7A35T-3FTG256E
✅ Drop-In📋 Referenzalternative (nicht im Katalog)
XC7A50T-1FTG256C
✅ Drop-In📋 Referenzalternative (nicht im Katalog)
XC7A35T-1FT256I Grenzwerte & elektrische Eigenschaften
| Device Type | Artix-7 FPGA |
| Logic Cells | 33,280 |
| User I/O | 170 |
| DSP Slices | 90 |
| Block RAM | 1,800 Kb |
| Process Technology | 28 nm |
| Nominal Supply Voltage | 1 V |
| Gehäuse | 256-ball FTBGA / 256-LBGA |
| Speed Grade | -1 |
| Temperature Grade | Industrial |
| Montageart | Surface Mount |
| Supplier Identification | 170 I/O; 33,280 logic cells; 256-LBGA |
XC7A35T-1FT256I 256-ball ftbga / 256-lbga Pinbelegungsleitfaden
Pinbelegung für XC7A35T-1FT256I (256-ball ftbga / 256-lbga-Gehäuse). Dieser digitale IC umfasst GPIO, Kommunikationsschnittstellen (UART, SPI, I2C) und Versorgungspins. Alternative Pin-Funktionen und Konfigurationsoptionen entnehmen Sie dem Herstellerdatenblatt. Unverzichtbar für Embedded-System-Design und PCB-Layout.
Keine detaillierten Pinbelegungsdaten verfügbar für XC7A35T-1FT256I.
Siehe die Datenblatt für die vollständige Pin-Konfiguration.
Typische Anwendungen
XC7A35T-1FT256I ist geeignet für 6 Anwendungs: Industrial Control Logic, Communications Interface, Embedded Signal Processing, Instrumentation and Data Acquisition, Industrial Networking Gateway, Embedded Processor Subsystem.
Industrial Control Logic
The XC7A35T-1FT256I fits industrial control logic where parallel decision paths, timers, state machines, and interface coordination are required. Its verified 33,280 logic cells provide implementation space for control logic, while 90 DSP slices can accelerate selected arithmetic and filtering functions. The 170 I/O support connections to sensors, actuators, communication transceivers, and status interfaces. In a controller, the FPGA can execute deterministic sequencing and combine multiple peripheral functions without relying on several discrete logic devices. Because the supplied data does not state the full operating-temperature range or power limits, the final design must verify environmental and electrical requirements against the official AMD documentation.
Empfohlen
Communications Interface
XC7A35T-1FT256I is suitable for communications interface and protocol-handling designs that require deterministic parallel logic and programmable I/O. The verified 170 I/O can be allocated to data buses, control signals, clocks, and status lines, while the 33,280-cell fabric can implement framing, filtering, buffering, and state management. Its 1,800 Kb of block RAM is useful for packet storage, dual-clock transfer, or lookup data when the exact memory architecture is confirmed. Compared with a fixed-function interface IC, the FPGA permits protocol changes after configuration. The design must still validate transceiver pin compatibility, voltage domains, timing closure, and high-speed signal integrity; those details are not fully specified in the provided snippets.
Empfohlen
Embedded Signal Processing
The FPGA's verified 90 DSP slices and 33,280 logic cells make XC7A35T-1FT256I relevant to embedded signal-processing blocks such as filtering, modulation, correlation, and fixed-point arithmetic. The DSP resources can execute parallel multiply-accumulate operations, while programmable logic handles control, address generation, buffering, and data-format conversion. The 1,800 Kb of block RAM provides on-chip storage for samples or intermediate results when the selected memory configuration supports the intended data width. Designers should use vendor timing and power tools for the actual clock rate and utilization, because the verified data does not include maximum operating frequency, power consumption, or resource-specific performance figures.
Empfohlen
Instrumentation and Data Acquisition
XC7A35T-1FT256I can be used in instrumentation systems that coordinate acquisition, digital filtering, calibration, and data transfer. The 170 I/O provide parallel connectivity to converters, clocks, triggers, and control registers, while the programmable logic fabric can implement trigger logic, channel sequencing, and digital correction. Its DSP slices can reduce processor load for common filtering and arithmetic operations. The 1,800 Kb block RAM may support local sample buffering, but the design must verify the exact block-RAM organization and required clock domains. For laboratory or industrial equipment, validate input tolerances, isolation, grounding, thermal performance, and calibration strategy; those application-specific requirements are not included in the verified snippets.
Empfohlen
Industrial Networking Gateway
The XC7A35T-1FT256I fits gateway designs that translate between industrial and embedded communication interfaces. Its programmable logic can implement protocol conversion, buffering, filtering, and timing adaptation across multiple I/O banks, while block RAM can hold local message or data queues. The verified resource profile—33,280 logic cells, 170 I/O, 90 DSP slices, and 1,800 Kb block RAM—provides a useful capacity baseline, but it does not establish throughput or packet-rate limits. Engineering validation must include transceiver selection, isolation requirements, clock-domain crossing, packet-loss behavior, and system reset sequencing. The -1 and I ordering suffixes must be checked against the production environmental requirement.
Empfohlen
Embedded Processor Subsystem
XC7A35T-1FT256I is relevant to FPGA-based embedded systems that combine programmable logic with external processors or dedicated controllers. The logic fabric can implement peripherals, accelerators, memory interfaces, and deterministic control around the processor, while the DSP slices support arithmetic-heavy functions and block RAM provides local data storage. The verified data does not state whether the target configuration includes a hard processor block or identify the exact memory interface, so those capabilities must be confirmed from the official device documentation. Use the AMD toolchain to validate processor, memory, interrupt, and peripheral compatibility before committing the design.
Empfohlen
Zusammenfassung der empfohlenen Produkte
Technische Referenzdaten für XC7A35T-1FT256I – Vergleich, Designhinweise und Compliance-Informationen.
Auswahlhilfe
Vergleich mit Alternativen
| Parameter | Dieses Produkt | XC7A35T-1FTG256I | XC7A35T-2FTG256C | XC7A35T-2FTG256I | XC7A35T-3FTG256E | XC7A50T-1FTG256C |
|---|---|---|---|---|---|---|
| Package | 256-ball FTBGA / 256-LBGA | 256-ball FTBGA / 256-LBGA family; exact suffix differs | 256-ball FTBGA / 256-LBGA family; exact suffix differs | 256-ball FTBGA / 256-LBGA family; exact suffix differs | 256-ball FTBGA / 256-LBGA family; exact suffix differs | Related Artix-7 256-pin BGA family; density differs |
| Brand | AMD | AMD | AMD | AMD | AMD | AMD |
| Device Family | Artix-7 | Artix-7 | Artix-7 | Artix-7 | Artix-7 | Artix-7 |
| Speed Grade | -1 | -1 | -2 | -2 | -3 | -1 |
| Temperature Suffix | I | I | C | I | E | C |
Wichtigste Unterscheidungsmerkmale
- Target resource profile (vs. XC7A35T-1FTG256I)
- Ordering-grade differentiation (vs. XC7A35T-2FTG256C)
- Family consistency (vs. XC7A35T-2FTG256I)
Designhinweise
Do not reuse an FTG256 layout for XC7A35T-1FT256I without checking the AMD package pinout files. The verified distributor description confirms a 256-ball/LBGA class package, but the supplied results do not provide a complete verified FT256I ball map. Compare power balls, ground balls, configuration pins, I/O standards, and exposed or thermal-related connections before routing. Use the exact package drawing and pinout files referenced by AMD rather than deriving assignments from similar order codes.
Plan the power tree around the 1 V nominal supply designation, while confirming the actual VCCINT, VCCAUX, VCCBRAM, VCCO, configuration, and other required rails from the official datasheet. Decoupling must be placed directly at the relevant supply and ground balls, with return-current paths kept continuous. Because the verified snippets do not specify current limits, startup sequencing, power sequencing, or rail tolerances, those values must be obtained from the AMD datasheet before schematic release.
Assign I/O standards by bank and verify every external interface against the target device's pin-specific constraints. For high-speed links, use controlled-length routing, continuous reference planes, proper terminations, and differential-pair geometry where required. The 170-I/O figure is a device resource count, not a guarantee that every pin supports the same voltage, drive strength, or differential standard. Validate each signal path with the complete Artix-7 package and electrical documentation.
Treat the 256-ball package as a thermal-design item even though the supplied snippets do not provide thermal resistance or power dissipation. Estimate junction temperature only after obtaining the actual utilization, clocking, I/O activity, ambient temperature, and package thermal data. Use the FPGA vendor power and thermal reports, provide a stable board-level thermal path, and avoid placing heat-sensitive components in poorly ventilated locations. Do not substitute a generic package thermal value for the manufacturer specification.
Compliance-Informationen
The supplied web results identify the device and package but do not provide verified RoHS, REACH, AEC-Q100, lead-free, halogen-free, or conflict-minerals statements. Confirm compliance from the official AMD product documentation and distributor records.
