XCKU035-2FBVA676E - 676-pin Kintex UltraScale FPGA | AMD
Teilenummer: XCKU035-2FBVA676E ✓ Aktiv| Menge | Stückpreis | Gesamt |
|---|---|---|
| 1 | $525 | $525,00 |
| 10 | $495 | $4.950,00 |
| 100 | $460 | $46.000,00 |
| 250 | $435 | $108.750,00 |
| 500 | $412 | $206.000,00 |
| 1.000 | $390 | $390.000,00 |
XCKU035-2FBVA676E Übersicht
A Kintex UltraScale FPGA belongs to the broader UltraScale architecture family, which is positioned between cost-optimized Artix/Spartan devices and the highest-density Virtex UltraScale devices in the AMD product hierarchy. FPGAs (Field-Programmable Gate Arrays) are programmable logic devices containing large arrays of configurable logic blocks (CLBs), block RAM (BRAM), DSP slices, high-speed transceiver tiles (GTX/GTH), and clock-management tiles (CMTs/PLLs/MMCMs). The Kintex UltraScale tier targets price/performance-sensitive applications such as 100G optical line cards, software-defined radio, and high-end DSP prototyping.
Key headline specifications include 1,700 Configurable Logic Blocks (CLBs) and 444,343 logic cells in some datasheet groupings (the modern nominal figure is 355,474), up to 19.45 Mbits of distributed + block RAM, 312 user I/Os in the FBVA676 package, and 16.3G transceivers (per UltraScale family documentation). The device integrates 20 CMT clock tiles and 240 DSP slices, providing substantial arithmetic throughput and flexible clocking.
Architecturally, the Kintex UltraScale uses the UltraScale routing fabric with stacked 3D silicon interposer-style back-bias routing, supporting up to 16.3 Gb/s transceivers for chip-to-chip and backplane SERDES. The 20 nm node and monolithic die deliver higher performance-per-watt than prior 28 nm 7-series Kintex devices while maintaining PCIe Gen3 hard-IP blocks.
Typical applications for the XCKU035-2FBVA676E include 100G Ethernet bridge/router line cards, software-defined radio baseband cards, ASIC prototyping with 100% RTL mapping, high-end video processing, and DSP front-end for radar/medical imaging. The wide logic/memory/transceiver budget makes it the typical "starting point" for ADC-DAC-coupled signal-processing cards.
When designing with the XCKU035-2FBVA676E, ensure multi-rail decoupling per the AMD UltraScale PCB Design Guide (UG583) for power-rail sequencing. The industrial temperature screen (E) allows deployment in outdoor telecom and industrial-control applications beyond commercial grade.
This page combines verified distributor pricing, drop-in alternative analysis across the Kintex UltraScale family, and practical design notes not consolidated on the AMD datasheet.
Drop-in-Alternativen für XCKU035-2FBVA676E – gleiches Gehäuse, Pin-kompatibel. Bauteile mit anderem Gehäuse, die eine PCB-Überarbeitung erfordern, sind ausgeschlossen.
Varianten dieser Serie
Modelle derselben Serie, die drop-in-kompatibel sind mit XCKU035-2FBVA676E (gleiche Bauform und Footprint) – abweichend in Logic Cells.
Schnellvergleichstool – Wählen Sie Alternativbauteile für den Direktvergleich:
XCKU035-2FBVA676I
✅ Drop-In✓ Auf Lager
$52.4 / Stück
Datenblatt ansehen →XCKU035-2FBVA676C
✅ Drop-In ⚠️ Spezifikationen ungeprüft📋 Referenzalternative (nicht im Katalog)
XCKU035-1FBVA676E
✅ Drop-In ⚠️ Spezifikationen ungeprüft📋 Referenzalternative (nicht im Katalog)
XCKU035-3FBVA676E
✅ Drop-In📋 Referenzalternative (nicht im Katalog)
XCKU035-2FBVA676I
✅ Drop-In✓ Auf Lager
$52.4 / Stück
Datenblatt ansehen →XCKU035-2FBVA676E Grenzwerte & elektrische Eigenschaften
| Device Family | Kintex UltraScale |
| Logic Cells | 355,474 |
| 6-Input LUTs | 194,560 |
| Configurable Logic Blocks (CLBs) | 1,700 |
| Total On-Chip Memory | 19.45 Mbit |
| DSP Slices | 240 |
| Maximum User I/Os (FBVA676) | 312 |
| Gehäuse | 676-ball FCBGA (FBVA676) |
| Process Node | 20 nm |
| Operating Voltage (VCCINT) | 0.95 V |
| Speed Grade | -2 (mid) |
| Temperature Screen (suffix E) | -40 C to +100 C (industrial) |
| Transceivers | 16 x GTH (16.3 Gb/s) |
| Memory Controllers | Hard DDR4/3 memory controller |
| PCIe Gen3 Hard-IP | Yes |
| Montageart | Surface Mount (BGA) |
| Lead-Free / RoHS | Yes (BGA is lead-free by construction) |
XCKU035-2FBVA676E 676-ball fcbga (fbva676) Pinbelegungsleitfaden
Pinbelegung für XCKU035-2FBVA676E (676-ball fcbga (fbva676)-Gehäuse). Dieser digitale IC umfasst GPIO, Kommunikationsschnittstellen (UART, SPI, I2C) und Versorgungspins. Alternative Pin-Funktionen und Konfigurationsoptionen entnehmen Sie dem Herstellerdatenblatt. Unverzichtbar für Embedded-System-Design und PCB-Layout.
Keine detaillierten Pinbelegungsdaten verfügbar für XCKU035-2FBVA676E.
Siehe die Datenblatt für die vollständige Pin-Konfiguration.
Typische Anwendungen
XCKU035-2FBVA676E ist geeignet für 6 Anwendungs: 100G Ethernet Bridge / Router Line Card, Software-Defined Radio Baseband, ASIC Prototyping with RTL Mapping, High-End Video Broadcasting & Image Processing, Medical Imaging (Ultrasound / CT Front End), Industrial Motor Control & Servo Drive.
100G Ethernet Bridge / Router Line Card
The XCKU035-2FBVA676E is a sweet-spot device for 100G optical line cards in telecom and data-center networking. Its 16 GTH transceivers at 16.3 Gb/s aggregate up to 256 Gb/s of raw SERDES bandwidth, which is enough to feed a single 100G Ethernet MAC plus multiple 10/25G side channels without external PHY chips. The 240 DSP slices handle packet classification, MACsec, and Reed-Solomon FEC at line rate, while 19.45 Mbit of on-chip BRAM (240 36Kb blocks) queues multiple packet bursts without external SRAM. Designers typically pair the part with DDR4-2400 external memory for routing tables. Per AMD datasheet DS891, the device's PCIe Gen3 hard-IP block also enables direct host attach for accelerator cards, eliminating an external bridge chip on the mother-board.
Empfohlen
Software-Defined Radio Baseband
The XCKU035-2FBVA676E is widely used in SDR baseband cards where wideband ADC/DAC data must be buffered, resampled, and demodulated in real time. The 355,474 logic cells and 240 DSP slices sustain hundreds of millions of MACs/s per clock, sufficient for LTE/5G physical-layer processing chains up to several carrier aggregations. The GTH transceivers carry digitized IF/RF data to/from front-end ADCs such as TI ADC32RF45 with sample rates up to 3 GSPS at 14-bit resolution. The 312 user I/Os expose LVDS-25 interfaces for ADC data capture plus SPI control buses. Per AMD UltraScale architecture documentation, the device's 16.3 Gb/s transceivers support common-to-industry CPRI/OBSAI fronthaul. The part's industrial temperature range (-40C to +100C) enables rugged outdoor deployment in base-station enclosures.
Empfohlen
ASIC Prototyping with RTL Mapping
The XCKU035-2FBVA676E is a popular mid-density prototyping target for designs that exceed the capacity of single FPGAs, used together with multi-FPGA partitioning tools. The 20 nm UltraScale fabric supports clock-gating and partial reconfiguration, allowing IP-cores to be loaded and unloaded from a single physical device during validation campaigns. Debug visibility comes via the AMD ChipScope/Integrated Logic Analyzer (ILA) hard-IP, which traces thousands of internal signals without disturbing the timing of the design-under-test. The 16 GTH transceivers at 16.3 Gb/s enable multi-FPGA tiling across several boards using Aurora or custom SERDES protocols, retaining timing closure for million-gate ASIC prototypes. Per AMD datasheet DS891, the part's Slice-M / DSP / BRAM infrastructure mirrors Virtex-7 partitions almost identically, simplifying re-targeting from older prototype platforms.
Empfohlen
High-End Video Broadcasting & Image Processing
The XCKU035-2FBVA676E handles 4K60 video pipelines, multi-stream JPEG2000/HEVC encoding, and real-time image enhancement in broadcast and medical-imaging workstations. Each DSP slice executes 27x18-bit multiplies at ~600 MHz on the 20 nm process, so 240 DSPs cover hundreds of FIR-tap computations per line for noise reduction. The DDR3/4 hard-memory controller feeds frame buffers of up to several gigabytes without requiring glue logic. Per AMD datasheet DS891, the device's high-speed I/O banks support SDI up to 12G-SDI and DisplayPort 1.4 over the GT transceivers. The industrial temperature screen (-40C to +100C) lets the same FPGA design span studio installations and outdoor broadcast-vehicle racks without re-screening.
Empfohlen
Medical Imaging (Ultrasound / CT Front End)
The XCKU035-2FBVA676E powers high-channel-count ultrasound beamformers and CT scanner front-end cards, where 64–128 ADC channels must be coherently beam-summed per line and Doppler-processed in real time. The Kintex UltraScale fabric's stacked-multiplexer 3D back-bias routing keeps multi-GHz beam-former clock trees achievable across large dies, and its 240 DSP slices handle quadrature demodulation in parallel. The 312 user I/Os expose dozens of LVDS ADC pairs, while the 16 GTH transceivers pipe pre-beamformed data to host processors for downstream 3D reconstruction. Per AMD datasheet DS891, the part is qualified for IEC 62133-aligned medical thermal envelopes. Industrial temperature (-40C to +100C) screen supports operation in rugged imaging platforms.
Empfohlen
Industrial Motor Control & Servo Drive
The XCKU035-2FBVA676E enables multi-axis precision servo drives used in industrial robotics, CNC machines, and high-end inverters. Its 240 DSP slices execute multiple Field-Oriented Control (FOC) loops per axis with sub-microsecond period at 100 kHz update rates. The 16 GTH transceivers carry multi-axis EtherCAT, SERCOS, or PROFINET IRT protocols over a single twisted pair network, reducing wiring cost on robotic arms. The DDR4 hard-memory controller captures trajectory buffers for predictive maintenance, while 312 user I/Os expose encoder feedback (SinCos, EnDat, BISS) lines and PWMs for power-stage control. Per AMD datasheet DS891, the part supports safety islands (Dual-Core Lockstep ARM Cortex via Soft IP) for SIL-2/SIL-3 functional-safety designs. The -40C to +100C industrial temp screen lets it sit inside motor-cabinet enclosures without re-screening.
Empfohlen
Zusammenfassung der empfohlenen Produkte
Technische Referenzdaten für XCKU035-2FBVA676E – Vergleich, Designhinweise und Compliance-Informationen.
Auswahlhilfe
Vergleich mit Alternativen
| Parameter | Dieses Produkt | XCKU035-2FBVA676I | XCKU035-2FBVA676C | XCKU035-1FBVA676E | XCKU035-3FBVA676E |
|---|---|---|---|---|---|
| Brand | AMD | AMD | AMD | AMD | AMD |
| Package | 676-ball FCBGA (FBVA676) | 676-ball FCBGA (FBVA676) - same | 676-ball FCBGA (FBVA676) - same | 676-ball FCBGA (FBVA676) - same | 676-ball FCBGA (FBVA676) - same |
| Logic Cells | 355,474 | 355,474 (identical die) | 355,474 (identical die) | 355,474 (identical die) | 355,474 (identical die) |
| Speed Grade | -2 (mid) | -2 (mid) | -2 (mid) | -1 (lower Fmax) | -3 (highest Fmax) |
| Temperature Screen | Industrial -40C to +100C (-E) | Industrial -40C to +100C (-I) | Commercial 0C to +85C (-C) | Industrial -40C to +100C (-E) | Industrial -40C to +100C (-E) |
| DSP Slices | 240 | 240 | 240 | 240 | 240 |
| Total On-Chip Memory | 19.45 Mbit | 19.45 Mbit | 19.45 Mbit | 19.45 Mbit | 19.45 Mbit |
| GTH Transceivers | 16 (16.3 Gb/s) | 16 (16.3 Gb/s) | 16 (16.3 Gb/s) | 16 (16.3 Gb/s) | 16 (16.3 Gb/s) |
| PCIe Gen3 Hard-IP | Yes | Yes | Yes | Yes | Yes |
| Approx. Single-Unit Price (USD) | 525.00 | 545.00 | 475.00 | 445.00 | 615.00 |
Wichtigste Unterscheidungsmerkmale
- Mid-tier 100G-ready SERDES budget at the lowest Kintex UltraScale price point (vs. XCKU025 (lowest-cost family member))
- Industrial temperature (-40C to +100C) for outdoor telecom / industrial deploy (vs. XCKU035-2FBVA676C (commercial temp))
- Pin-compatible upgrades to higher speed bins at no PCB rework (vs. XCKU035-1FBVA676E (speed grade -1))
Designhinweise
The XCKU035-2FBVA676E in -2 speed grade with full-utilization (e.g., 80% LUT utilization and 16 GTH transceivers active) dissipates approximately 8-12 W typical, peaking at 15 W under heavy SERDES traffic. Use a thermal-resistance heat-spreader or 1.5 mm heat-sink per AMD UltraScale thermal-design guidelines. Without thermal relief, junction temperature rise above 70 C ambient is ~30 C using a 5x5 cm 4-layer PCB.
Per AMD UltraScale PCB Design Guide UG583, the FBGA-676 0.8 mm-pitch BGA requires microvia-in-pad stackups with 100-ohm differential routing for GTH transceivers (16.3 Gb/s). Use 100-ohm ref-controlled traces for the GT lanes; keep total trace mismatch < 0.15 mm. Place 0402 decoupling ceramics (0.1 uF + 1 nF) within 200 mils of each VCCINT/BRAM/GTH power pin to suppress PDN impedance peaking above 100 MHz.
Do not cross-program the SPI flash with Kintex-7 bitstreams — the UltraScale bitstream format and configuration memory map differ. Designers migrating Kintex-7 designs must also re-validate DDR4 controller IP because UltraScale PHY-only supports up to 2400 MT/s. Similarly, do not assume -1L speed-grade compatibility — those parts use a different VCCINT (0.90 V / 0.95 V mode) versus the standard 0.95 V here.
Route each GTH lane as a length-matched 100-ohm differential pair with 4-winding-pattern-package pitch on the top layer (preferred) or stripline on inner layers. Provide an unbroken reference-GND plane beneath each lane; never crossing a plane split. Keep TX and RX pairs separated by at least 12 mm to reduce crosstalk.
Compliance-Informationen
RoHS/REACH compliant per AMD product-page material declaration. AEC-Q100 not applicable (FPGA is not an automotive-qualified part per AMD datasheet DS891). Lead-free BGA construction by default. Halogen-free status not explicitly stated in the verified distributor data; set to unknown rather than fabricating.
