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Productos (6)
653 - Miniature Fuseholder Banana Plug Test Jack | Keystone
The Keystone Electronics 653 is a miniature banana plug test jack designed for thru-hole PCB mounting in test points, programming headers, and measurement access points. Housed in a single-pin thru-hole package with an overall height under typical Keystone 653-series dimensions, the device provides a reliable spring-loaded contact receptacle that accepts standard 0.166 in (4.22 mm) banana plugs and standard 0.080 in (2.03 mm) probe tips for in-circuit testing. A banana plug test jack, also called a banana jack or test jack, is a single-contact receptacle used to provide a convenient, reusable, non-permanent electrical connection point on a printed circuit board or chassis. It sits in the broader family of test points and PCB interconnect accessories (sub-category: connectors > board-to-board interconnects), and is engineered to accept banana-style plugs, oscilloscope probes, multimeter leads, and pin probes. The Keystone 653 is widely adopted as a programming header pin, debug access point, or ground reference in lab and production test fixtures. Key features include a current rating of 5 A, a contact resistance of 10 mOhm or less, and a dielectric withstand voltage of 2100 V DC per the Keystone datasheet. The body is insulated with a color-coded polycarbonate sleeve (standard color options include red and black), and the internal contact is beryllium-copper with gold or tin plating for low contact resistance and high-cycle life. The 653 accepts mating pins and banana plugs of 0.080 in (2.03 mm) diameter. The Keystone 653 is built around a single-piece stamped contact and molded insulator geometry, providing repeatable insertion force and reliable mating over thousands of cycles. The thru-hole termination accepts a standard 0.116 in (2.95 mm) PCB hole and is wave-solder compatible, making the part suitable for both hand-prototyping and high-volume SMT-adjacent production lines where test points are added post-reflow. Typical applications include oscilloscope probe ground posts on evaluation boards, programming/debug access headers on microcontroller boards, signal injection and measurement points on RF prototype boards, ATE fixture contact points, and educational lab trainers where students need to probe the circuit without soldering. When designing with the Keystone 653, observe the recommended PCB hole diameter and keep-out clearance around the body so the banana plug can fully engage without mechanical interference. Color-coding (red = positive, black = ground) reduces user error in production test fixtures. The Keystone 653 is not designed for permanent connection - repeated mating cycles and axial pull forces will eventually wear the contact.
B03B-PAEK(LF)(SN) - 3-Pin 2mm Through-Hole PA Header | JST
The JST B03B-PAEK(LF)(SN) is a 3-position, top-entry male pin header from JST's PA series, designed for through-hole wire-to-board interconnects at a 2.0 mm pitch. The connector carries a 3 A current rating, a 250 V voltage rating, and an operating temperature range of -25 C to +85 C, making it a practical choice for low-voltage signal and power distribution in commercial and industrial equipment. A board-to-board or wire-to-board header is a passive interconnect component that provides a separable, mechanically robust electrical path between a printed circuit board and an external cable, harness, or mating PCB. Headers sit within the broader category of rectangular connectors, which belong to the family of electromechanical interconnect products. The PA series from JST is widely used as a cost-effective, polarized, locking-rail solution where 2.00 mm pitch discrete-wire termination is required. Key differentiating features of the B03B-PAEK(LF)(SN) include a glass-fiber reinforced PBT insulator rated UL94V-0, copper-alloy contacts with a tin (Sn) plating finish, and a polarized housing with a friction lock ramp that mates with the corresponding PAP-series crimp housing. The through-hole K-pin tail geometry, combined with a 5.3 mm profile and 8 mm overall length, supports wave-solder assembly while leaving room for standard cable-side mating clearance. From an engineering standpoint, the PA series uses a single-row contact arrangement with 2.00 mm pitch, which is a widely accepted open-industry footprint. Tin-plated copper-alloy contacts provide low contact resistance for sub-3 A signal and low-power distribution; for harsher environments, JST offers gold-plated variants within the same mechanical envelope. Typical applications: internal wiring harnesses for consumer electronics, low-current power distribution boards, signal header interfaces on industrial controllers, sensor break-out boards, and prototyping/DIY electronics that use the popular JST-PH-equivalent footprint family. Design tip: Always mate the B03B-PAEK(LF)(SN) with the correct PA-series female housing (e.g., PAP-03V-S) and AWG 28-22 crimp contacts; mismatched series will not latch and may damage the locking ramp. This page consolidates distributor pricing, drop-in alternative headers, and selection notes beyond what is summarized in the JST catalog datasheet, supporting faster engineering decisions.
DF22R-3P-7.92DSA(05) - 3-Pin 7.92mm 30A Power Header | Hirose
The Hirose DF22R-3P-7.92DSA(05) is a 3-position through-hole vertical header from the DF22R series of 7.92 mm pitch high-current connectors designed for internal power supplies. It carries up to 30 A per contact, supports 600 V AC/DC, and uses a positive locking mechanism plus mechanical keying to prevent incorrect mating when multiple identical-position connectors coexist on a single board. A power-to-board header is a board-mounted male contact strip that mates with a wire-side crimp socket (DF22RC series) to bring power into or between PCBs. As a member of the high-current rectangular connector family, the DF22R sits in the hierarchy board-to-board connector -> rectangular power connector -> high-current header -> through-hole vertical header. It bridges upstream bulk DC rails (24 V bus, 48 V telecom, battery stacks) to downstream point-of-load converters and DC-DC bricks inside industrial, robotics, and telecom equipment. Key features of the DF22R-3P-7.92DSA(05) include a 7.92 mm contact pitch (the widest in the DF22 family for high-current applications), UL/C-UL and TUV safety certifications, and a robust halogen-free resin housing rated for -55 C to +85 C operation. The vertical through-hole mount orientation simplifies PCB routing for stacked board-to-board power delivery where a right-angle exit is not viable. Architecturally, the header uses thick copper-alloy pins with tin plating for low contact resistance and high current density. The 7.92 mm pitch provides the creepage and clearance required by IEC 60950 / IEC 62368 for primary-side power circuits, while the positive lock delivers audible mating feedback and prevents vibration-induced disconnection in industrial environments. Typical applications include industrial automation controllers, programmable logic controller (PLC) power inputs, servo drive bus rails, telecom base-station 48 V distribution, and uninterruptible power supply (UPS) battery interconnects. The wide pitch also suits EV charging station auxiliary power, where isolation and mechanical robustness are essential. When designing with this header, derate the 30 A rating to roughly 24 A continuous per pin at industrial ambient (typically 70 C) and provide adequate copper pad area for thermal relief. Always use the matched DF22RC-3S-7.92C receptacle and the recommended crimp contacts to maintain the rated current and the UL/TUV approvals. This page synthesises distributor pricing, same-brand and cross-brand drop-in alternatives, and practical design notes not found in the manufacturer datasheet alone.
FTSH-105-01-L-DV-K-A-TR - 10-Pin SMT Micro Header Strip | Samtec
The Samtec FTSH-105-01-L-DV-K-A-TR is a 10-position (2 rows x 5 pins) surface-mount micro header strip on a 0.050 in (1.27 mm) pitch, part of Samtec's high-reliability FTSH series. The part features a vertical orientation, a 10 microin (0.25 um) gold contact mating surface with tin-lead (Pb) terminations, a 0.120 in (3.05 mm) post length, and a keying notch on the A side. It is supplied in Tape and Reel (TR) packaging and is designed for high mating-cycle applications where polarized, keyed board-to-board interconnects are required. A board-to-board header strip is a surface-mount electromechanical interconnect that provides a detachable, multi-position link between a daughter card and a host PCB. It sits within the broader family of pin headers, which are organized into unshrouded (breakaway) and shrouded (shrouded/boxed) variants. FTSH parts are unshrouded and rely on a keying notch rather than a plastic shroud to prevent mis-mating. Within Samtec's catalog the FTSH series sits above lower-cost breakaway headers and below fully shrouded, locking Tiger Eye or QTE/QSE interfaces, placing it in the mid-tier for moderate reliability and signal integrity. Key features of the FTSH-105-01-L-DV-K-A-TR include a liquid crystal polymer (LCP) insulator rated for reflow soldering up to 260 C in accordance with JEDEC J-STD-020, phosphor-bronze contact springs for stable contact force, and the '-K-A' polarization key that orients mating halves relative to pin A1. Operating temperature spans -55 C to +125 C. The TR suffix denotes Tape and Reel packaging compatible with automated pick-and-place assembly. The 'e3' termination finish designation refers to a tin (Sn) finish with a nickel underplate; this variant retains a lead-containing contact plating consistent with the legacy '-L' coding. Typical applications include FPGA and MCU debug/JTAG headers, signal break-out boards, mezzanine-to-board interconnects for industrial controllers, test and programming fixtures, and routing for differential low-speed signal buses such as SPI, I2C, and GPIO banks. Designers select this footprint when board real estate is constrained and a vertical, shrouded-or-keyed interface is not required. When comparing drop-in alternatives note that all variants in the FTSH-105-01 family share the same 1.27 mm pitch, 10-pin count, and insulator body - only the plating (L), keying position (K-A), and packaging (TR or tube) change. Design considerations include ensuring pad geometry matches the recommended land pattern in the Samtec FTSH datasheet, providing adequate keep-out for the post tails to avoid solder wicking, and confirming that mating socket housings such as CLP or FLE series are specified for the same polar-key orientation. This page synthesizes distributor pricing and drop-in alternatives from DigiKey, Mouser, and LCSC that are not consolidated on the manufacturer datasheet.
FX18-60P-0.8SV - 60-Pin 0.8mm Pitch Board-to-Board Header | Hirose
The Hirose FX18-60P-0.8SV is a 60-position vertical surface-mount board-to-board header from the FX18 Series, featuring an outer shroud contact configuration with a 0.8 mm pitch and rated for high-speed transmission up to 10 Gbps. The connector is designed for vertical coplanar or mezzanine PCB mating and supports multi-functional (MF) contacts that combine signal, ground, and power (up to 12 A) functions in a single compact housing, making it suitable for compact backplane and embedded computing applications. The outer shroud provides mechanical alignment and EMI containment for high-density signal routing. A Board-to-Board (B2B) connector is a type of interconnect that joins two printed circuit boards electrically and mechanically, either in a stacked (mezzanine), coplanar, or right-angle configuration. The FX18 Series sits within the family hierarchy of mezzanine connector -> board-to-board connector -> rectangular connector -> electronic interconnect, and is engineered specifically for high-speed digital signaling required by modern serial bus standards. Within the broader connector ecosystem, B2B headers like the FX18 are classified as plug-side components, paired with FX18 receptacle (socket) counterparts of the same pin count and pitch. Key features include 60 contacts on a 0.8 mm pitch, a rated current up to 12 A on power contacts, gold contact plating for low contact resistance, surface-mount termination with retention features, and support for 3-step sequential mating. The FX18 Series supports data rates up to 10 Gbps, enabling compatibility with standards such as PCI Express, SATA, and high-speed LVDS. Operating temperature ranges of up to 125 C with heat-resistant options are available for thermally demanding enclosures. The connector uses a precision-stamped contact design with optimized contact geometry to maintain signal integrity at multi-gigabit speeds, and it is supplied in tape-and-reel packaging compatible with automated SMT placement. The vertical orientation and outer shroud layout facilitate dense routing on stacked or coplanar PCB assemblies, particularly where conventional headers cannot accommodate the required pin count within the available board real estate. Typical applications include Open Pluggable Specification (OPS 2.0) digital signage modules, server backplanes, industrial control boards, embedded computing platforms, and test-and-measurement instrumentation where high-density, high-speed interconnects are required. The 0.8 mm pitch enables fine-pitch routing while the multi-functional contacts reduce the total pin count required for power distribution. When designing with this connector, verify the mating receptacle (FX18-60S-0.8SV family) for pin compatibility and ensure PCB land patterns match the Hirose-recommended footprint. Use the manufacturer's recommended PCB keep-out and pick-and-place footprints for reliable automated assembly. This page synthesizes distributor pricing, drop-in variants within the Hirose FX18 family, and practical design notes not aggregated in a single manufacturer datasheet.
TSM-106-01-L-SH - 6-Pin SMT Strip Header, Horizontal | Samtec
The Samtec TSM-106-01-L-SH is a 6-position, single-row, surface-mount terminal-strip header on a 0.100 inch (2.54 mm) pitch, with horizontal (right-angle) orientation and a 0.230 inch (5.84 mm) mating post length. It belongs to the TSM series of unshrouded, breakaway .025 inch square post headers and ships in 10 µin gold on the contact mating surface with tin on the solder tail. A board-to-board connector header is a through-hole or surface-mount male pin strip that mates with a corresponding female socket or socket strip to carry signals and low-current power between printed circuit boards. Headers sit at the leaf level of the connector family taxonomy: connector -> board-to-board connector -> pin header -> breakaway header -> unshrouded header. The TSM series specifically targets surface-mount reflow soldering with horizontal or vertical entry, eliminating the need for plated through-holes on the host board and enabling placement on a single-sided SMT process. Engineers value unshrouded headers because their open pin field lets them key, mix, and trim the strip to any pin count at the bench, with mating sockets from the SSW, SSQ, ESW, ESQ, HLE, or HPM families. Key features of the TSM-106-01-L-SH include a 0.025 inch (0.635 mm) square post that survives high mating cycles with a phosphor-bronze or brass body, optional alignment and locking features selected by suffix, and compatibility with both single and double-row boards when polarity allows. Samtec offers plating options from matte tin to 30 µin gold for engineer-grade versus production-grade reliability, and the part is rated for use across extended operating temperature ranges typical of industrial electronics. The horizontal right-angle orientation supports low-clearance applications where the board edge meets a parallel mating PCB inside a stacked assembly. Typical applications include board-to-board stacking where one board sits parallel to another at a defined stand-off, point-to-point ribbon-cable headers for I/O and power, prototyping breakaway bus strips, test-point and programming-port headers, and discrete signal pass-through between mezzanine modules. Pairing with a Samtec SSW, SSQ, ESW, or BCS socket of the same pin count yields a complete signal path. Designers should verify the mating post length versus the socket stack height to avoid bottoming-out or float-out, and they should respect the recommended PCB land pattern in the TSM datasheet to keep solder joints robust under mechanical mating stress.