FPGA y CPLD
Productos (6666)
10M25DCF484A7G - MAX 10 FPGA, 25K LE, 484-BGA | Intel
The Intel (formerly Altera) 10M25DCF484A7G is a MAX 10 FPGA with 25,000 logic elements, 1,728 Kbit embedded block RAM (Kb), and 360 maximum user I/O pins, packaged in a 484-ball FineLine BGA (FBGA-484) optimized for high I/O density designs. Operating from a 1.2 V core supply with integrated voltage regulator and configuration flash, this non-volatile FPGA delivers up to 25000 logic elements and 81 multipliers (18x18) for DSP pipelines, with up to 4 PLLs for clock management. A Field Programmable Gate Array (FPGA) is a programmable logic device that allows hardware designers to implement custom digital circuits after manufacturing, using configurable logic blocks (CLBs), programmable interconnects, and dedicated hardware blocks such as multipliers, block RAM, and PLLs. FPGAs occupy a tier in the digital logic hierarchy above simple microcontrollers and below custom ASICs, offering parallel processing capability, deterministic latency, and reconfigurability that makes them ideal for glue logic, I/O expansion, motor control, industrial communication protocols, and pre-ASIC prototyping. The MAX 10 family specifically targets low-power, non-volatile, cost-sensitive applications by integrating a configuration flash and an internal LDO voltage regulator on-chip, eliminating the need for external boot PROMs and regulators used in classic SRAM FPGAs. Key features of the 10M25DCF484A7G include dual-configuration flash with self-refresh, 12 Kbit user flash for system-level parameter storage, a built-in ADC block (up to 12-bit, 1 MSPS, 17 channels) for analog sensor monitoring, instant-on support from <10 ms, and -40C to +125C (automotive AEC-Q100 grade) operating range. The device integrates an analog-to-digital converter and temperature-sensing diode, supporting industrial and automotive mixed-signal designs without external ADC ICs. The 484-ball FBGA package exposes up to 360 user I/O pins, accommodating LVDS, LVCMOS, SSTL, and other interface standards via Intel Quartus Prime pin assignment. The MAX 10 architecture uses a 55 nm non-volatile process with embedded flash, supporting up to 300 MHz internal operation. Embedded memory is partitioned into 9 Kbit M9K blocks for distributed workloads, while 144 18x18 multipliers accelerate DSP algorithms such as FIR filters and motor-control transforms. The device supports external memory interfaces including DDR3, LPDDR2, and SRAM, controlled by four PLL-driven clock trees. Typical applications include industrial motor control drives, programmable logic controllers (PLCs), automotive driver-assistance systems, sensor fusion hubs, factory automation gateways, and low-cost video processing pipelines. The integrated ADC simplifies analog front-end design for battery management and process control, while non-volatile instant-on behavior suits safety-critical and power-sequenced designs. When designing with this device, verify that the FBGA-484 land pattern matches PCB manufacturing tolerances (typically 1.0 mm pitch), and confirm that the Quartus Prime device selection corresponds to speed grade -7 and the A7 commercial temperature option. Always check the latest Intel MAX 10 device handbook for I/O bank voltage constraints and configuration scheme selection. This page synthesizes distributor inventory, drop-in alternatives from the same MAX 10 family, and practical design notes not found in the manufacturer datasheet alone.
10M25DCF484C8G - MAX 10 FPGA 25K LE 484-BGA | Intel
The Intel (Altera) 10M25DCF484C8G is a MAX 10 field-programmable gate array integrating 25,000 logic elements, 691,200 bits of embedded SRAM, and a 360-pin interface in a 484-ball fine-pitch BGA package. It is part of Intel's non-volatile MAX 10 family, which uniquely combines FPGA logic with on-chip flash configuration memory, eliminating the need for an external boot PROM in most designs. A Field-Programmable Gate Array (FPGA) is a reconfigurable integrated circuit containing an array of programmable logic blocks, interconnect, and I/O cells that engineers can customize after manufacturing. FPGAs sit between fixed-function ASICs and microcontrollers in the semiconductor taxonomy: programmable logic device -> FPGA -> reconfigurable logic IC -> semiconductor. They are widely used for digital glue logic, sensor aggregation, industrial control, motor drive, video bridging, and ASIC prototyping where parallelism and deterministic latency matter more than raw clock speed. Key features of the 10M25DCF484C8G include 25,000 logic elements, 16 dedicated 18x18 multipliers (DSP blocks), integrated configuration flash, on-chip ADC support, and 360 user I/O pins enabled by the F484 BGA package. It belongs to the 'C8' speed/temperature grade, which targets commercial-temperature operation (0C to 85C) at the -8 speed bin, balancing cost and timing margin for mainstream industrial and consumer designs. The MAX 10 architecture employs a look-up-table (LUT)-based logic fabric combined with a flash-programmable configuration plane, allowing instant-on behavior at power-up - a critical advantage over SRAM-based FPGAs that require external boot devices. The 484-BGA package also exposes a high number of general-purpose I/O and high-speed LVDS lanes, supporting parallel data capture and bridge applications. Typical applications include industrial machine vision, motor control and drive, factory automation backplanes, low-cost video processing, sensor fusion hubs, and portable test instrumentation where instant-on reconfigurable logic is valuable. The integrated flash and ADC blocks reduce bill-of-materials cost for distributed I/O nodes. When designing with the 484-BGA variant, pay close attention to PCB stack-up and via-in-pad rules for breakout routing. Confirm Quartus Prime device support (Cyclone V / MAX 10 device library) before committing the layout, and verify that the -C8 timing model matches your target fMAX for DSP and external memory interfaces.
10M25DCF484I7G - MAX 10 FPGA 25K LE 484-BGA | Intel
The Intel (formerly Altera) 10M25DCF484I7G is a member of the MAX 10 family of non-volatile FPGAs integrating 25,000 logic elements, 1,728 Kbits of embedded RAM, and a 5 Mb flash configuration block in a 484-ball FineLine BGA package. The device provides up to 360 user I/O pins with industrial temperature grade support (I7 suffix indicates -40C to +100C operating range) and is built on a low-power 55 nm TSMC process that consumes roughly one-tenth the standby power of comparable CPLDs. A Field Programmable Gate Array (FPGA) is a reprogrammable digital logic device built from an array of configurable logic blocks (CLBs), programmable interconnects, and dedicated hard IP blocks such as PLLs, transceivers, multipliers, and memory controllers. FPGAs sit hierarchically within the broader taxonomy of programmable logic: CPLD (simpler, non-volatile, fast I/O) -> FPGA (higher density, SRAM or flash based) -> SoC FPGA (integrated CPU subsystem) -> ASIC (custom silicon). MAX 10 devices occupy the non-volatile low-end FPGA segment, replacing CPLDs and small ASICs in glue-logic, I/O expansion, and control-plane roles. Key features include single-chip instantiation through on-chip flash, integrated analog-to-digital converters on selected variants, instant-on support, and dual-configuration flash images for fail-safe field upgrades. The 25K LE density supports moderate glue logic, custom peripheral implementations, and small protocol bridging designs. Hard IP blocks include up to 4 PLLs, embedded SRAM blocks of 9 Kbits (M9K) totaling 1,728 Kbits, and multiplier blocks for DSP operations, while the package delivers 360 user I/Os in a 1.0 mm pitch FineLine BGA. The 10M25DCF484I7G uses a flash-backed configuration cell that retains the bitstream across power cycles, eliminating external boot PROMs. Internal dual-boot logic can store two images, allowing field reconfiguration and fail-safe rollback. The 484-ball FineLine BGA is optimized for high I/O count with manageable PCB routing complexity using standard BGA fanout rules. Typical applications include industrial motor control, factory automation I/O expansion, low-cost video bridging, LED display controllers, sensor aggregation nodes, and portable medical instrumentation. The integrated flash and analog blocks reduce BOM count and PCB footprint versus discrete CPLD-plus-ADC implementations, which is the primary value proposition for the MAX 10 family. Designers should plan power distribution carefully. Decoupling must include 100 nF ceramic capacitors on every VCCIO and VCCA supply pin placed within 100 mils of the ball, plus bulk capacitance. Ensure JTAG chain integrity for in-system programming, and verify that the Quartus Prime pin assignment matches the chosen board layout before committing to the 484-BGA footprint. This page consolidates distributor pricing, drop-in alternative MAX 10 OPNs, and engineering notes beyond the manufacturer datasheet to accelerate board bring-up and sourcing decisions for engineers evaluating the 10M25DCF484I7G.
10M25SAE144C8G - MAX 10 FPGA 25K LE 144-LQFP | Intel
The Intel (formerly Altera) 10M25SAE144C8G is a non-volatile, low-cost MAX 10 Field-Programmable Gate Array (FPGA) with 25,000 logic elements (25K LE), 1,638 Kbit embedded SRAM (1,638 Kbits total memory), and 101 maximum user I/Os, housed in a 144-pin LQFP Exposed Pad (EQFP-144) package at 0.5 mm pitch. It integrates a 12-bit 1 Msps ADC, dual-configuration flash, and instant-on support, delivering single-chip programmable logic that eliminates external boot devices. What is a non-volatile FPGA? A non-volatile FPGA integrates its configuration memory on-chip, so it powers up instantly without an external boot PROM. The MAX 10 family belongs to Intel's low-cost programmable logic portfolio (FPGA -> programmable logic -> logic device -> semiconductor) and targets bridge, I/O expansion, motor control, and industrial sensor applications where instant-on and small footprint are critical. Key features include 25K logic elements, 54 embedded 18x18 multipliers, 66 PLLs (4 fractional PLLs), 1.638 Mbit user flash, single or dual power supply options, and 1 Msps 12-bit ADC with 17 analog inputs. The 144-LQFP package has a body size of 22 x 22 mm with exposed thermal pad for enhanced power dissipation. The device operates across industrial temperature ranges and supports JTAG programming. The MAX 10 architecture uses SRAM-based logic fabric backed by on-chip configuration flash, allowing dual boot from two flash images for field upgrades. The fabric includes LABs (Logic Array Blocks), MLABs (Memory LABs), and DSP blocks with hardware multipliers for signal-processing pipelines. Hardened IP blocks (PLL, ADC, flash) reduce die area and power compared to soft implementations. Typical applications include industrial motor control with hardware PWM, factory sensor aggregation with on-chip ADC, video bridging between parallel RGB and MIPI, automotive rear-view camera preprocessing, and consumer appliance HMI controllers. The exposed thermal pad supports continuous operation up to 100 MHz core frequencies in fanless enclosures. When designing with this device, use the Quartus Prime design suite and Intel FPGA Power and Thermal Calculator to validate junction temperature. Route all LVDS pairs with length-matched 100 ohm differential traces, and provide at least four PCB vias under the exposed pad to the inner ground plane for thermal relief.
10M25SAE144I7G - MAX 10 FPGA 25K LE 144-LQFP | Intel / Altera
The Intel (formerly Altera) MAX 10 10M25SAE144I7G is a non-volatile Field Programmable Gate Array from the MAX 10 family, integrating 25,000 logic elements, 691,200 bits of embedded memory (1,728 Kbits), and 144 EQFP pins in a 144-LQFP exposed-pad package. The device supports up to 101 user I/O pins and is fabricated on a 55 nm process node, targeting low-power, instant-on, single-chip FPGA applications with 3.0 V/3.3 V rail support. A MAX 10 FPGA is a non-volatile, flash-based programmable logic device that combines look-up tables, embedded memory blocks, digital signal processing blocks, phase-locked loops, and on-chip analog-to-digital converters in a single die. Within the broader programmable logic taxonomy, MAX 10 sits below Cyclone 10 LP in cost and power, above CPLDs such as MAX V in density and DSP capability, and is the lowest-cost Intel FPGA family with integrated ADC and instant-on flash configuration. Key features include 25,000 logic elements, 45 embedded 18x18 multipliers, four 12-bit 1 MSPS analog-to-digital converters, 1.2 V core voltage, and support for LVDS, LVCMOS, SSTL, and other single-ended I/O standards. The device also integrates user flash memory for non-volatile data storage, dual configuration flash for instant-on operation, and an on-chip temperature-sensing diode. The 144-LQFP exposed-pad package (E144) provides up to 101 general-purpose user I/O with a 22x22 mm body footprint suitable for industrial reflow assembly. The MAX 10 architecture uses a logic-element fabric with adaptive logic modules, embedded SRAM blocks, and DSP blocks optimized for fixed- and floating-point operations. The integrated 12-bit ADC supports up to 17 analog input channels via the dedicated analog package pins, while the flash-based configuration memory eliminates external boot PROMs and enables sub-10 ms instant-on behavior in safety-critical industrial systems. Typical applications include industrial control and motor drive, machine vision pre-processing, factory automation I/O expansion, video bridging and display controllers, low-cost ASIC/ASSP replacement, and distributed I/O aggregation at the edge of industrial Ethernet networks. The combination of non-volatile flash configuration, integrated 12-bit ADC, and industrial temperature grade makes it well suited for glue-logic designs with analog sensing and instant-on behavior. When designing with this part, ensure the exposed pad is soldered to a sufficiently large copper pour for thermal dissipation and ground integrity, since high-utilization designs in the E144 package can dissipate 1-2 W. Use Intel Quartus Prime Lite for synthesis, place-and-route, and timing closure at no additional cost. Vertical migration between MAX 10 density grades within the same E144 footprint enables seamless design scaling. This page synthesizes distributor pricing across DigiKey, Mouser, and Arrow, cross-references drop-in same-package MAX 10 alternatives, and consolidates practical design guidance not found in the manufacturer datasheet.
10M25SCE144A7G - MAX 10 FPGA 25K LE, 144-LQFP | Intel | Altera
The Altera 10M25SCE144A7G is a non-volatile MAX 10 field programmable gate array with 25000 logic elements, 691200 bits of embedded user flash memory, and 101 maximum user I/O pins, housed in a 144-pin LQFP with exposed pad. It is fabricated on a 55nm CMOS process and supports a 1.2V core supply. This -A7G speed/temperature grade targets commercial 3.3V operation and is part of the MAX 10 family that integrates flash configuration, ADC, and DSP blocks on a single chip. A field programmable gate array (FPGA) is a semiconductor device built around a matrix of configurable logic blocks (CLBs) connected by programmable interconnect. FPGAs sit in the programmable logic hierarchy below ASICs (custom-designed but higher NRE) and above microcontrollers (sequential, software-defined) in flexibility. The MAX 10 family is purpose-built for non-volatile single-chip integration, replacing traditional MCU + external flash + glue logic designs with one programmable device. Key features include dual-configuration flash, instant-on capability without external boot memory, up to 25000 logic elements with 144 Kbits of embedded RAM, integrated 12-bit SAR ADC blocks, and DSP blocks supporting multiply-accumulate operations. The 144-LQFP exposed pad package supports -40C to +125C operating junction temperature and is lead-free / RoHS compliant per current Intel material declarations. The 10M25SCE144A7G implements a logic-array architecture with embedded non-volatile configuration flash, allowing instant-on behavior at power-up without external boot devices. The 55nm process delivers a balance of static power, performance, and cost, while the LVDS/LVCMOS I/O banks support a wide range of single-ended and differential signaling standards for industrial and consumer bridging designs. Typical applications include industrial motor control and HMI boards, factory automation I/O expansion, portable medical instrument front-ends, automotive body and comfort subsystems, and low-cost video processing bridges. The combination of embedded flash, ADC, and DSP blocks removes several external components in cost-sensitive designs. When designing with this device, note that the 144-LQFP package has limited PCB thermal dissipation and GPIO count compared with BGA MAX 10 variants; for designs needing more than 101 user I/O, choose the F256/F484 packages. Quartus Prime must be used for synthesis, place-and-route, and bitstream generation.
10M25SCE144I7G - MAX 10 FPGA 25K LE 144-LQFP | Intel
The Intel (formerly Altera) 10M25SCE144I7G is a non-volatile MAX 10 field programmable gate array (FPGA) integrating 25,000 logic elements, 1,728 Kbits of embedded memory, and a 144-pin EQFP (LQFP with exposed pad) package. Built on TSMC 55nm embedded flash process technology, this device delivers single-chip instant-on functionality without external configuration memory, making it ideal for cost- and power-sensitive applications. An FPGA (Field Programmable Gate Array) is a semiconductor integrated circuit composed of configurable logic blocks (CLBs), programmable interconnects, and dedicated I/O and memory resources that an engineer can reconfigure post-manufacture to implement custom digital logic, glue logic, state machines, signal processing pipelines, or hardware accelerators. Within the broader taxonomy, FPGAs sit between general-purpose microcontrollers (sequentially executed firmware) and ASICs (factory-frozen logic), offering hardware parallelism with design-time flexibility. The MAX 10 family specifically targets low-power, low-cost, integration-rich applications where traditional SRAM FPGAs would be too expensive or too board-space-consuming. Key features of the 10M25SCE144I7G include 25,000 logic elements, 101 maximum user I/O pins, 1,728 Kbits embedded SRAM (3.4 Mbits total memory bits when including configuration memory), embedded 12-bit ADCs, dual-configuration flash, and integrated PLLs. The device operates from a 1.2V core supply with 3.3V/2.5V/1.8V/1.5V LVCMOS/LVTTL/LVDS I/O standards. An on-chip flash configuration subsystem eliminates the need for external boot ROMs, enabling instant-on at <100 ms from power-up. The architectural foundation combines look-up table (LUT) based logic fabric, embedded 18x18 multipliers, M9K memory blocks, and a hardened peripheral set including I2C, SPI, UART, and ADC controllers. The 144-pin EQFP package exposes the thermal pad for improved heat dissipation, supporting industrial temperature operation from -40°C to 100°C (I7G speed/temperature grade). Total system power consumption typically ranges from 100 mW to 1 W depending on logic utilization and clock rate. Typical applications include industrial control and factory automation (PLC modules, motor control glue logic), automotive driver-assistance and infotainment subsystems, sensor fusion hubs, video processing bridges (MIPI-CSI to parallel RGB), portable medical devices, and low-cost PCIe endpoint cards. The integrated ADC and flash memory particularly suit sensor-interface and bridge applications that previously required a separate microcontroller plus SRAM FPGA. When designing with the 10M25SCE144I7G, plan for the 1.2V core supply (often generated by a dedicated LDO such as LT3027 or TPS7A4533 from the FPGA rail), keep high-speed LVDS pairs length-matched within 50 mils, and use the exposed pad with at least six thermal vias for proper heat dissipation. Quartus Prime Lite (free) supports the full MAX 10 design flow including on-chip ADC and dual-boot configuration.
10M40DAF256C7G - 40K LE MAX 10 FPGA, 256FBGA | Intel
The Intel 10M40DAF256C7G is a non-volatile MAX 10 Field Programmable Gate Array (FPGA) with 40,000 logic elements, 178 user I/Os, and 1,290,240 RAM bits, housed in a 256-ball FineLine BGA (FBGA-256) package. It is a commercial-temperature MAX 10 device with an operating range of 0C to +85C, a 1.2V core supply, and the industry-recognized MAX 10 instant-on capability. An FPGA is a semiconductor device containing programmable logic fabric that can be configured after manufacturing to implement digital circuits, from combinational logic to complex state machines and soft microcontrollers. The MAX 10 family is notable for integrating non-volatile configuration memory on-chip, which means no external SPI flash configuration device is required during board bring-up. In the system hierarchy, this FPGA sits between high-end ASSPs/SoCs and low-density CPLDs, allowing engineers to implement custom I/O, protocol bridging, and real-time control logic while retaining field-upgrade flexibility. Key features of the 10M40DAF256C7G include 40,000 logic elements, 178 user I/Os, and 1,290,240 RAM bits. The FBGA-256 package has a 17 mm x 17 mm body with 1 mm ball pitch, enabling compact PCB implementation. The device is marked as RoHS compliant in distributor listings and is supplied as non-volatile, configurable FPGA silicon from the MAX 10 portfolio. From an architecture perspective, the MAX 10 family combines FPGA fabric, embedded memory blocks, and non-volatile configuration flash in one die. The 256-ball package provides a practical balance between I/O count and board area. The 1.2V core supply simplifies power delivery planning compared to some older CPLD/FPGA devices that require multiple auxiliary supplies, while the many I/O pins support parallel interfaces, memory buses, and general-purpose control signals. Typical applications for this part include industrial motor control, factory automation, IoT edge gateways, display and vision interfaces, remote I/O concentrators, and test-and-measurement equipment. The combination of 40K logic elements and on-chip configurability makes it suitable for designs that need custom logic without the cost or board space of external configuration memory. One important design consideration is that the commercial-temperature device is rated only from 0C to +85C. For outdoor or cold-start environments, use the industrial-temperature variant, 10M40DAF256I7G, which has the same logic density and FBGA-256 package. Power-supply decoupling should target the 1.2V core rail with low-ESR ceramic capacitors distributed near the BGA package. This page synthesizes distributor availability, price references, drop-in alternative variants, and practical design notes that are not all consolidated in a single manufacturer datasheet, providing engineers with actionable data for sourcing and design decisions.
10M40DAF256C8G - MAX 10 FPGA 40K LE, 256-FBGA | Intel / Altera
The Intel / Altera (formerly Altera) 10M40DAF256C8G is a MAX 10 family non-volatile Field-Programmable Gate Array (FPGA) integrating 40,000 logic elements, 1,290,240 bits of embedded SRAM, and 178 general-purpose user I/O in a 256-ball FineLine BGA (FBGA-256) package. Built on a 55 nm process, the device combines LUT-based fabric, 9-bit analog-to-digital converter blocks, on-chip flash configuration memory, and instant-on support in a single chip, enabling glue-logic, control-plane, and low-power signal-processing designs without an external configuration PROM. What is a MAX 10 FPGA? The MAX 10 is Intel's small-to-medium-density non-volatile FPGA family that bridges CPLDs and high-end FPGAs. It belongs to the broader category hierarchy of programmable logic devices (PLD) -> field-programmable gate array (FPGA) -> non-volatile FPGA -> instant-on FPGA -> low-power FPGA. MAX 10 devices integrate dual-configuration flash, user flash memory, and analog blocks, which eliminates the need for a separate boot memory and makes them suitable for industrial control and motor-drive subsystems where deterministic power-up timing is required. Key features include 40K logic elements (LE), 1.29 Mbit embedded SRAM, 178 maximum user I/O pins, integrated 12-bit analog-to-digital converter (ADC) blocks, embedded SRAM, and DSP blocks. The 256-ball FBGA package uses a 1.0 mm ball pitch on a 17 x 17 mm body, supporting surface-mount assembly with standard JEDEC JEDEC MSL-3 moisture sensitivity handling. The 10M40DAF256C8G is implemented in a low-power 55 nm CMOS process and supports instant-on functionality because the configuration image is stored in on-chip flash. The integrated 9-bit sigma-delta ADC can sample up to twelve analog channels and is suited to multi-rail voltage and temperature monitoring without an external ADC IC. Hard memory controllers, PLLs, and global clock networks provide deterministic timing for industrial protocols. Typical applications include industrial motor control and factory automation, low-power IoT edge nodes with deterministic boot, video bridge and display controllers, automotive driver-assistance subsystems (non-safety-critical), and portable test-and-measurement instrumentation. Designers choose MAX 10 when instant-on, integrated analog, and single-chip simplicity outweigh the need for high-end transceivers. When designing with the 10M40DAF256C8G, pay attention to the FBGA-256 PCB land-pattern requirements: a 1.0 mm pitch BGA requires microvia or laser-drilled via technology for inner-row fan-out, and the JTAG and configuration pins must be pulled according to Intel MAX 10 Hardware Reference guidance. Quartus Prime design software is required for synthesis, place-and-route, and bitstream generation. This page consolidates distributor pricing, datasheet links, drop-in MAX 10 alternatives in the same FBGA-256 footprint, and practical PCB design notes not found in the manufacturer datasheet alone.
10M40DAF256I7G - MAX 10 FPGA 40K LE, 178 I/O, 256-FBGA | Intel
The Intel (Altera) 10M40DAF256I7G is a non-volatile MAX 10 Field Programmable Gate Array delivering 40,000 logic elements, 1,290,240 bits of embedded memory, and 178 user I/O in a 256-pin FineLine BGA (FBGA) package with 1.2 V core operation at up to 472.5 MHz internal performance. Built on a 55 nm TSMC process, this MAX 10 device integrates a dual-configuration flash, ADC blocks, and instant-on support in a single chip. What is a non-volatile FPGA? A non-volatile FPGA is a field-programmable gate array that retains its configuration bitstream in on-chip flash memory, eliminating the need for an external boot PROM and enabling instant-on operation within milliseconds of power-up. MAX 10 FPGAs sit at the lowest end of Intel's FPGA portfolio in terms of logic density but offer the highest integration of analog/mixed-signal features (12-bit SAR ADC, temperature sensors, PLLs), making them ideal for I/O expansion, glue-logic replacement, and low-cost control-plane designs. Within the broader taxonomy they belong to: FPGA -> programmable logic -> digital IC -> semiconductor. Key features of the 10M40DAF256I7G include 40K logic elements (LEs), 1,290,240 bits (M9K + M144K) embedded user RAM, 4 PLLs, 56 (18x18) multipliers for DSP, and an integrated hard IP block set including DDR3 external memory interfaces, 12-bit ADC, and PCIe Gen2 hard IP (x1/x2). The device supports LVDS, LVTTL, LVCMOS, SSTL, and HSTL I/O standards with hot-socket support and on-die termination. Technically the 10M40DAF256I7G uses Intel's adaptive logic module (ALM) architecture with 8-input fracturable look-up tables, providing superior logic packing versus legacy 4-input LUT architectures. The on-chip flash stores two configuration images for fail-safe dual-boot, and the analog block integrates up to 16 channels of 12-bit 1 MSPS SAR ADC plus on-die temperature sensing diodes that connect to the FPGA fabric. Typical applications include industrial motor control, factory automation I/O concentrators, portable medical device displays, low-cost video bridging, automotive infotainment pre-processing, and PCIe endpoint cards. The 256-FBGA package also fits space-constrained designs requiring a BGA footprint with high pin count and good thermal dissipation via the exposed die paddle. When designing with this device, route the dedicated configuration/JTAG pins (nCONFIG, nSTATUS, CONF_DONE, TMS, TCK, TDI, TDO) to the board test access points and provide at least one 10 uF + one 100 nF decoupling pair per power rail (VCCINT, VCCA, VCCIO bank). The dual-boot flash allows in-field updates over PCIe or serial protocols, but designers must budget flash update time and provide an external watchdog to recover from corrupted images. This page synthesizes distributor pricing, drop-in pin-compatible alternatives from Intel's MAX 10 family, application-specific design notes, and comparison tables not consolidated in the manufacturer datasheet.
10M40DAF484C7G - MAX 10 FPGA, 40K LE, 484-BGA | Intel / Altera
The Intel / Altera 10M40DAF484C7G is a MAX 10 field-programmable gate array (FPGA) integrating 40,000 logic elements, 1,290,240 bits of embedded SRAM, and 360 user I/Os in a 484-ball FineLine BGA package. It belongs to the MAX 10 non-volatile FPGA family, which uniquely combines a flash-backed configuration memory with on-chip analog and digital peripherals, eliminating the need for an external boot PROM. A field-programmable gate array (FPGA) is a semiconductor device built around an array of configurable logic blocks (CLBs) connected via programmable interconnect. FPGAs sit at the top of the programmable logic hierarchy alongside CPLDs, and are used to implement custom digital logic, glue logic, signal conditioning, and compute pipelines that would otherwise require many discrete ICs. The MAX 10 family adds integrated features such as ADCs, PLLs, temperature-sensing diodes, and flash memory, blurring the line between FPGA and microcontroller-plus-SoC designs. Key features of the 10M40DAF484C7G include 40,000 logic elements (LEs), 1,290,240 bits (approximately 160 Kbytes) of embedded user SRAM, 4 embedded DSP blocks, and an integrated 12-bit ADC. The 484-ball FineLine BGA exposes 360 general-purpose user I/Os supporting LVDS, LVCMOS, and other single-ended I/O standards. The 'C7G' speed/grade suffix denotes a commercial temperature range device targeting cost-sensitive high-volume designs. On the technical side, the part uses Intel's TSMC 55 nm embedded flash process, which gives instant-on behavior (configuration loaded in microseconds from internal flash) and supports dual-image configuration for fail-safe field updates. The integrated hard IP blocks (PLLs, ADC, JTAG, and temperature sensor) operate independently of the fabric, allowing deterministic latency for I/O conditioning and analog sampling even before user logic is loaded. Typical applications for the 10M40DAF484C7G include industrial motor control, machine vision pre-processing, video bridging, I/O expansion and protocol translation (I2C, SPI, UART to LVDS or parallel), portable test instrumentation, and low-cost display controllers. The high I/O count (360) and 484-BGA footprint are well suited to designs that need to fan out to many external peripherals or high-speed parallel buses. When designing with this device, allocate at least four PCB layers for signal routing under the BGA and follow Intel/Altera's power-sequencing guidance. Decouple each bank of I/O supplies with 0.1 microfarad plus bulk ceramic capacitors placed as close to the balls as the breakout allows. Quartus Prime is the supported design toolchain for this part. This page synthesizes distributor pricing, package-level alternatives, and practical Quartus Prime design notes not present in the manufacturer datasheet.
10M40DAF672C7G - MAX 10 FPGA 40K LE 672-BGA | Intel
The Intel (formerly Altera) 10M40DAF672C7G is a MAX 10 non-volatile FPGA with 40,000 logic elements, 1,290,240 bits of embedded SRAM, and 500 user I/Os housed in a 672-ball FineLine BGA package. It is fabricated on a 55 nm TSMC process and operates from a 1.2 V core supply with on-chip voltage regulation for the configuration and flash blocks. According to the verified distributor data, the device belongs to the MAX 10 family and integrates dual-configuration flash, a 12-bit ADC block, and hardware multiplier/ DSP blocks. A Field-Programmable Gate Array (FPGA) is a class of programmable logic device that allows hardware designers to implement arbitrary digital circuits after PCB fabrication. The MAX 10 family sits at the intersection of CPLD and high-density FPGA: it offers instant-on non-volatile configuration via on-die flash, eliminating external boot memories. Within Intel's programmable-logic taxonomy, MAX 10 ranks as a low-power, low-cost, non-volatile FPGA suitable for I/O expansion, bridging, motor control, and industrial automation. Key differentiating features of the 10M40DAF672C7G include 40K logic elements (the largest density in the MAX 10 family), 1.29 Mbit user flash, 5,888 Kbit embedded SRAM, 4 PLLs, 2 I/O banks with LVDS support, and an integrated 12-bit 1 MSPS ADC with up to 17 analog inputs. The 672-FBGA package exposes 500 general-purpose I/Os - the highest user-IO count in the family - making it suitable for high-pin-count bridging and parallel-processing designs. The device is offered in the commercial C7 speed grade (about -40 °C to +85 °C) and supports JTAG, AS, and PS configuration modes. Architecturally, MAX 10 uses Logic Array Blocks (LABs) of 16 Adaptive Logic Modules (ALMs), each ALM containing an 8-input fracturable look-up table, two dedicated adders, and four registers. Embedded memory blocks (M9K) deliver true dual-port or single-port RAM, while DSP blocks support 18x18 signed multiplication. The on-die flash supports dual-boot images and instant-on operation, so the device behaves like a CPLD at power-up while retaining full FPGA flexibility. Typical applications include industrial motor control and drive interfaces, multi-protocol industrial bridging (EtherCAT, PROFINET, Modbus), video processing and image-sensor aggregation, factory-automation PLCs, and portable medical instrumentation. The high IO count also makes it attractive for LED video-wall scan boards and avionics display controllers where every pin matters. A practical design consideration: route LVDS pairs as length-matched 100 ohm differential nets and place the 1.2 V core decoupling capacitors as close as the FBGA's inner-row balls allow. Because the device integrates configuration flash, designers must still respect the dual-boot image boundary or risk bricking the part if the user image is corrupted during in-field updates. This page synthesizes distributor pricing, same-package MAX 10 drop-in alternatives, and practical design notes not found in the standalone manufacturer datasheet, giving engineers a single decision-ready reference.
10M40DAF672C8G - MAX 10 FPGA, 40K LE, 672-FBGA | Intel / Altera
The Intel (Altera) 10M40DAF672C8G is a non-volatile MAX 10 Field Programmable Gate Array (FPGA) integrating 40,000 logic elements, 1,290,240 bits of embedded SRAM, and a 672-ball FineLine BGA package. Built on a low-power 55 nm process, the device operates from a 1.2 V core supply and delivers instant-on functionality through on-die flash configuration memory, eliminating external boot PROMs in most designs. A Field Programmable Gate Array (FPGA) is a semiconductor integrated circuit composed of configurable logic blocks (CLBs), programmable interconnects, and I/O tiles that engineers can re-program to implement arbitrary digital logic, DSP functions, or memory interfaces. MAX 10 FPGAs belong to the non-volatile FPGA family, a sub-class of programmable logic devices (PLDs) that integrate configuration flash on-die. Within the broader programmable logic taxonomy, MAX 10 sits between small CPLDs and higher-density Cyclone/Cyclone V devices, offering up to 50K logic elements with low static power and single-chip boot for industrial, automotive, and consumer applications. Key features include 40K logic elements, 1,290,240 bits of user flash memory, a hard DDR3 memory controller, integrated PLLs, and 500 user I/O pins supporting LVDS, LVCMOS, and SSTL I/O standards. The 672-FBGA package exposes 16 global clock networks, dedicated 18x18 multipliers, and an embedded ADC block on selected MAX 10 variants, making the 10M40 well suited for mixed-signal bridge designs. Architecture details: the 10M40 uses an LUT-based logic fabric with 8-input fracturable look-up tables, distributed M9K memory blocks, and MLAB memory. The 672-ball FBGA package offers signal integrity advantages for high-speed DDR3 interfaces up to 300 MHz. Dual-configuration flash supports remote field updates, a critical feature for industrial IoT endpoints. Typical applications include industrial motor control, factory automation bridges, video processing pipelines, LED display controllers, and portable medical instrumentation. The on-die flash simplifies BOM, and the integrated ADC eliminates an external analog front end for sensor conditioning. When designing with the 10M40DAF672C8G, plan I/O bank partitioning carefully - the 672-FBGA exposes eight I/O banks, each with independent VCCIO rails. Use the Quartus Prime PowerPlay early power estimator to validate thermal budget before PCB layout, since BGA fan-out requires 0.8 mm or finer trace/space. This page consolidates distributor stock, validated drop-in alternatives, and design notes that complement the manufacturer datasheet, helping procurement and engineering teams evaluate the 10M40DAF672C8G quickly.
10M40DAF672I7G - MAX 10 FPGA 40K LE, 672-BGA | Intel
The Intel (formerly Altera) 10M40DAF672I7G is a MAX 10 Field Programmable Gate Array (FPGA) with 40,000 logic elements, 1,290,240 bits of embedded memory, and 500 user I/Os, fabricated on a 55 nm non-volatile process and housed in a 672-ball FineLine BGA (FBGA) package. What is a MAX 10 FPGA? A Field Programmable Gate Array (FPGA) is a semiconductor device built around an array of configurable logic blocks (CLBs) connected via programmable interconnect, allowing hardware functionality to be defined after manufacturing. MAX 10 is Intel's non-volatile, instant-on FPGA family positioned between CPLDs and traditional SRAM FPGAs; it integrates flash configuration memory on-chip so designs load at power-up without an external boot PROM. The MAX 10 family belongs to the broader hierarchy of programmable logic devices (PLD) and is widely used for I/O expansion, bridging, motor control, and industrial glue logic. Key features of the 10M40DAF672I7G include 40K logic elements, 1.29 Mbit embedded SRAM, 4 Mb user flash, an integrated ADC, dual-configuration flash, and DSP blocks that deliver up to 156 GMACs of fixed-point performance. The -I7G speed/temperature grade specifies an industrial junction range with the 7 speed bin, suitable for fanless industrial enclosures. The 672-ball FBGA package supports the high I/O count needed for parallel bus bridging, video aggregation, and multi-protocol industrial networking. The MAX 10 architecture combines a logic fabric, embedded 18x18 multipliers, and hard memory controllers. The on-chip flash also enables user-accessible storage for firmware, calibration constants, or soft-core configuration images, which is unique in its class and eliminates the external SPI flash typically required by SRAM FPGAs. Typical applications include industrial machine vision, motor and motion control, multi-protocol bridging (EtherCAT, PROFINET, EtherNet/IP), test and measurement front-ends, and portable medical or point-of-sale terminals. The integrated ADC and DSP blocks also suit sensor aggregation nodes. When designing, plan power sequencing carefully: MAX 10 devices support single-supply operation but require proper decoupling and a clean POR ramp. Quartus Prime is the supported toolchain. The 672-BGA requires a 4+ layer PCB with microvia technology for fan-out. This page synthesizes distributor pricing, same-package MAX 10 alternative OPNs, and practical design notes not found in the standalone datasheet PDF.
10M40DCF256A7G - MAX 10 FPGA, 40K LE, 256-FBGA | Intel
The Intel (formerly Altera) 10M40DCF256A7G is a MAX 10 field-programmable gate array (FPGA) with 40,000 logic elements, 1,290,240 bits of embedded memory (approximately 160 Kbytes), and 178 maximum user I/Os, housed in a 256-ball FineLine BGA (FBGA) package. It is fabricated on a 55 nm TSMC process and supports a core voltage of 1.2 V with a maximum internal operating frequency of 472.5 MHz. A field-programmable gate array (FPGA) is a semiconductor device built around an array of configurable logic blocks (CLBs), programmable interconnect, and on-die memory that engineers can reconfigure after manufacturing to implement arbitrary digital logic, DSP pipelines, or glue logic. MAX 10 sits in the low-power, non-volatile family tier - below Cyclone and above MAX V - and is the only non-volatile FPGA family in the Intel low-density lineup, integrating configuration flash, ADC blocks, and dual-configuration images on-chip. This hierarchy (FPGA -> programmable logic -> semi-custom ASIC alternative) makes MAX 10 ideal for volume production where ASSP flexibility is insufficient but full ASIC NRE is uneconomical. Key features of the 10M40DCF256A7G include integrated dual-configuration flash, up to 16 analog-to-digital converter (ADC) channels at 12-bit resolution, on-chip temperature sensing, and optional Nios II soft-core processor support. The device integrates 178 user I/Os with support for LVDS, LVCMOS, SSTL, and other single-ended and differential I/O standards, while embedded MRAM blocks total approximately 378 Kbits of true RAM without sacrificing logic utilization. Architecturally, the MAX 10 family combines a logic array fabric with hard IP blocks - including PLLs, embedded memory (M9K blocks), DSP blocks (18x18 multipliers), and a hard ADC subsystem. The 55 nm process node strikes a balance between static power consumption and performance, and the dual-boot configuration flash allows in-field firmware upgrades without external programmer hardware. Typical applications include industrial motor control and factory automation, automotive body and infotainment subsystems, IoT edge sensor aggregation, video bridging and display controllers, and low-cost ASIC prototyping. The integrated ADC and on-die temperature diode simplify sensor interfacing in industrial IoT nodes, while 40K logic elements provide sufficient capacity for protocol bridging and small DSP functions. When designing with the 10M40DCF256A7G, engineers must observe the FBGA-256 PCB land pattern (17 mm x 17 mm, 1.0 mm ball pitch) and ensure 8-layer stack-up with microvia-in-pad capability for breakout routing. Quartus Prime software is required for synthesis, place-and-route, and bitstream generation; the Lite Edition supports this device at no cost. This page synthesizes distributor pricing, drop-in same-package alternatives drawn from the MAX 10 family and Site MPN list, and practical PCB layout and configuration guidance that complement the official datasheet.
10M40DCF256C7G - MAX 10 FPGA, 40K LE, 256-LBGA | Intel / Altera
The Intel (formerly Altera) 10M40DCF256C7G is a non-volatile MAX 10 Field Programmable Gate Array (FPGA) with 40,000 logic elements (LE), 1,290,240 bits of embedded SRAM, and 178 user I/O pins, fabricated on a 55 nm process and housed in a 256-ball FineLine BGA package. It integrates dual-configuration flash, ADC blocks, and DSP support on-chip, delivering instant-on capability without an external boot PROM. An FPGA (Field Programmable Gate Array) is a semiconductor integrated circuit composed of configurable logic blocks (LBs), programmable interconnects, and embedded memory/DSP blocks that can be re-programmed to implement arbitrary digital logic. MAX 10 sits within the low-density, non-volatile tier of Intel's FPGA portfolio, positioned between CPLDs (e.g., MAX V) and mid-range FPGAs (e.g., Cyclone IV/V) - offering higher logic capacity than CPLDs while retaining instant-on dual-power-supply simplicity. Key features include 40K logic elements, 1,290,240 embedded SRAM bits, integrated 12-bit ADC blocks, on-chip dual-configuration flash, DSP blocks supporting up to 472.5 MHz operation, and 178 maximum user I/O pins. The DC suffix denotes the dual-power-supply variant with 1.2 V core VCC and a separate VCCIO bank supply. Architecturally, MAX 10 FPGAs use 8-input adaptive logic modules (ALMs) with fracturable look-up tables, embedded multipliers for DSP, and dedicated memory blocks. The integrated flash eliminates the need for external boot memory, reducing BOM cost and PCB area. The 55 nm process node balances static power and performance for cost-sensitive industrial and consumer designs. Typical applications include industrial motor control, factory automation I/O expansion, low-cost video processing, sensor aggregation hubs, and portable test equipment. The integrated ADC and DSP make the part especially attractive for mixed-signal data acquisition front-ends. When designing with this part, ensure the Quartus Prime toolchain supports the device family and that the pinout is locked via the Quartus Pin Planner before PCB layout - 256-BGA fanout requires careful escape routing and microvia stack-up design. This page synthesizes distributor pricing, drop-in same-family alternatives, and practical design notes not consolidated in the manufacturer datasheet, delivering verified engineering context for sourcing and selection decisions.
10M40DCF256C8G - MAX 10 FPGA, 40K LE, 256-FBGA | Intel
The Intel 10M40DCF256C8G is a MAX 10 field-programmable gate array (FPGA) integrating 40,000 logic elements (LE) and 1,290,240 bits of embedded memory in a 256-ball FineLine BGA (FBGA) package. It is fabricated on a 55 nm non-volatile process, supports a core voltage of 1.2 V, and operates across the commercial 0 °C to 85 °C junction temperature range. The device belongs to the MAX 10 family, Intel's (formerly Altera) non-volatile FPGA line that combines LUT-based logic, block RAM, DSP blocks, and on-die flash configuration in a single chip. A field-programmable gate array (FPGA) is a programmable logic device (PLD) belonging to the broader hierarchy of integrated circuits (ICs) > programmable logic > digital semiconductors. Unlike application-specific integrated circuits (ASICs), FPGAs allow designers to implement arbitrary digital logic, signal processing, and glue-logic functions after PCB fabrication. Modern non-volatile FPGAs such as MAX 10 additionally integrate a configuration flash memory on-die, removing the need for external boot PROMs and enabling instant-on behavior comparable to microcontrollers. Key features of the 10M40DCF256C8G include 4-input look-up tables (LUT4) for combinatorial logic, embedded 18 × 18 multipliers for DSP operations, embedded SRAM blocks, phase-locked loops (PLLs) for clock management, and a hard ADC block unique to MAX 10 family. The -8 speed grade indicates the fastest commercial timing bin, while the C suffix denotes the commercial temperature range and the G suffix denotes a lead-free / RoHS-compliant Pb-free terminal finish. The 256-pin FBGA package supports high I/O density while maintaining a small footprint suitable for space-constrained industrial and consumer designs. MAX 10 FPGAs are designed for system-level integration. They feature on-die flash for instant-on configuration, an integrated ADC for analog monitoring, and support for Nios II soft-core processors. The internal flash also supports dual-boot and remote upgrade, simplifying firmware updates in deployed equipment. These capabilities make MAX 10 suited to motor control, industrial I/O bridging, video processing pipelines, and protocol-conversion designs. Typical applications include industrial control and factory automation, where the FPGA provides deterministic logic for PLCs and sensor aggregation; communications infrastructure, where it implements bridging between legacy and modern interfaces; automotive driver-assistance modules that require instant-on logic; consumer electronics that need flexible glue logic; and test & measurement equipment that requires reconfigurable DSP. The on-die ADC further enables system-level analog monitoring. When designing with the 10M40DCF256C8G, pay attention to bank I/O voltage constraints (each I/O bank supports a single VCCIO), reference-clock pin assignment for PLL jitter performance, and JTAG chain ordering when programming multiple devices in series. Thermal performance in the 17 mm × 17 mm FBGA-256 package supports up to approximately 4 W without external heatsinking in still air. Quartus Prime (Intel/Altera) is the primary design tool, with free Quartus Prime Lite supporting this device. This page synthesizes distributor pricing, drop-in pin-compatible alternatives within the MAX 10 family and select Cyclone parts, and practical design notes not collated in the manufacturer datasheet.
10M40DCF256I7G - MAX 10 FPGA 40K LE, 256-FBGA | Intel
The Intel (formerly Altera) 10M40DCF256I7G is a MAX 10 Field-Programmable Gate Array with 40,000 logic elements, 1,290,240 bits of embedded SRAM, and 178 user I/O, packaged in a 256-ball FineLine BGA (FBGA) and fabricated on a 55 nm non-volatile process. It operates at a core voltage of 1.2 V, supports LVDS/LVCMOS/PCIe interfaces, and includes hard IP blocks such as PLLs, ADCs, and embedded multipliers for signal-processing and control-plane applications. MAX 10 FPGAs are non-volatile, instant-on programmable logic devices that bridge the gap between traditional CPLDs and low-density FPGAs. They integrate flash configuration memory on-chip, eliminating the need for an external boot PROM. Within the broader programmable logic hierarchy, MAX 10 sits below Cyclone V and above MAX II/MAX V, targeting cost-sensitive, low-power, and board-management applications. With 40K logic elements, the 10M40 variant occupies the upper end of the MAX 10 family, alongside the 10M25, 10M16, 10M08, and 10M02 density grades. Key features include 4-input look-up tables, 9-Kbit M9K memory blocks, embedded 18x18 multipliers, up to 2 PLLs, an internal flash configuration block, an optional 12-bit SAR ADC, and support for DDR3/LPDDR2 external memory interfaces. The 'I' suffix denotes the industrial temperature grade (-40C to +100C junction) and the speed grade is 7 (fastest commercial speed for this density/package). The 10M40DCF256I7G uses Intel's Quartus Prime design software with Verilog, VHDL, and SystemVerilog support. Designers leverage IP cores for Nios II soft processors, Ethernet MAC, PCIe Gen1, and MIPI D-PHY. The 55 nm process balances cost, power, and density, while the non-volatile architecture provides instant-on behavior within microseconds of power-up. Typical applications include industrial motor control, factory automation I/O expansion, video bridging and image preprocessing, IoT edge gateways, telecom line cards, and automotive infotainment prototyping. The internal ADC and analog features are especially useful for sensor aggregation. When designing, ensure the 256-FBGA PCB land pattern supports the 1.0 mm ball pitch and that all VCCINT/VCCA/VCCIO rails are properly decoupled. JTAG and configuration pins must be terminated per Intel AN 443 for in-system programmability. This page synthesizes distributor pricing, drop-in alternatives, and design notes not found in the manufacturer datasheet, helping engineers select and source 10M40DCF256I7G quickly.
10M40DCF484C7G - MAX 10 FPGA, 40K Logic Elements, 484-BGA | Intel
The Intel (formerly Altera) 10M40DCF484C7G is a MAX 10 field-programmable gate array (FPGA) with 40,000 logic elements (LEs), 1,290,240 bits of embedded memory (1290 Kbit / 160 Kib RAM), and 360 user I/Os, packaged in a 484-ball fine-pitch BGA (FBGA-484, 23 x 23 mm, 1.0 mm pitch). The MAX 10 family is built on a non-volatile flash-based process, which means the FPGA boots from on-chip flash configuration memory and requires no external boot PROM at power-up. What is a non-volatile FPGA? A non-volatile FPGA integrates a flash configuration cell into each logic element, so the bitstream is stored on-die rather than loaded from external memory at every boot. In the product taxonomy, the MAX 10 sits below SRAM-based FPGAs (Cyclone, Stratix, Agilex) for low-power, instant-on applications, and above microcontroller units (MCUs) for parallel-logic and high-IO workloads. It belongs to the broader programmable logic family within Intel's FPGA product portfolio. Key features of the 10M40DCF484C7G include an integrated dual-configuration flash, on-chip ADC (12-bit, up to 17 channels on selected package variants), embedded DSP blocks for fixed-point arithmetic, PLLs for clock generation, and hard memory controllers. The 484-ball BGA offers up to 360 general-purpose user I/O pins, plus dedicated configuration, JTAG, and power pins. The device supports core voltages of 1.2 V and I/O voltages from 1.2 V to 3.3 V. Technically, the MAX 10 architecture combines an LAB (logic array block) fabric with M9K memory blocks and 18x18 multipliers, supporting common FPGA design patterns such as state machines, FIFO controllers, and video/imagery pipelines. The integrated analog-to-digital converter allows direct sensor interfacing without external ADCs in industrial monitoring. Typical applications include industrial motor control, factory automation I/O expansion, video bridging and display controllers, low-volume ASIC prototyping, and IoT edge devices. The on-chip ADC and dual-boot flash also suit functional safety designs (when paired with the appropriate documentation set). When designing with the MAX 10, confirm pinout, ADC channel count, and LVDS support for the specific 484-BGA variant in the Quartus Prime device handbook before PCB layout.
10M40DCF484C8G - MAX 10 FPGA, 40K LE, 484-FBGA | Intel / Altera
The Intel / Altera 10M40DCF484C8G is a MAX 10 field-programmable gate array (FPGA) in the 484-pin fine-pitch BGA (F484) package, integrating 40,000 logic elements, 1,290,240 bits of embedded SRAM, and 360 user I/Os. Built on TSMC's low-power 55 nm embedded flash process, this non-volatile FPGA requires no external configuration memory and supports instant-on operation from its internal flash. Per the MAX 10 FPGA datasheet, this variant is the C8 speed grade with a commercial temperature rating, suitable for industrial and consumer designs where single-chip integration is paramount. What is a non-volatile FPGA? A non-volatile FPGA, in the broader taxonomy of programmable logic devices (PLDs), retains its configuration in on-chip flash memory. This contrasts with SRAM-based FPGAs (such as older Altera Cyclone or Xilinx 7-series families) that require an external boot PROM and lose their configuration on power-down. The MAX 10 family belongs to Intel's programmable logic hierarchy: PLD -> CPLD/FPGA -> non-volatile FPGA -> MAX 10. By integrating configuration storage, ADCs, and DSP blocks onto a single die, MAX 10 devices simplify board design, reduce BOM cost, and accelerate time-to-market versus competing SRAM-based solutions. Key features of the 10M40DCF484C8G include an on-die 12-bit analog-to-digital converter (ADC) supporting up to 17 analog inputs, dedicated hardware multipliers (DSP blocks) for fixed- and floating-point arithmetic, and an embedded Nios II soft processor compatibility layer. The device also integrates phase-locked loops (PLLs) for clock management, internal flash memory for user data and configuration, and supports the LVDS, LVTTL, and LVCMOS I/O standards at rates suitable for industrial control and video bridging. Architecturally, the MAX 10 die is divided into logic array blocks (LABs), embedded memory blocks (M9K), DSP blocks (18x18 multipliers), and a periphery of GPIO banks. The 484-FBGA package exposes 360 general-purpose I/Os to the PCB and supports the commercial junction temperature range with appropriate derating. Internal flash can be partitioned for user data storage, enabling the device to replace a small microcontroller plus glue logic on a single chip. Typical applications include industrial motor control, factory automation I/O expansion, video interface bridging (display port to RGB), portable medical instrumentation, and low-volume ASIC replacement. The instant-on capability also makes it attractive in aerospace and defense subsystems where deterministic boot latency is required. Compared to discrete microcontrollers, the MAX 10 provides deterministic parallel logic and high-speed custom I/O timing that software-driven MCUs cannot match. When designing with this part, pay attention to the BGA fanout: the 1 mm pitch 484-FBGA demands HDI PCB stack-ups with microvias for reliable assembly. Decoupling, PLL power filtering, and JTAG chain integrity must follow the Intel MAX 10 hardware design guidelines to avoid signal-integrity issues. This page synthesizes distributor stock, datasheet parameters, and same-family drop-in alternatives across the MAX 10 line, providing practical engineering context not consolidated in any single manufacturer document.
10M40DCF484I7G - MAX 10 FPGA, 40K LE, 484-FBGA | Intel
The Intel 10M40DCF484I7G is a MAX 10 Field Programmable Gate Array (FPGA) from the non-volatile MAX 10 family, integrating 40,000 logic elements into a 484-ball FineLine BGA package with 360 user I/O pins. Built on a 55 nm CMOS process, it delivers up to 472.5 MHz internal operation and includes an on-chip flash configuration memory that eliminates the need for an external boot PROM. A Field Programmable Gate Array (FPGA) is a type of programmable logic device (PLD) containing an array of configurable logic blocks (CLBs), programmable interconnects, and I/O cells that designers can configure after manufacturing to implement arbitrary digital circuits. FPGAs sit within the semiconductor hierarchy between ASICs (which are fixed-function) and microcontrollers (which run software), making them ideal for parallel processing, custom interface bridging, hardware acceleration, and rapid prototyping. Key features of the 10M40DCF484I7G include 1,290,240 bits of embedded SRAM (Kb memory), 4 PLLs, 2 I/O banks with LVDS support, an integrated ADC block, and a 1.2 V core supply. The 'DC' package code indicates a commercial-grade temperature range, while the 'I7' speed grade and 'G' lead-free finish complete the part designation per Altera/Intel ordering nomenclature. The MAX 10 architecture combines LUT-based logic fabric with hardened peripherals including DDR3 memory controllers, soft processors (Nios V), and on-die configuration flash, enabling single-chip system designs. Unlike SRAM-based Cyclone or Stratix devices, MAX 10 is instant-on at power-up with no external boot device required, simplifying PCB layout and reducing BOM cost. Typical applications include industrial motor control, factory automation I/O expansion, video processing pipelines, low-cost custom protocol bridging, and prototype ASIC emulation. The 484-ball FBGA package with 1.0 mm pitch is well-suited for moderate-density designs where high I/O count is required but full FPGA BGA assembly is acceptable. When designing with this device, ensure the Quartus Prime software version supports the 10M40DCF484I7G device variant. Verify the IBIS model and pinout file against your PCB layout, and follow Intel's MAX 10 hardware design guidelines for power rail sequencing, decoupling, and JTAG chain implementation. This page synthesizes distributor pricing, same-family MAX 10 drop-in alternatives, and practical Quartus Prime design notes not found in a single manufacturer datasheet.
10M40DCF672C7G - MAX 10 FPGA 40K LE 672-BGA | Intel
The Intel 10M40DCF672C7G is a non-volatile MAX 10 Field Programmable Gate Array with 40,000 logic elements, 1,290,240 bits of embedded SRAM, and 500 maximum user I/O pins, housed in a 672-ball FineLine BGA package. The device integrates dual-configuration flash, analog-to-digital converter blocks, and embedded memory blocks in a single chip fabricated on a 55 nm process technology. A Field Programmable Gate Array (FPGA) is a semiconductor device built around a matrix of configurable logic blocks (CLBs) connected via programmable interconnect. FPGAs sit in the broader taxonomy: programmable logic -> logic device -> integrated circuit -> semiconductor. The MAX 10 family is Intel's (formerly Altera) non-volatile FPGA line that combines LUT-based logic with on-chip flash configuration memory, eliminating the need for external boot PROMs and delivering instant-on behavior at power-up. Key features of the 10M40DCF672C7G include 40K logic elements, 250 (18x18) hardware multipliers, 1,290 Kbits embedded SRAM, 4 Kbits user flash memory, and up to 500 user I/O pins. The device operates from a 1.2 V core supply with multi-voltage I/O banks supporting LVCMOS, LVDS, SSTL, and other single-ended and differential standards. An integrated 12-bit ADC with up to 17 channels is available for system-monitoring functions. The MAX 10 architecture pairs a look-up-table (LUT)-based logic fabric with embedded hard IP such as PLLs, memory controllers, and DSP blocks. The 672-ball FBGA package provides the high pin count required for 500 user I/Os and full bank access for DDR3/LPDDR2 external memory interfaces. Built on a 55 nm embedded-flash process, the 10M40 instant-on architecture removes external boot memory while retaining in-field reprogrammability via JTAG. Typical applications include industrial motor control and factory automation, video bridging and image processing pipelines, automotive driver-assistance modules, I/O expansion and bridging for processors, low-volume ASIC prototyping, and portable instrumentation requiring non-volatile single-chip logic. The integrated ADC and PLL resources are particularly valuable for closed-loop control designs that need deterministic analog monitoring alongside digital logic. When designing with the 10M40DCF672C7G, ensure all VCCIO bank supplies match the I/O standard of connected devices, and provide adequate decoupling per the Quartus Prime power-tree guidelines. Note that the C7 speed grade (commercial, -7) targets commercial-temperature designs; for industrial or automotive temperature ranges, select the I7 or A7 speed-grade variants from the same family.
10M40DCF672C8G - MAX 10 40K LE FPGA 672-BGA | Intel
The Intel (formerly Altera) 10M40DCF672C8G is a non-volatile FPGA from the MAX 10 family featuring 40,000 logic elements, 1,290,240 bits of embedded memory, and a 672-ball FBGA package. It integrates a dual-configuration flash, on-chip ADC, and 500 user I/Os in a single chip, eliminating the need for an external boot PROM in most designs. What is a MAX 10 FPGA? MAX 10 is Intel's non-volatile FPGA family that combines traditional FPGA logic fabric with built-in flash configuration memory, hardened analog blocks (ADC), and instant-on capability. It sits in the hierarchy: programmable logic device (PLD) -> FPGA -> non-volatile FPGA -> low-density logic-integration FPGA -> system-on-chip building block. This category targets glue-logic replacement, I/O expansion, and bridge functions in industrial, automotive, and consumer systems where cost, board area, and instant-on behavior matter more than the highest logic density. Key specifications of the 10M40DCF672C8G include 40,000 logic elements, 1,290 Kbits (M9K) embedded RAM, 4 PLLs, 2 hard memory controllers, 2 integrated 12-bit ADCs, and 500 maximum user I/Os. The -8 speed grade denotes the fastest commercial speed bin. Logic density, embedded flash, and on-chip analog make the part a single-chip alternative to CPLD-plus-microcontroller or CPLD-plus-external-ADC designs. Architecturally, MAX 10 devices use a TSMC 55nm embedded flash process and a look-up-table (LUT) based logic array with routing fabric. Hardened IP blocks include the ADC subsystem, PLLs, and DDR3/LPDDR2 memory controllers. Internal configuration flash is accessed through a JTAG, AS, or JTAG-driven in-system programming interface, allowing field updates without external storage. Typical applications include industrial motor control and sensor aggregation, factory automation bridges (e.g., I2C/SPI/UART to Ethernet gateways), video/display interface conversion, automotive infotainment and ADAS I/O expansion, and portable medical instrument front-end logic. The integrated dual ADC enables direct temperature, voltage, and current monitoring without external ADCs. Designers should evaluate whether 500 user I/Os, 40K LEs, and 1.29 Mbit of block RAM are sufficient headroom for their pipeline. Quartus Prime is the supported design entry and synthesis toolchain, with free Lite Edition supporting the full MAX 10 family. The 672-pin FBGA requires a 4-layer or higher PCB with microvia construction for breakout routing. This page combines distributor pricing, drop-in same-package alternatives, and practical design notes beyond what the manufacturer datasheet alone provides, helping engineers compare options and qualify a replacement quickly.
10M40DCF672I7G - MAX 10 FPGA, 40K LEs, 1.29Mb, 672-FBGA | Intel
The Intel (formerly Altera) 10M40DCF672I7G is a MAX 10 field-programmable gate array (FPGA) with 40,000 logic elements, 1,290,240 bits of embedded user flash memory, and 500 user I/O pins, packaged in a 672-ball fine-pitch BGA (FBGA-672). It is fabricated on a 55 nm TSMC process node, operates from a 1.2 V core supply with on-die voltage regulation, and is specified over the industrial temperature range of -40 C to +100 C. What is an FPGA? A field-programmable gate array is a semiconductor device built around an array of configurable logic blocks (CLBs/LABs) connected by a programmable interconnect, with I/O cells on the periphery and dedicated hardware such as block RAM, DSP blocks, PLLs, and (in modern devices) hard memory controllers, transceivers, or processor cores. FPGAs sit above microcontrollers and ASICs in the digital design hierarchy: like an MCU they are software-defined at run-time via a bitstream, but unlike an MCU they achieve deterministic parallelism and can be re-architected on a per-product basis. The MAX 10 family in particular is the lowest-cost, non-volatile single-chip FPGA Intel/Altera offers, integrating a flash configuration cell on-die so no external boot PROM is required. Key features of the 10M40DCF672I7G include 40K logic elements, 2,500 Kbits (Kb) of embedded SRAM (M9K blocks), 144 (18x18) multipliers, 4 PLLs, 16 global clock networks, and integrated dual-configuration flash with instant-on support. The 672-FBGA package exposes the maximum 500 user I/Os of any MAX 10 device and supports LVDS, LVTTL, LVCMOS, SSTL, and other single-ended and differential I/O standards at up to 400 MHz. Hard memory controllers (DDR3, LPDDR2) and an ADC block are integrated into the die. The non-volatile nature allows instant-on behavior in < 10 ms from power-valid, eliminating external boot memory and reducing BOM cost. The 55 nm process delivers a favorable cost / power / performance balance for volume production. Typical applications span factory automation controllers, industrial machine vision, motor control co-processors, low-cost software-defined radios, test and measurement front-ends, video bridging, IoT edge nodes, and automotive driver-assistance subsystems. In each case the 10M40DCF672I7G acts as a flexible glue / accelerator between a host MCU/MPU and high-speed peripherals, offloading deterministic parallel DSP and LVDS processing that a microcontroller cannot execute in real time. When designing with this device, allocate sufficient PCB real-estate for the 1.0 mm pitch FBGA-672 footprint, supply all required decoupling capacitors per the Intel pin connection guidelines, and validate the LVDS and DDR3 interface signal-integrity with IBIS models before layout freeze. This page synthesizes distributor pricing, same-package drop-in alternatives from the MAX 10 family, and design notes that complement, but do not replace, the manufacturer datasheet.