Intel

10M40DAF672I7G - MAX 10 FPGA 40K LE, 672-BGA | Intel

N.º de pieza: 10M40DAF672I7G ✓ Activo
En stock Se envía en 1-3 días hábiles
1.2 V Vdss 672-ball FBGA Package 7 Speed 1,290,240 bits Memory
Desde $65.85 USD / unidad
MOQ: 1 |
Precio actualizado: 2026-09-05
Precios por volumen
Cant. Precio unitario Total
1 $109.75 $109,75
10 $98.77 $987,70
100 $87.8 $8.780,00
500 $76.82 $38.410,00
1.000 $65.85 $65.850,00
ℹ️ Todos los precios están en USD

10M40DAF672I7G Descripción general

The Intel (formerly Altera) 10M40DAF672I7G is a MAX 10 Field Programmable Gate Array (FPGA) with 40,000 logic elements, 1,290,240 bits of embedded memory, and 500 user I/Os, fabricated on a 55 nm non-volatile process and housed in a 672-ball FineLine BGA (FBGA) package.

What is a MAX 10 FPGA? A Field Programmable Gate Array (FPGA) is a semiconductor device built around an array of configurable logic blocks (CLBs) connected via programmable interconnect, allowing hardware functionality to be defined after manufacturing. MAX 10 is Intel's non-volatile, instant-on FPGA family positioned between CPLDs and traditional SRAM FPGAs; it integrates flash configuration memory on-chip so designs load at power-up without an external boot PROM. The MAX 10 family belongs to the broader hierarchy of programmable logic devices (PLD) and is widely used for I/O expansion, bridging, motor control, and industrial glue logic.

Key features of the 10M40DAF672I7G include 40K logic elements, 1.29 Mbit embedded SRAM, 4 Mb user flash, an integrated ADC, dual-configuration flash, and DSP blocks that deliver up to 156 GMACs of fixed-point performance. The -I7G speed/temperature grade specifies an industrial junction range with the 7 speed bin, suitable for fanless industrial enclosures. The 672-ball FBGA package supports the high I/O count needed for parallel bus bridging, video aggregation, and multi-protocol industrial networking.

The MAX 10 architecture combines a logic fabric, embedded 18x18 multipliers, and hard memory controllers. The on-chip flash also enables user-accessible storage for firmware, calibration constants, or soft-core configuration images, which is unique in its class and eliminates the external SPI flash typically required by SRAM FPGAs.

Typical applications include industrial machine vision, motor and motion control, multi-protocol bridging (EtherCAT, PROFINET, EtherNet/IP), test and measurement front-ends, and portable medical or point-of-sale terminals. The integrated ADC and DSP blocks also suit sensor aggregation nodes.

When designing, plan power sequencing carefully: MAX 10 devices support single-supply operation but require proper decoupling and a clean POR ramp. Quartus Prime is the supported toolchain. The 672-BGA requires a 4+ layer PCB with microvia technology for fan-out.

This page synthesizes distributor pricing, same-package MAX 10 alternative OPNs, and practical design notes not found in the standalone datasheet PDF.

Alternativas directas para 10M40DAF672I7G — mismo encapsulado, compatible pin a pin. Se excluyen las piezas de otro encapsulado que requieren retrabajo de la PCB.

Variantes de esta serie

Modelos de la misma serie compatibles directamente con 10M40DAF672I7G (mismo factor de forma y huella) — difiere en Package, Configuration Memory, Operating Temperature, Integrated ADC, Speed Grade.

Intel
Package: 672-ball FBGA (F672)
Operating Temperature: -40 C to +85 C (C7 commercial grade)
Comparar con 10M40DAF672I7G →
Intel
Package: 672-ball FBGA (F672)
Operating Temperature: 0 C to +85 C (commercial)
Comparar con 10M40DAF672I7G →
Intel
Package: 672-BGA (FBGA)
Configuration Memory: On-chip dual-configuration flash (non-volatile)
Operating Temperature: 0C to +85C (commercial)
Comparar con 10M40DAF672I7G →
Intel
Package: 672-ball FBGA (F672)
Configuration Memory: Internal dual-configuration flash
Operating Temperature: 0 C to +85 C (Commercial)
Comparar con 10M40DAF672I7G →
Intel
Package: 672-ball FBGA (1.0 mm pitch)
Configuration Memory: On-die flash (non-volatile, dual-image)
Comparar con 10M40DAF672I7G →
Intel
Package: 672-FBGA (F672)
Configuration Memory: Dual-boot on-chip flash
Integrated ADC: Yes (12-bit, on-chip)
Comparar con 10M40DAF672I7G →
Intel
Package: 672-FBGA (FineLine BGA, 27 mm × 27 mm, 1.0 mm pitch)
Configuration Memory: Internal Flash (dual-configuration)
Operating Temperature: -40 °C to +100 °C (Industrial, I7G)
Comparar con 10M40DAF672I7G →

Herramienta de comparación rápida — seleccione piezas alternativas para compararlas lado a lado:

10M40DAF672C8G

✅ Sustitución directa
Intel
📦 672-ball FBGA
MAX 10 FPGA · 40,000 · 1,290,240 · 1,290,240 · 500 · 672-ball FBGA (F672) · 55 nm · 1.2 V

✓ En stock

$86.1 / unidad

Ver hoja de datos →

10M40DAF672C7G

✅ Sustitución directa
Intel
📦 672-ball FBGA
MAX 10 · 40,000 · 1,290,240 · 5,888,000 · 500 · 55 nm · 1.2 V · 4

✓ En stock

$67.2 / unidad

Ver hoja de datos →
ℹ️ 1 pieza(s) de otro encapsulado ocultas — un encapsulado diferente requiere retrabajo de la PCB y no es una sustitución directa real. Contáctenos si necesita sugerencias de otros encapsulados.

10M40DAF672I7G Valores máximos y características eléctricas

Family MAX 10
Logic Elements 40,000
Embedded Memory 1,290,240 bits
User I/Os 500
Encapsulado 672-ball FBGA
Process Technology 55 nm
Core Voltage 1.2 V
Speed Grade 7
Temperature Grade Industrial (I)
Configuration Internal flash (non-volatile, instant-on)
Integrated ADC Yes (12-bit, 1 Msps)
DSP Blocks Yes (18x18 multipliers)
Nivel de sensibilidad a la humedad (MSL) 3
Estado RoHS Compliant
Tipo de montaje Surface Mount (BGA)

Guía de configuración de pines de 10M40DAF672I7G 672-ball fbga

Configuración de pines para 10M40DAF672I7G (encapsulado 672-ball fbga). Este CI digital incluye GPIO, interfaces de comunicación (UART, SPI, I2C) y pines de alimentación. Consulte la hoja de datos del fabricante para conocer las funciones alternativas de los pines y las opciones de configuración. Esencial para el diseño de sistemas embebidos y el diseño de PCB.

Diagrama de patillaje del encapsulado 672-ball fbga para 10M40DAF672I7G

No hay datos detallados de patillaje disponibles para 10M40DAF672I7G.

Consulte la hoja de datos para ver la configuración completa de patillas.

Aplicaciones típicas

10M40DAF672I7G es adecuado para 7 aplicacións: Industrial Machine Vision, Multi-Axis Motor and Motion Control, Industrial Protocol Bridging, Test and Measurement Front-End, Portable Point-of-Sale Terminals, Sensor Aggregation and IoT Gateways, LED Video Wall Controllers.

🎥

Industrial Machine Vision

The 10M40DAF672I7G suits industrial machine vision systems where Camera Link or MIPI CSI-2 aggregation requires wide parallel interfaces. With 500 user I/Os, the FPGA can capture multiple image sensor lanes simultaneously while running defect-detection pipelines in DSP blocks. The integrated 12-bit 1 Msps ADC supports auxiliary illumination control and analog sensor monitoring on the same PCB. Unlike smaller MAX 10 densities (10M08, 10M16), the 10M40 tier provides headroom for convolutional pre-filters and Bayer-to-RGB conversion, reducing load on the downstream CPU.

🏭

Multi-Axis Motor and Motion Control

The 10M40DAF672I7G is well matched to multi-axis motion controllers driving stepper or servo drives over EtherCAT, PROFINET, or EtherNet/IP. The 40K-LE fabric runs multiple PID loops concurrently, while 500 I/Os handle encoder feedback, limit-switch inputs, and PWM outputs across 4-6 axes. MAX 10 instant-on behavior ensures the drive is ready within milliseconds of power-up, critical for safety-rated machinery. The integrated ADC simplifies analog current sensing, eliminating an external ADC IC and reducing BOM cost.

🌐

Industrial Protocol Bridging

The 10M40DAF672I7G acts as a high-speed bridge between industrial fieldbusses such as EtherCAT, PROFINET, Modbus TCP, and legacy RS-485/Profibus. The 1.29 Mbit embedded memory buffers protocol frames without external SRAM for most use cases, and the 500 I/Os support multiple isolated PHY interfaces on the same board. Quartus Prime reference designs for EtherCAT and PROFINET slaves target the MAX 10 family, accelerating development. The non-volatile configuration eliminates boot delays typical of SRAM FPGAs.

🔧

Test and Measurement Front-End

The 10M40DAF672I7G is suitable as a flexible front-end for test and measurement equipment. The 500 user I/Os, many of which support LVDS, enable parallel ADC/DAC interfacing with sub-nanosecond skew matching. The DSP blocks run FFTs and digital down-conversion in real time, freeing the host CPU for analysis. MAX 10 instant-on allows the instrument to be ready immediately at power-up. The integrated 12-bit ADC handles auxiliary analog monitoring such as temperature or supply rail telemetry on the same PCB.

📱

Portable Point-of-Sale Terminals

The 10M40DAF672I7G supports POS terminals that need display aggregation, secure keypad handling, and multi-protocol connectivity. The on-chip user flash stores firmware and encryption keys safely, while the 500 I/Os drive LCD panels, NFC readers, and thermal printers concurrently. Industrial temperature grade (-40C to +100C junction) tolerates harsh retail environments. Although the 10M40 power budget is higher than smaller MAX 10 densities, mains-powered countertop POS terminals are well within thermal limits.

🧩

Sensor Aggregation and IoT Gateways

The 10M40DAF672I7G fits industrial IoT gateways aggregating multiple sensor types (analog, digital, serial, and bus-based). The integrated 12-bit ADC samples analog sensors directly, eliminating external ADC ICs. The 1.29 Mbit embedded memory buffers data during cloud transmission, and the 500 I/Os support many concurrent UART/SPI/I2C channels. The non-volatile flash enables over-the-air update staging with dual-configuration boot for fallback safety. Industrial temperature grade ensures reliable operation in factory-floor enclosures.

📺

LED Video Wall Controllers

The 10M40DAF672I7G drives small-to-medium LED video walls where its 500 I/Os provide enough LVDS lanes to drive multiple GCLK scan-board panels. DSP blocks perform brightness correction and gamma mapping in real time, and the 1.29 Mbit embedded memory holds frame buffers for several panels. The non-volatile instant-on boot eliminates visible reconfiguration flashes on power-up, important for commercial display installations. The industrial temperature grade handles enclosed display cabinet environments with limited airflow.

What is the logic element count of the 10M40DAF672I7G?
The 10M40DAF672I7G contains 40,000 logic elements (LEs), placing it in the upper mid-range of the MAX 10 family. Combined with 1,290,240 bits of embedded SRAM, it supports mid-complexity glue logic, parallel bus bridging, and DSP-centric designs. According to the Altera/Intel MAX 10 device overview, the '40' in '10M40' identifies the 40K-LE density tier.
How many user I/Os does the 10M40DAF672I7G provide?
The 10M40DAF672I7G provides 500 user I/Os in its 672-ball FBGA package. According to the MAX 10 datasheet, the high I/O count is enabled by selecting the largest package in the 10M40 family, making this OPN ideal for parallel external memory interfaces, multi-protocol industrial busses, and machine-vision aggregation where many LVCMOS/LVDS lanes are required.
Is the MAX 10 10M40DAF672I7G non-volatile?
Yes, the 10M40DAF672I7G is non-volatile. MAX 10 FPGAs integrate dual-configuration flash on-chip so the design loads at power-up without an external boot PROM. According to the MAX 10 device handbook, this instant-on behavior reduces bill-of-materials cost and simplifies PCB layout compared to SRAM-based FPGAs that require external configuration memory.
What is the difference between 10M40DAF672I7G and 10M40DAF672C8G?
The 10M40DAF672I7G is the industrial temperature grade with speed grade 7, while the 10M40DAF672C8G is the commercial temperature grade with speed grade 8. Both share the same 672-ball FBGA footprint, 40K LEs, and pinout, making them drop-in compatible. Choose I7G for industrial environments and C8G for benign commercial applications where higher speed is acceptable.
Where can I buy the 10M40DAF672I7G and what is the price?
The 10M40DAF672I7G is available from authorized distributors including DigiKey, Mouser, and Heisener. As of 2026-09-05, Heisener lists a unit price of approximately $109.75 for qty-1. Volume pricing drops below $90 at qty-100. Lead time for production quantities is typically 8-12 weeks; contact your distributor for an exact quote and current stock.
What is the lead time for the 10M40DAF672I7G?
As of 2026-09-05, the lead time for the 10M40DAF672I7G is listed as 'To be Confirmed' by Heisener with an estimated delivery of late December to early January. Inventory on third-party brokers varies; ordering through authorized distributors such as DigiKey or Mouser is recommended for guaranteed traceability. Plan 8-12 weeks for production-volume orders.
Is the 10M40DAF672I7G in stock at distributors?
As of 2026-09-05, distributor stock for the 10M40DAF672I7G varies: DigiKey and Mouser list the part in their catalogs with real-time stock, and Heisener shows 4,992 pieces available. For urgent prototypes, check DigiKey or Mouser first; for volume orders, request a quote to confirm factory lead time. Stock fluctuates with demand cycles.
10M40DAF672I7G vs 10M25DAF484C8G - which is better for industrial motor control?
For industrial motor control, the 10M40DAF672I7G is the better choice when you need maximum I/O count (500 vs 240) for multi-axis encoder feedback and parallel ADC sampling, plus larger logic capacity (40K vs 25K LEs) for control loops. The 10M25DAF484C8G is suitable for simpler single-axis designs and costs less. Both share MAX 10 instant-on architecture.
What is the best drop-in replacement for the 10M40DAF672I7G?
The best drop-in replacement for the 10M40DAF672I7G is the 10M40DAF672C8G (commercial temperature, speed grade 8) when industrial temperature range is not required. Both share the 672-ball FBGA footprint, identical pinout, and 40K-LE architecture. The C8G variant delivers higher Fmax but is limited to 0C to +85C; the I7G supports -40C to +100C junction.
When should I choose 10M40DAF672I7G over 10M40DAF256I7G?
Choose the 10M40DAF672I7G when you need 500 user I/Os for wide parallel buses or many encoder/ADC channels; the 256-ball FBGA 10M40DAF256I7G provides only 178 I/Os. Both share the same 10M40 logic fabric and 1.29 Mbit memory. The 672-ball package is also more PCB-routing friendly for high-speed DDR3 interfaces due to shorter matched-length paths.
Where can I download the 10M40DAF672I7G datasheet PDF?
The 10M40DAF672I7G datasheet is available as part of the MAX 10 device family datasheet PDF on the Altera/Intel website. Find it at https://www.altera.com/products/fpga/max/10/10m40-f672/10M40DAF672I7G or via the Intel FPGA documentation hub. Octopart also hosts a datasheet mirror; the document covers electrical characteristics, pinout, and configuration for the entire 10M40 family.
Where can I find the 10M40DAF672I7G pinout?
The 10M40DAF672I7G pinout is published in the MAX 10 device family datasheet on the Intel FPGA website. The 672-ball FBGA uses a 1.0 mm pitch grid array; pin assignment tables specify ball functions, I/O bank assignments, and dedicated configuration pins. Use the Quartus Prime Pin Planner tool to validate pin assignments against your schematic during development.
What are the key specifications of the 10M40DAF672I7G that engineers should know?
The 10M40DAF672I7G key specs are: 40K logic elements, 1,290,240 bits embedded SRAM, 500 user I/Os, 672-ball FBGA package, 55 nm non-volatile process, industrial temperature grade, speed grade 7, integrated 12-bit 1 Msps ADC, DSP blocks with 18x18 multipliers, and on-chip dual-configuration flash. It targets instant-on industrial applications where external boot memory is undesirable and high I/O count is required.
Is the 10M40DAF672I7G suitable for portable battery-powered designs?
The 10M40DAF672I7G is not ideal for portable battery-powered designs. With 40K LEs and 500 I/Os active, core current at 1.2V typically exceeds 1 A, which is high for battery budgets. For portable applications, consider the smaller MAX 10 densities (10M08, 10M04) or Cyclone 10 LP parts with sub-100 mA active power. The 10M40DAF672I7G suits mains-powered industrial equipment.

Datos de referencia de ingeniería para 10M40DAF672I7G — comparación, orientación de diseño e información de cumplimiento.

Guía de selección

Choose the 10M40DAF672I7G when you need MAX 10 instant-on non-volatile behavior in an industrial temperature environment with up to 500 user I/Os. It is the right choice for multi-axis motion control, machine vision aggregation, and industrial protocol bridging where the 40K-LE fabric and integrated ADC and DSP blocks eliminate external components. Choose the 10M40DAF672C8G instead when higher Fmax matters more than industrial temperature. Choose the 10M40DAF672C7G when a speed-grade-7 commercial-temperature part is acceptable. Avoid the 10M40DAF672I7G for battery-powered designs; consider smaller MAX 10 densities (10M08, 10M16) or Cyclone 10 LP instead.

Comparación con alternativas

Parámetro Este producto 10M40DAF672C8G 10M40DAF672C7G
Brand Intel Intel Intel
Package 672-ball FBGA 672-ball FBGA (same) 672-ball FBGA (same)
Logic Elements 40,000 40,000 40,000
Embedded Memory 1,290,240 bits 1,290,240 bits 1,290,240 bits
User I/Os 500 500 500
Speed Grade 7 8 (faster) 7
Temperature Grade Industrial (-40C to +100C) Commercial (0C to +85C) Commercial (0C to +85C)
Configuration Type Internal flash (non-volatile) Internal flash (non-volatile) Internal flash (non-volatile)
Integrated ADC 12-bit, 1 Msps 12-bit, 1 Msps 12-bit, 1 Msps

Diferenciadores clave

  • Industrial temperature grade with high-density I/O (frente a 10M40DAF672C8G)
  • Non-volatile instant-on configuration (frente a Cyclone IV EP4CE40F29 (SRAM FPGA, 780-pin BGA))
  • Integrated 12-bit ADC and DSP blocks (frente a CPLD-only solutions (e.g. EPM240))

Notas de diseño

The 672-ball FBGA uses a 1.0 mm pitch. Use a 4+ layer PCB with laser-drilled microvias (stacked or staggered) to fan out from inner balls. Maintain a continuous ground plane beneath the device to provide low-impedance return paths for high-speed LVDS pairs. Length-match differential pairs (typically within 150 mil) and reference each layer to an unbroken ground plane to control impedance (100 ohm differential for LVDS). Avoid routing signals across plane splits.

MAX 10 FPGAs require a clean power-on-reset (POR) ramp on VCCINT (1.2 V core). Use a sequenced power supply or a supervisor IC to ensure VCCA (2.5 V analog) and VCCIO (per-bank) come up within the datasheet-defined windows. Place 0.1 uF and 10 uF decoupling capacitors within 100 mil of each power pin. Estimated: total core current at 40K LE utilization with 100 MHz operation can exceed 500 mA; verify thermal dissipation via the Quartus Prime Early Power Estimator before finalizing the design.

Do not confuse the MAX 10 I7G temperature grade with AEC-Q100 automotive qualification; MAX 10 devices are not AEC-Q100 qualified. For automotive designs, verify compliance with a separate AEC-Q100 component. Also note that dual-configuration flash supports two images, but image-switch on boot-failure requires correct CFM0/CFM1 programming via the Quartus Programmer. Finally, JTAG chain integrity must be verified on the assembled board before production programming.

Información de cumplimiento

RoHS
Compliant
REACH
Compliant
AEC-Q100
Not Qualified
Libre de plomo
Yes
Libre de halógenos
[Data Needed: Halogen-Free Status]
Minerales en conflicto
Compliant

RoHS compliant per Altera/Intel product page. MSL 3 per Vyrian listing. Not AEC-Q100 qualified - do not use in automotive safety-critical designs without separate verification. Halogen-free status not explicitly stated in the verified web data.

Datos verificados el: 2026-09-05 — datos verificados y seleccionados por el equipo de ingeniería de componentes de XAIPART

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10M40DAF672I7G 10M40DAF672I7G datasheet Intel MAX 10 FPGA 40K MAX 10 672-ball FBGA FPGA 10M40DAF672I7G price buy MAX 10 vs Cyclone 10 LP non-volatile FPGA 500 I/O industrial MAX 10 drop-in replacement 10M40DAF672I7G motor control EtherCAT MAX 10 integrated ADC 12-bit FPGA what is the user I/O count of 10M40DAF672I7G MAX 10 pinout 672 FBGA ball map Altera MAX 10 10M40 industrial temperature

Componentes & términos relacionados

Intel Altera 10M40DAF672I7G 10M40DAF672C8G 10M40DAF672C7G MAX 10 FPGA CPLD Field Programmable Gate Array non-volatile FPGA FBGA BGA 672-ball FBGA logic element DSP block embedded memory integrated ADC AEC-Q100 RoHS REACH EtherCAT PROFINET machine vision industrial motor control Quartus Prime
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