10M40DAF672C8G - MAX 10 FPGA, 40K LE, 672-FBGA | Intel / Altera
N.º de pieza: 10M40DAF672C8G ✓ Activo| Cant. | Precio unitario | Total |
|---|---|---|
| 1 | $142.5 | $142,50 |
| 10 | $128.2 | $1.282,00 |
| 100 | $112.75 | $11.275,00 |
| 500 | $98.4 | $49.200,00 |
| 1.000 | $86.1 | $86.100,00 |
10M40DAF672C8G Descripción general
A Field Programmable Gate Array (FPGA) is a semiconductor integrated circuit composed of configurable logic blocks (CLBs), programmable interconnects, and I/O tiles that engineers can re-program to implement arbitrary digital logic, DSP functions, or memory interfaces. MAX 10 FPGAs belong to the non-volatile FPGA family, a sub-class of programmable logic devices (PLDs) that integrate configuration flash on-die. Within the broader programmable logic taxonomy, MAX 10 sits between small CPLDs and higher-density Cyclone/Cyclone V devices, offering up to 50K logic elements with low static power and single-chip boot for industrial, automotive, and consumer applications.
Key features include 40K logic elements, 1,290,240 bits of user flash memory, a hard DDR3 memory controller, integrated PLLs, and 500 user I/O pins supporting LVDS, LVCMOS, and SSTL I/O standards. The 672-FBGA package exposes 16 global clock networks, dedicated 18x18 multipliers, and an embedded ADC block on selected MAX 10 variants, making the 10M40 well suited for mixed-signal bridge designs.
Architecture details: the 10M40 uses an LUT-based logic fabric with 8-input fracturable look-up tables, distributed M9K memory blocks, and MLAB memory. The 672-ball FBGA package offers signal integrity advantages for high-speed DDR3 interfaces up to 300 MHz. Dual-configuration flash supports remote field updates, a critical feature for industrial IoT endpoints.
Typical applications include industrial motor control, factory automation bridges, video processing pipelines, LED display controllers, and portable medical instrumentation. The on-die flash simplifies BOM, and the integrated ADC eliminates an external analog front end for sensor conditioning.
When designing with the 10M40DAF672C8G, plan I/O bank partitioning carefully - the 672-FBGA exposes eight I/O banks, each with independent VCCIO rails. Use the Quartus Prime PowerPlay early power estimator to validate thermal budget before PCB layout, since BGA fan-out requires 0.8 mm or finer trace/space.
This page consolidates distributor stock, validated drop-in alternatives, and design notes that complement the manufacturer datasheet, helping procurement and engineering teams evaluate the 10M40DAF672C8G quickly.
Alternativas directas para 10M40DAF672C8G — mismo encapsulado, compatible pin a pin. Se excluyen las piezas de otro encapsulado que requieren retrabajo de la PCB.
Variantes de esta serie
Modelos de la misma serie compatibles directamente con 10M40DAF672C8G (mismo factor de forma y huella) — difiere en Package, Configuration Memory, Operating Temperature, Speed Grade, DSP Blocks.
Herramienta de comparación rápida — seleccione piezas alternativas para compararlas lado a lado:
10M40DAF672C7G
✅ Sustitución directa✓ En stock
$67.2 / unidad
Ver hoja de datos →10M40DCF672C8G
✅ Sustitución directa✓ En stock
$60.4 / unidad
Ver hoja de datos →10M40DAF484C7G
✅ Sustitución directa✓ En stock
$92.4 / unidad
Ver hoja de datos →10M40DAF672C8G Valores máximos y características eléctricas
| Family | MAX 10 FPGA |
| Logic Elements | 40,000 |
| Embedded Memory (bits) | 1,290,240 |
| User Flash (bits) | 1,290,240 |
| Maximum User I/O | 500 |
| Encapsulado | 672-ball FBGA (F672) |
| Process Technology | 55 nm |
| Core Voltage | 1.2 V |
| Configuration Method | On-die flash (instant-on) |
| I/O Standards | LVDS, LVCMOS, SSTL, HSTL |
| Temperatura de funcionamiento | 0 C to +85 C (commercial) |
| Tipo de montaje | Surface Mount (BGA) |
| Nivel MSL | 3 (168 hours) |
| Estado RoHS | Compliant |
| Lead-Free | Yes |
Guía de configuración de pines de 10M40DAF672C8G 672-ball fbga (f672)
Configuración de pines para 10M40DAF672C8G (encapsulado 672-ball fbga (f672)). Este CI digital incluye GPIO, interfaces de comunicación (UART, SPI, I2C) y pines de alimentación. Consulte la hoja de datos del fabricante para conocer las funciones alternativas de los pines y las opciones de configuración. Esencial para el diseño de sistemas embebidos y el diseño de PCB.
No hay datos detallados de patillaje disponibles para 10M40DAF672C8G.
Consulte la hoja de datos para ver la configuración completa de patillas.
Aplicaciones típicas
10M40DAF672C8G es adecuado para 6 aplicacións: Industrial Motor Control, Video Processing Bridge, LED Display Controller, Factory Automation Bridge (Fieldbus-to-Ethernet), Portable Medical Instrumentation, IoT Edge Gateway.
Industrial Motor Control
The 10M40DAF672C8G's 40K logic elements and on-die ADC make it a strong fit for industrial motor-control loops. Engineers typically implement field-oriented control (FOC) state machines in the LUT fabric, drive PWM signals through 500 user I/Os, and sample phase currents via the embedded ADC. The 672-FBGA package exposes sufficient LVDS pairs for high-resolution encoder feedback, and the 1.2 V core keeps dissipation low enough for fan-less DIN-rail enclosures. Unlike larger Cyclone V devices, the 10M40 instant-on flash eliminates external boot PROMs and shortens safe-torque-on latency, a critical parameter for Category 3/PL d safety architectures.
Recomendado
Video Processing Bridge
In video bridging applications, the 10M40DAF672C8G converts between HDMI, MIPI, and LVDS streams using its 40K logic elements and 1.29 Mbit of M9K block memory. The 672-FBGA package supports the high pin count required for parallel RGB and 24-bit LVDS interfaces. DDR3 memory controllers sustain frame-buffer bandwidth up to 300 MHz. Compared with discrete ASSP bridges, the MAX 10 lets designers add custom overlays, OSD, or color-space conversion without external glue logic. On-die flash enables field firmware updates for evolving broadcast protocols.
Recomendado
LED Display Controller
The 10M40DAF672C8G drives large LED video walls by multiplexing thousands of pixels across 500 user I/Os. Designers implement gamma correction tables in M9K block RAM and use the hard PLL to generate pixel clocks. The 672-FBGA package offers ample LVDS channels for high-speed hub-to-panel links, while the 1.2 V core keeps board power within thermal limits of sealed outdoor enclosures. Instant-on flash configuration ensures that display cabinets boot without a separate PROM, a key reliability advantage over Cyclone V reference designs in 24/7 signage deployments.
Recomendado
Factory Automation Bridge (Fieldbus-to-Ethernet)
For Industry 4.0 retrofit, the 10M40DAF672C8G bridges Profinet, EtherCAT, Modbus, and legacy RS-485 fieldbuses to Ethernet. Its 40K logic elements implement protocol stacks in soft IP, while 500 user I/Os accept the multi-standard physical interfaces found in brownfield PLCs. The 672-FBGA package supports the high-speed transceiver count needed for dual-port Ethernet switches, and the on-die ADC monitors backplane voltages for predictive maintenance. Compared to dedicated protocol ASSPs, the MAX 10 cuts bill of materials by integrating configuration flash and reducing external clock sources.
Recomendado
Portable Medical Instrumentation
The 10M40DAF672C8G powers portable patient-monitoring and diagnostic devices where 40K logic elements run DSP filter chains and the on-die ADC digitizes ECG or pulse-oximeter signals. The 672-FBGA package's small footprint and 1.2 V core extend battery life, while instant-on flash shortens clinician-initiated boot time - a measurable usability win for handheld ultrasounds. The hard DDR3 controller buffers high-bandwidth image streams, and integrated PLLs synthesize the multiple clock domains required by mixed analog/digital subsystems, reducing external components.
Recomendado
IoT Edge Gateway
In IoT edge gateways, the 10M40DAF672C8G aggregates sensor data over SPI, I2C, UART, and CAN, then performs local analytics before forwarding to the cloud via Ethernet. The 40K logic elements run TLS termination and lightweight ML inference, while 500 user I/Os accommodate many concurrent field sensors. The 672-FBGA package exposes LVDS lanes for high-speed camera links and the on-die ADC reads battery and rail telemetry. Instant-on flash means the gateway recovers after power-loss events without external boot memory, simplifying deployment in unattended remote cabinets.
Recomendado
Resumen de productos recomendados
Datos de referencia de ingeniería para 10M40DAF672C8G — comparación, orientación de diseño e información de cumplimiento.
Guía de selección
Comparación con alternativas
| Parámetro | Este producto | 10M40DAF672C7G | 10M40DCF672C8G | 10M40DAF484C7G |
|---|---|---|---|---|
| Brand | Intel | Intel | Intel | Intel |
| Package | 672-ball FBGA (F672) | 672-ball FBGA (F672) | 672-ball FBGA (F672) | 484-ball FBGA (F484) - different package |
| Logic Elements | 40,000 | 40,000 | 40,000 | 40,000 |
| Speed Grade | C8 | C7 (faster) | C8 | C7 (faster) |
| Embedded SRAM (bits) | 1,290,240 | 1,290,240 | 1,290,240 | 1,290,240 |
| ADC Block | Yes | Yes | No (DC variant) | Yes |
| Configuration Flash | On-die (instant-on) | On-die (instant-on) | On-die (instant-on) | On-die (instant-on) |
| Core Voltage | 1.2 V | 1.2 V | 1.2 V | 1.2 V |
Diferenciadores clave
- Integrated ADC with 1 MSPS, 12-bit resolution (frente a 10M40DCF672C8G)
- Cost-optimized C8 speed grade (frente a 10M40DAF672C7G)
- On-die configuration flash for instant-on (frente a 10M40DAF484C7G)
Notas de diseño
The 672-ball FBGA requires 0.8 mm or finer PCB trace/space. Use a 4-6 layer stack-up with continuous ground planes beneath the BGA to control return paths. Estimate: with 1 oz copper on outer layers and 0.5 oz on inner layers, allocate at least two inner layers as solid GND planes to maintain DDR3 signal-integrity margins. Via-in-pad with filled and plated-over vias is recommended for the BGA breakouts to maximize routing channel density.
Estimate the core current using the Quartus Prime PowerPlay Early Power Estimator before committing to a regulator. A typical 10M40 design at 40% toggle rate and 100 MHz clock draws 350-500 mA from VCC (1.2 V). Use a low-dropout regulator with 1.5 A headroom and place decoupling as 0402/0201 ceramics within 2 mm of each supply ball. Add a bulk 47 uF tantalum or polymer cap near the FPGA to suppress transient load steps during clock-tree switching.
Do not assume the 10M40DCF672C8G and 10M40DAF672C8G are interchangeable - the DC variant lacks the on-die ADC block. If your design uses the ADC for sensor monitoring, replacing DA with DC will silently fail at bring-up. Conversely, do not assume the 10M40DAF484C7G is drop-in compatible with the 672-ball version - the 484-FBGA has a different ball map and reduced I/O count, requiring PCB respin.
Información de cumplimiento
RoHS and lead-free compliance verified per Intel MAX 10 product page. AEC-Q100 not applicable for commercial-grade MAX 10; industrial variants available separately. Halogen-free status not stated in verified data - marked unknown.