Circuitos integrados

XMC4800-E196K2048AA

XMC4800-E196K2048AA - 144MHz Cortex-M4 MCU | Infineon

Infineon Technologies XMC4800-E196K2048AA is an industrial 32-bit Arm Cortex-M4 microcontroller operating at 144 MHz, with 2048 kB of embedded flash memory, Ethernet connectivity, and a 196-pin PG-LFBGA package. The device belongs to the XMC4000 family and combines a real-time microcontroller core with industrial communication and mixed-signal capabilities. Its stated operating voltage is 3.3 V, and the verified product information identifies the part for embedded industrial control, networked automation, and EtherCAT-connected equipment. An Arm Cortex-M4 microcontroller is a 32-bit embedded processor based on the ARMv7E-M architecture and optimized for real-time control systems. The Cortex-M4 core combines deterministic exception handling, compact instruction processing, and support for efficient digital signal-processing instructions. Within the broader semiconductor hierarchy, this device is an embedded microcontroller, part of the integrated-circuit category, and specifically designed for industrial automation rather than general-purpose computing. The XMC4800-E196K2048AA provides 144 MHz processing performance, 2048 kB of on-chip program flash, and integrated Ethernet. These features allow firmware, communications software, control logic, and field-bus services to execute from one integrated device. The verified product description also identifies on-chip flash and analog or mixed-signal capabilities. Its industrial positioning and stated 125°C ambient-temperature capability distinguish it from general-purpose microcontrollers intended for consumer or office environments. The EtherCAT capability associated with the XMC4800 family is important for industrial automation because EtherCAT provides deterministic Ethernet-based communication between controllers and distributed I/O devices. Integrating communications processing with a 144 MHz Cortex-M4 core can reduce system complexity compared with a separate microcontroller and communications controller. The 196-pin LFBGA package also provides a substantial pin count for mixed-signal, communications, debug, and application-specific interfaces, although its land grid requires careful PCB layout and inspection. Typical applications include EtherCAT servo drives, programmable automation controllers, industrial Ethernet gateways, motor-control equipment, factory-floor I/O modules, and embedded condition-monitoring systems. In each case, the Ethernet interface supports networked control, while the Cortex-M4 processing capacity accommodates real-time algorithms and communications stacks. The 3.3 V supply and 125°C ambient-temperature specification make the device suitable for industrial environments when the complete circuit, storage, and thermal design remain within their respective limits. Designers should verify all 196 BGA assignments against the official Infineon datasheet before layout and must provide suitable decoupling, clock circuitry, programming access, and Ethernet physical-layer implementation. The package requires careful escape routing and assembly inspection, and firmware memory planning should account for the 2048 kB flash capacity. Exact peripheral availability, electrical limits, and recommended operating conditions should be confirmed in the manufacturer datasheet. This page consolidates the verified Infineon specifications, distributor pricing, package information, and practical application guidance. It also distinguishes confirmed drop-in alternatives from variants that cannot safely be treated as replacements, helping engineers evaluate the XMC4800-E196K2048AA without relying on unverified cross-reference listings.

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XMC4800F144K2048AA

XMC4800F144K2048AA - 144MHz Cortex-M4 MCU | Infineon

Infineon XMC4800F144K2048AA is an industrial 32-bit ARM Cortex-M4 microcontroller with a 144 MHz processor, 2048 kB of flash memory, and integrated 10/100 Mbit/s Ethernet connectivity, supplied in a 144-pin LQFP package. The XMC4800 combines general-purpose embedded control with Ethernet and EtherCAT-oriented industrial connectivity in a single device. An ARM Cortex-M4 microcontroller is a 32-bit embedded processor based on the ARMv7E-M architecture family and commonly integrates peripherals, memory interfaces, and real-time control functions. Microcontrollers sit within the broader semiconductor hierarchy and are widely used as the central controller in industrial automation, networking equipment, motor-control systems, and connected embedded products. The XMC4800 specifically targets industrial and energy-efficient real-time applications. The XMC4800's headline characteristics are its 144 MHz Cortex-M4 operating frequency, 2048 kB flash configuration, and 10/100 Mbit/s Ethernet interface. Its flash capacity provides room for application code, networking stacks, and EtherCAT-related software, while the Ethernet interface allows direct connection to industrial networks without requiring a separate controller. Distributor records identify a 12-bit conversion feature and an operating temperature range of -40°C to +125°C. The device belongs to Infineon's XMC4000 family and is presented as an industrial microcontroller with DSP and FPU capabilities in the family documentation. This combination is relevant to industrial controls that must execute control algorithms, communicate over Ethernet, and maintain deterministic timing. The verified distributor listing identifies the component as a 32-bit Cortex-M4 MCU with 2 MB of flash in an LQFP-144-24 package. Typical applications include EtherCAT industrial nodes, factory automation controllers, industrial Ethernet equipment, real-time motor-control platforms, and connected sensor systems. In these systems, the XMC4800 can manage application processing and network communication within one package. Its 144 MHz Cortex-M4 core and integrated Ethernet connectivity reduce the need for separate processing and communication components when board area and integration are priorities. Designers should verify the complete pin assignment, peripheral availability, power requirements, clock configuration, and package details in the manufacturer datasheet before layout. Because this 144-pin LQFP device offers many mixed-signal and interface functions, careful partitioning of power, Ethernet, clock, and debugging nets is important. The complete 144-pin electrical pinout was not included in the supplied verified data and therefore must not be inferred from generic XMC4000 documentation. This page consolidates the verified manufacturer and distributor information, separates known XMC4800 characteristics from missing electrical details, and documents drop-in ordering-code candidates without presenting unverifiable substitutions. It also provides application guidance, comparison parameters, and sourcing considerations for engineers evaluating the XMC4800F144K2048AA.

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XMC6221SCQ024XABXUMA1

XMC6221SCQ024XABXUMA1 - Wireless-Charging MCU | Infineon

Infineon Technologies XMC6221SCQ024XABXUMA1 is a microcontroller IC in the XMC6000 family, specifically the XMC6200 series, designed for adapter and charger applications. The ordered part is also indexed as a wireless charging IC, placing it in the power-management control category associated with wireless power adapters. Its exact package, core configuration, flash capacity, timing range, and electrical limits must be confirmed from the Infineon datasheet and ordering information before a PCB design is released. A microcontroller is a programmable semiconductor that integrates a processor core, memory, peripherals, and interface circuitry into one device. In an adapter or charger, this functional category controls input negotiation, power-stage timing, fault handling, communication, and protection sequencing. The XMC6000 family therefore serves as the embedded control center between the power-conversion hardware and the external charging system. The Infineon product page identifies XMC6221SC-Q024X-AB as an XMC6000-family, XMC6200-series device for adapters and chargers. The full orderable identifier XMC6221SCQ024XABXUMA1 identifies the specific ordering configuration used by distributors. The manufacturer's documentation should be consulted for the exact package dimensions, pin assignments, flash-memory configuration, clock architecture, analog and digital peripherals, operating-voltage range, and temperature ratings. This device is relevant to wireless-charging power adapters that need deterministic control of the primary switching stage and coordinated management of faults. It can also be considered for conventional charger and adapter platforms when the product's voltage, current, communication, and safety requirements match the manufacturer's electrical limits. Firmware qualification, electromagnetic compatibility testing, and production fault-mode analysis remain essential parts of any charger design. Typical design work begins by assigning every XMC6221SCQ024XABXUMA1 pin according to the manufacturer pin-description table and then reviewing the power architecture. The designer should confirm which pins provide supply voltage, ground, reset, programming access, switching-control outputs, and communications. Component population and analog-network values must also follow the reference circuit associated with the selected package and ordering option. Before schematic capture, verify the exact package and exposed-pad requirements directly in the Infineon ordering information. Check the recommended operating area, absolute maximum ratings, flash endurance, clock tolerance, and reset behavior. Layout planning must then provide adequate copper for thermal dissipation and clean grounding for the switching stage, especially when the controller is mounted near a high-current power converter. This product page combines the confirmed XMC6000-family classification, adapter and charger positioning, ordering identifiers, and sourcing links with engineering-focused design guidance. It also distinguishes verified product identity from specifications that still require direct confirmation from the manufacturer datasheet, helping teams evaluate the XMC6221SCQ024XABXUMA1 without overlooking critical footprint and qualification checks.

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XMC6521SCQ040XAAXUMA1

XMC6521SCQ040XAAXUMA1 - ARM Cortex-M0 Wireless Power MCU | Infineon Technologies

The Infineon Technologies XMC6521SCQ040XAAXUMA1 is an application-specific ARM Cortex-M0 microcontroller in the XMC1000 family, designed for real-time control in wireless power systems. The device is identified as a wireless charging controller MCU with 40 KB of flash memory and a 40-pin VFQFN exposed-pad package. Its ARM Cortex-M0 processor core supports deterministic control of wireless power-transfer systems requiring low-latency peripheral handling and compact embedded processing. An application-specific microcontroller is an integrated circuit optimized for a defined equipment category rather than a general-purpose processor. The XMC1000 family combines an ARM Cortex-M0 core with embedded control peripherals suited to real-time power conversion and communication tasks. This makes the XMC6521SCQ040XAAXUMA1 appropriate for wireless charging transmitters, receivers, power-conversion control, and embedded systems that coordinate coil drive, feedback, protection, and user-interface functions. The XMCXXXXSC series addresses wireless power system control requirements, according to the XMC6521SCQ040XAAXUMA1 datasheet listing. The Cortex-M0 architecture provides a compact instruction set and efficient event-driven execution, while the 40 KB embedded flash supports application firmware for power-loop control, communication protocols, state machines, and system supervision. The 40-VFQFN exposed-pad package supports high-density PCB layouts but requires careful thermal and layout planning. The 40-VFQFN exposed pad improves heat transfer from the device to the PCB when the pad is properly soldered and connected to a thermal plane. In a wireless power converter, the MCU typically supervises bridge or resonant-converter switching decisions, interprets voltage and current feedback, manages fault conditions, and coordinates auxiliary functions such as foreign-object detection or communications. For PCB design, place input and output decoupling capacitors close to the corresponding supply and ground pins, provide a low-impedance return path beneath the exposed pad, and keep high-current switching loops compact. Route sensitive feedback signals away from power-stage switching nodes, use a continuous ground reference, and follow the pin-description table in the manufacturer datasheet when assigning tracks and test points. The XMC6521SCQ040XAAXUMA1 is listed by Infineon Technologies as an ARM Cortex-M0 XMC1000 wireless power controller microcontroller in a 40-VFQFN exposed-pad package. Request the current price, stock status, and lead time through the Request a Quote form on this page.

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XMC7201SCQ024XABXUMA1

XMC7201SCQ024XABXUMA1 - Dual-Core M7 MCU | Infineon

The Infineon Technologies XMC7201SCQ024XABXUMA1 is an industrial ARM microcontroller in the XMC7200 family, integrating two Arm Cortex-M7 CPUs for primary processing and one Arm Cortex-M0+ CPU for peripheral and security processing. Its embedded connectivity includes Controller Area Network with Flexible Data rate and Gigabit Ethernet, while the complete orderable part is supplied in a grade described by Infineon as having extended longevity, being halogen free, and complying with RoHS. An ARM microcontroller is a programmable semiconductor that integrates a processor core, memory interfaces, communication peripherals, timers, interrupt logic, and general-purpose I/O on one device. In the product hierarchy, the XMC7201SCQ024XABXUMA1 is a 32-bit microcontroller, an embedded-processing IC, and a member of the XMC family designed for industrial control, communications, networking, and connected equipment. The family's defining feature is heterogeneous processing. The two Cortex-M7 cores can divide demanding control and communications workloads, while the Cortex-M0+ core provides an independent domain for peripheral control and security-related tasks. The embedded CAN FD interface supports higher-capacity, flexible automotive or industrial network communication, and Gigabit Ethernet provides high-bandwidth connectivity to a controller, switch, or network infrastructure. The XMC7200 architecture combines those processors with embedded peripherals rather than relying only on external communication devices. CAN FD and Gigabit Ethernet are the clearest application-facing interfaces in the manufacturer datasheet. This makes the family appropriate for industrial gateways, networked controllers, adapter and charger platforms, and connected automation equipment that must combine real-time control with Ethernet communication. Typical uses include industrial Ethernet gateways, CAN FD communication hubs, adapter and charger controllers, programmable automation equipment, and connected industrial sensors. The extended-longevity positioning makes the device especially relevant to industrial programs where supply continuity, PCB compatibility, and lifecycle management matter. Software support should be selected for the complete ordering code rather than only the abbreviated XMC7201SC-Q024X-AB designation. Before schematic capture, confirm the exact lead configuration, exposed-pad requirements, pin multiplexing, and recommended decoupling from the Infineon package drawing and datasheet. Preserve the manufacturer's startup, clock, memory, and peripheral-instantiation requirements. Firmware configuration must account for all three CPU domains and should be validated for interrupt routing, Ethernet initialization, and CAN FD timing. This page organizes the manufacturer specifications, sourcing guidance, application fit, and engineering cautions around the complete XMC7201SCQ024XABXUMA1 ordering code. It also distinguishes the product's industrial connectivity features from generic microcontroller capabilities and highlights the design checks needed before layout or firmware deployment.

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XMC7241SCQ040XAAXUMA1

XMC7241SCQ040XAAXUMA1 ARM Microcontroller | Infineon

Infineon Technologies XMC7241SCQ040XAAXUMA1 is an ARM microcontroller IC listed in the XMC1000 series and identified by distributor product records as an Infineon microcontroller. The exact orderable suffix identifies an automotive-oriented XMC configuration, while its core architecture, memory configuration, operating limits, peripherals, and package dimensions remain tied to the manufacturer documentation. The device is suitable for compact embedded-control systems that require an established Infineon MCU platform and production sourcing under the exact XMC7241SCQ040XAAXUMA1 ordering code. An ARM microcontroller is a programmable semiconductor that combines a processor core, memory interfaces, peripherals, and communication resources on one integrated circuit. Within the product hierarchy, the XMC device is an embedded microcontroller, part of the ARM MCU category, and belongs to the broader embedded-control semiconductor market. Such devices are programmed to supervise actuators, read sensors, communicate with external circuits, and execute real-time control functions in industrial, automotive, and communications equipment. The decisive selection criteria for this exact MPN are its package, pin arrangement, core specification, flash and SRAM capacity, operating-voltage range, temperature rating, peripheral set, qualification status, and software-development support. These characteristics must be matched against the target PCB and firmware before ordering. The suffix contains the commercial ordering information, but the suffix alone should not be treated as a substitute for the package data table and pin description in the Infineon documentation. This device is intended for embedded applications where a compact ARM-based controller can manage multiple digital interfaces and deterministic control tasks. Relevant designs may include automotive control modules, industrial automation equipment, communications equipment, sensor hubs, and compact power or motor-control systems. Final suitability depends on whether the required peripherals, timing resources, memory, and I/O voltage assumptions match the design. The exact electrical limits must be checked against the worst-case operating conditions rather than inferred from the product family. Before schematic capture, confirm the physical package, exposed-pad requirements, pin multiplexing, and PCB land pattern from the Infineon package drawing. Decoupling, grounding, signal-integrity, and power-distribution layout should follow the reference circuitry in the manufacturer documentation. If the PCB already exists, compare every connected pin, supply requirement, and exposed thermal connection rather than relying only on the XMC family name. This page consolidates the exact commercial MPN, structured purchase information, application guidance, and engineering checks into one product record. It deliberately avoids substituting a visually similar XMC order code. For a controlled new design, request the current manufacturer documentation and use the complete part number shown above as the single source of truth for sourcing, firmware hardware definitions, and PCB compatibility. The Infineon XMC7241SCQ040XAAXUMA1 remains a practical choice when an ARM-based embedded controller is required and the design team can verify the exact package, electrical limits, qualification requirements, and software support. Use the Request a Quote form for current commercial availability and lead-time confirmation. Obtain the manufacturer datasheet and package drawing before releasing the PCB or production BOM.

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XMC8231SCQ024XABXUMA1

XMC8231SCQ024XABXUMA1 ARM MCU | Infineon Technologies

Infineon Technologies XMC8231SCQ024XABXUMA1 is an ARM-based XMC8000 microcontroller intended for industrial adapters and chargers. The device combines embedded control processing, programmable digital interfaces, and mixed-signal peripherals in a single microcontroller platform designed for compact power-conversion equipment. Its RoHS-compliant and halogen-free construction supports environmentally conscious product designs, while the broad integration reduces the need for external control components. An XMC microcontroller belongs to the embedded-processing hierarchy: XMC8000 series microcontroller, ARM microcontroller, 32-bit embedded controller, integrated circuit, and semiconductor. Unlike a discrete logic controller, this device consolidates control logic, peripheral interfaces, timing functions, and analog signal handling around an embedded processor core. That architecture is useful when an industrial power supply needs deterministic supervisory control, communication, fault handling, and configurable analog functions without relying on a separate processor. The XMC8231SC-Q024X-AB ordering family is identified by Infineon as an XMC8000 microcontroller for adapters and chargers. Its RoHS compliance and halogen-free status are stated on the manufacturer product page. These attributes matter for power-supply products because system designers must coordinate environmental requirements with component documentation, production controls, and end-product certifications. Because the complete electrical characteristics table, memory configuration, clock ratings, peripheral list, and package dimensions must be confirmed from the manufacturer datasheet, engineers should use the official ordering information before finalizing a design. In particular, confirm the exact pin assignment, peripheral availability, operating limits, clock configuration, conversion performance, and exposed-pad requirements for the complete ordering code. Typical application roles include digitally controlled adapter power supplies, charger controllers, industrial power-conversion modules, and compact external power supplies. In these systems, the microcontroller can coordinate feedback control, supervise voltage and current conditions, manage protection states, and support communication with a higher-level controller. The integrated approach can also reduce board area and the number of discrete components when compared with a solution assembled from separate logic devices. A successful implementation begins with the manufacturer pin-description and characteristic tables. Verify startup behavior, clock requirements, analog reference handling, communication pins, and the thermal pad connection on the exact package variant. Prototype the control firmware with realistic load transitions and fault cases before production, especially for designs that depend on accurate current measurement or safety-related shutdown behavior. This page organizes the confirmed XMC8000 identity, environmental attributes, application fit, sourcing information, and engineering validation points into a concise engineering reference. Use the manufacturer ordering page and datasheet as the final authority for electrical limits, memory, peripherals, pinout, and lifecycle decisions.

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XMC8511SCQ040XAAXUMA1

XMC8511SCQ040XAAXUMA1 - Cortex-M0 Power MCU | Infineon

The Infineon XMC8511SCQ040XAAXUMA1 is an ARM Cortex-M0 application-specific microcontroller in a 40-pin VQFN exposed-pad package. It belongs to the XMC8500 family for industrial power-control applications, including PC docking, audio systems, electric vehicles, adapters, and chargers. The device combines a 40-pin VQFN footprint, ARM Cortex-M0 processing capability, and embedded flash in a compact surface-mount package. An application-specific microcontroller is a semiconductor that integrates a processor core, memory, and interfaces tailored to a particular equipment category. The XMC8500 family occupies the microcontroller hierarchy within embedded semiconductors and industrial control ICs. Compared with a general-purpose microcontroller, this device is optimized around power-conversion control, peripheral monitoring, communications, and compact industrial-system tasks where deterministic control, limited board area, and integrated control functions are important. The manufacturer identifies the XMC8511SC-Q040X-AA as an industrial XMC8500-family device for PC docking, audio, electric-vehicle, adapter, and charger platforms. Its 40-pin VQFN exposed-pad package supports dense PCB layouts and provides a thermal and electrical connection to the board through its exposed pad. Tape-and-reel packaging supports automated production. The product listing identifies the device as active and RoHS3 compliant. The ARM Cortex-M0 core provides a compact embedded-control architecture for supervisory, sequencing, communication, and power-management tasks. Because the XMC8511 is application-specific rather than a generic Cortex-M0 MCU, designers should use the Infineon pin-description and peripheral-assignment tables when defining board nets. The exposed pad must be connected according to the manufacturer land-pattern and thermal recommendations rather than treated as an optional NC land. Typical applications include wireless power and charging adapters, audio power-control systems, PC docking equipment, electric-vehicle auxiliary controllers, industrial adapters, and compact power-conversion products. In these systems, the MCU can coordinate control loops, supervise analog or power stages through dedicated peripherals, manage communication interfaces, and enforce safe operating sequences. Exact flash, SRAM, clock, analog, and communication ratings should be selected from the exact ordering-code table in the manufacturer datasheet. The primary design consideration is package-aware PCB implementation. Place the exposed pad on a properly sized copper area, follow the manufacturer’s land pattern, and route high-current or fast-switching power-stage connections away from sensitive control signals. Confirm signal levels, pin multiplexing, clock configuration, peripheral availability, and startup behavior against the datasheet before releasing a production schematic. This page organizes the XMC8511SCQ040XAAXUMA1 for engineering evaluation by connecting its product identity, package, compliance, application context, alternative-device assessment, and practical implementation guidance. It is designed to help engineers narrow the correct XMC8500-family option while keeping PCB, firmware, thermal, and sourcing decisions tied to the exact Infineon ordering information.

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XMC8531SCQ040XAAXUMA1

XMC8531SCQ040XAAXUMA1 - ARM Cortex-M0 Wireless Power MCU | Infineon

Infineon Technologies XMC8531SCQ040XAAXUMA1 is an application-specific ARM Cortex-M0 microcontroller for wireless power controller and power-conversion applications, supplied in a 40-pin VFQFN exposed-pad package. The device operates from a 3.3 V to 5.5 V supply range and is specified for an ambient temperature range of -40 °C to +105 °C. Its position within the XMC8000 family makes it suitable for adapters, inductive charging equipment, information and communication technology equipment, PC docking systems, home audio products, and light electric vehicles. An application-specific microcontroller, or MCU, is an integrated semiconductor device that combines a CPU core, program memory, data memory, peripherals, and communication interfaces into one compact package. The XMC8531 belongs to the XMC8000 product family and uses an ARM Cortex-M0 core. This architecture places the MCU in the broader hierarchy of embedded processors, microcontrollers, and semiconductor devices, where it controls power-conversion behavior and handles communication between the power stage and the external system. The XMC8531SCQ040XAAXUMA1 is identified as an XMC1000 wireless power controller in distributor product records, while the manufacturer describes the XMC8531SC-Q040X-AA device as an XMC8000 microcontroller. The exact memory configuration, clock characteristics, digital peripherals, analog features, and package dimensions must be confirmed from the manufacturer datasheet and ordering information before schematic capture or PCB layout is finalized. The 40-VFQFN exposed-pad package supports compact, high-density power-conversion layouts where the pad can be connected to a thermal and ground copper plane. Thermal performance depends on the PCB copper area, copper layers, airflow, nearby heat sources, and the operating duty cycle. The exposed pad must follow the manufacturer's recommended land pattern and thermal-via arrangement rather than being treated as an optional mechanical feature. Typical applications include wireless power adapters, charging cradles, industrial power modules, home-audio charging accessories, notebook and PC docking equipment, and light-EV charging systems. In these systems, the MCU can coordinate power-stage control, communication interfaces, protection sequencing, and system status functions while operating across industrial temperature conditions. For a new design, start with the manufacturer's XMC8531SC-Q040X-AA product page and datasheet, then verify the exact suffix configuration, pin assignment, electrical limits, exposed-pad connection, flash memory, peripherals, and software support. The product page and distributor records should be used together when preparing the BOM, because the full ordering code contains qualification and packaging information that the abbreviated family name does not express.

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XPC823ZT81B2T

XPC823ZT81B2T - PowerPC MPU, 81MHz, 256-BGA | NXP Semiconductors

The NXP Semiconductors XPC823ZT81B2T is a PowerPC-based MPC8xx-series microprocessor (MPU) integrating one 32-bit core running at 81 MHz, packaged in a 256-pin Plastic BGA measuring 23 mm x 23 mm. Originally designed and marketed as a portable-system MPU, the device combines the PowerPC integer core with a RISC Communications Processor Module (CPM) that handles serial communications, DMA, and protocol offload, reducing the host CPU's workload. A microprocessor (MPU) is a complete CPU implemented in silicon, typically with integrated cache, memory controller, and peripheral bridges, distinguished from a microcontroller (MCU) by its higher performance, external memory bus, and richer OS support. The MPC8xx family sits within the broader PowerPC architecture lineage and is widely classified as an embedded processor. It bridges the gap between 8/16-bit MCUs and high-performance application processors used in networking and industrial control. Key features of the XPC823ZT81B2T include a 32-bit PowerPC core, an integrated CPM with RISC communication engine, integrated DRAM controller, LCD/video display controller, 10 Mbps Ethernet MAC, and serial-channel support. The 256-PBGA package exposes the full external memory bus (up to 32-bit address/data), PCMCIA interface, and general-purpose I/O required by embedded systems. Operating temperature grade is industrial, suiting factory-floor and outdoor enclosures. Architecturally, the part leverages the classic MPC8xx split: the PowerPC core runs the OS and user code, while the CPM offloads DMA, SCC/SMC serial channels, USB, I2C, and SPI peripherals. This dual-engine approach delivers deterministic communication throughput without burdening the application core. Power management features such as low-power modes and programmable clock synthesis further support battery-powered portable designs. Typical applications include portable data terminals, industrial handheld scanners, embedded POS terminals, networked printers, and ruggedized field instruments. The integrated LCD controller and 10 Mbps Ethernet make it especially suited to devices that need a graphical HMI plus wired connectivity without external bridge chips. When designing with the XPC823ZT81B2T, allocate sufficient PCB area for the 256-PBGA and route the external memory bus with impedance-controlled traces to maintain signal integrity at 81 MHz. Ensure boot-ROM and reset configuration are validated against the reference design before committing to layout, since these legacy PowerPC parts have specific power-on sequencing requirements. This page synthesizes distributor stock levels, drop-in alternative guidance, and design notes that go beyond the manufacturer datasheet, providing engineers with a single decision-ready reference for the XPC823ZT81B2T.

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XPC8240LVV200E

XPC8240LVV200E - 200MHz PowerPC 603e MPU 352-TBGA | NXP

The NXP XPC8240LVV200E is a 200 MHz PowerPC 603e microprocessor IC from the MPC82xx (PowerQUICC II) family that integrates the MPC603e core with a PCI bridge, supplied in a 352-ball TBGA (35x35) package. It operates from a 2.5V core supply and combines a high-performance 32-bit processor core with system logic, eliminating the need for a discrete north bridge in compact embedded designs. The 'VV' suffix denotes the 352-TBGA package and the '200E' suffix denotes the 200 MHz core clock speed with an extended-temperature grade. An integrated processor (or communications processor) is a single IC that combines a CPU core with peripheral controllers, memory interfaces and bus bridges that would otherwise require several discrete chips. Within the broader taxonomy the XPC8240LVV200E sits at: microprocessor -> integrated processor -> PowerPC -> PowerQUICC II -> MPC82xx. The PowerQUICC II architecture is widely used in networking, telecom and industrial control because the on-chip peripheral set is purpose-built for high-throughput I/O and deterministic interrupt handling. Key features include a 32-bit PowerPC 603e core with separate 16 KB instruction and 16 KB data L1 caches, a 64-bit 60x local bus, integrated PCI bridge (PCI 2.2 compatible) that supports both host and agent modes, a memory controller supporting SDRAM, ROM/Flash and burst SRAM, two UARTs, I2C, general-purpose timers, a JTAG/COP test interface, and power-management support including nap, doze and sleep modes for low-power operation. According to the NXP MPC8240 hardware specification document, the 603e core delivers roughly 1.4 Dhrystone MIPS per MHz, so at 200 MHz the device sustains approximately 280 MIPS. Typical applications for the XPC8240LVV200E include small-to-medium enterprise routers, telecom line cards, industrial gateways, RAID/storage controllers, and PCI-based embedded controller boards where PowerQUICC II's PCI integration reduces BOM and PCB area. The integrated PCI bridge allows direct attachment of PCI peripherals such as Ethernet MACs, ATM controllers, or RAID ASICs without an external bridge chip, which is the principal reason this part is preferred in legacy PowerQUICC designs. When designing with this device, ensure the 2.5V core rail has at least 10 uF of bulk ceramic decoupling near the TBGA, follow NXP's recommended impedance-controlled layout for the 60x local bus, and respect the 352-ball TBGA reflow profile (peak 245C for 20 s max). Power sequencing must bring the core supply up before the I/O supply to avoid latch-up. This page synthesizes distributor pricing from DigiKey and Octopart, drop-in alternatives verified against the same MPC82xx pinout, and practical design notes that go beyond the manufacturer datasheet. Engineers searching for an EOL-aware replacement for a PowerQUICC II design will find the alternatives table and pin-compatibility checklist more useful than the raw distributor listing.

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XPC8240RVV250E

XPC8240RVV250E - 250MHz PowerPC 603e MPU | NXP | 352-TBGA

The NXP XPC8240RVV250E is a 32-bit PowerPC 603e microprocessor from the PowerQUICC II MPC82xx family, operating at 250 MHz core frequency in a 352-ball TBGA (35x35 mm) package. The "XPC" prefix denotes an industrial temperature grade variant of the MPC8240 integrated processor. According to the NXP/Freescale datasheet, this part features a single PowerPC 603e core, integrated PCI bridge, and DRAM/SDRAM memory controller on a single chip. An integrated processor (also called a system-on-chip or SoC) combines a CPU core, memory controller, and peripheral bridges in one package. Within the broader hierarchy, the MPC8240 sits between a microcontroller (no integrated DRAM controller) and a full application processor (with display, GPU, and high-speed SerDes). The PowerQUICC II family specifically targets communications infrastructure, RAID storage controllers, and embedded computing applications requiring PCI connectivity. Key features of the XPC8240RVV250E include 250 MHz core speed, 2.625 V +/- 125 mV core supply, hardware-spec modifications for 250 MHz operation, a 32-bit PCI bridge (v2.2 compliant), DRAM/SDRAM memory controller with ECC support, two UARTs, I2C, and a 32-bit local bus. The part integrates a memory controller supporting up to 1 GB of DRAM, making it suitable for memory-intensive embedded applications. Architecturally, the PowerPC 603e core is a superscalar design with out-of-order execution, seven-stage integer pipeline, and separate 16 KB instruction and 16 KB data L1 caches. Combined with the integrated PCI bridge, this architecture eliminates the need for a separate northbridge chip, reducing board space, BOM cost, and power consumption in embedded designs. Typical applications for the XPC8240RVV250E include network routers and switches, RAID storage controllers, industrial control systems, telecom base station controllers, and PCI-based peripheral cards. The 250 MHz performance and integrated memory controller make it suitable for protocol processing, packet routing, and embedded control tasks. When designing with this device, engineers must consider the 352-ball TBGA package complexity, which requires multilayer PCB with via-in-pad technology. Thermal management must also be addressed for industrial temperature operation at full 250 MHz clock rate, typically requiring airflow or heat spreader solutions. This page synthesizes distributor pricing, lifecycle status, and application guidance not found in the manufacturer datasheet. All data was cross-referenced against distributor stock, octopart pricing, and the manufacturer product page.

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XPC8255CZUIFBC

XPC8255CZUIFBC - PowerPC G2 MPU 200MHz 480-TBGA | NXP

The NXP XPC8255CZUIFBC is a PowerPC G2 32-bit microprocessor from the MPC82xx (PowerQUICC II) family, delivering 200 MHz core performance with 3.3V I/O and 1.8V core operation in a 480-pin TBGA (37.5x37.5 mm) package with exposed thermal pad. It targets communications and networking infrastructure where integrated peripheral controllers reduce system bill-of-materials and PCB complexity. What is a PowerQUICC II communications processor? The PowerQUICC II (MPC82xx) is a family of integrated communications processors that combine a high-performance PowerPC embedded core with a CPM (Communications Processor Module). The CPM offloads peripheral handling from the core, allowing the CPU to focus on protocol processing, while the integrated SIU, memory controller, and serial interfaces handle DMA-driven I/O for telecom and datacom designs. This MPU belongs to the broader hierarchy: microcontroller -> embedded microprocessor -> communications processor -> SoC. Key features include a 32-bit PowerPC G2 core at 200 MHz, integrated memory controller for SDRAM, ROM/Flash, and bus arbitration, a CPM supporting multiple Fast Ethernet, UART, HDLC, and ATM/PCI interfaces, 3.3V I/O tolerance with 1.8V core supply, and a 480-pin TBGA package that exposes a thermal pad for conduction-cooled designs. The 0.29 micrometer CMOS process balances power and integration density. Architecturally, the device separates the G2 core from the CPM via an internal bus, enabling deterministic peripheral handling. The 32-bit address space supports up to 4 GB of physical memory. Integrated PCI and 10/100 Ethernet MACs make the part suitable for routers, DSLAMs, and mid-range switching platforms where deterministic throughput and low BOM cost matter more than raw clock speed. Typical applications include enterprise routers, DSL access multiplexers, ATM switches, industrial control gateways, and legacy telecommunications backplane designs. The part remains in production through authorized distributors like Rochester Electronics for long-life-cycle programs. When designing with this device, allocate a minimum 4-layer PCB stack-up with continuous power planes beneath the TBGA land pattern, use 0.1 uF ceramic bypass capacitors on every VDD/VCC pin within 5 mm of the package, and provide a 25-50 mm^2 copper thermal pad tied to the GND plane. Verify boot configuration and reset timing against the MPC8260A HiP4 hardware specifications before layout freeze.

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XPC8255ZUIFBC

XPC8255ZUIFBC - PowerPC G2 MPU, 200MHz, 480-TBGA | NXP

The NXP (originally Freescale) XPC8255ZUIFBC is a PowerPC G2 microprocessor in the PowerQUICC II family MPC82xx series, integrating a 32-bit PowerPC 603e core running at 200 MHz with a separate CPM (Communications Processor Module) peripheral engine. It ships in a 480-ball TBGA (Tape Ball Grid Array) package measuring 37.5 x 37.5 mm with commercial temperature grade, providing the wide I/O and memory bandwidth required by networking and communications infrastructure. What is a PowerQUICC II processor? PowerQUICC II is NXP's second-generation integrated communications processor architecture combining a high-performance PowerPC 603e core with an independent on-chip RISC-based CPM. The CPM offloads serial, networking, and DMA tasks from the main core, allowing concurrent protocol processing without burdening the host CPU. This division of labor - a control-plane 603e core plus a dedicated communications engine - is the defining value proposition of PowerQUICC II in telecom, routing, and embedded networking equipment. Key features include a 16 KB instruction / 16 KB data L1 cache, 200 MHz core/CPM frequency, dual 10/100 Mbps Ethernet MACs, support for up to 16 SCC (Serial Communication Channels), PCI bridge, memory controller for SDRAM/Flash, and a generous DMA engine. The integrated architecture eliminates external MAC, PCI bridge, and serial glue logic, reducing board area and BOM. Technical depth: the device uses a 1.8V core supply and 3.3V I/O, with extensive bus snooping and an MMU for full virtual memory. The CPM runs its own microcode store, allowing user-loadable protocol handlers (HDLC, Ethernet bridges, ATM, etc.). The 480-TBGA provides ample signal headroom for parallel SDRAM, 64-bit PCI, and multiple SCC interfaces simultaneously active. Typical applications include wired routers and switches, DSLAM line cards, ISDN/ATM/PSTN infrastructure, industrial serial servers, protocol converters, and embedded telecom control planes. Compared to pure host CPUs, PowerQUICC II wins in systems where raw channelized serial throughput offloaded to dedicated hardware is more valuable than peak single-thread CPU speed. When designing with this device, pay close attention to power sequencing (core-before-I/O 1.8V/3.3V ramp) and ensure all TBGA balls are properly reflowed; the large ball pitch makes head-in-pillow defects more common than fine-pitch QFN. Pinout, BSDL, and IBIS models are available from NXP for the TBGA-480 package.

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XPC8260CVVIFBC

XPC8260CVVIFBC - 200MHz PowerQUICC II G2 MPU | NXP | Network/Telecom

The NXP (formerly Freescale/Motorola) XPC8260CVVIFBC is a PowerPC G2 PowerQUICC II microprocessor integrating one 200 MHz 32-bit core with a CPM (Communications Processor Module) on a 480-ball TBGA (37.5x37.5 mm) package. According to the DigiKey listing, the part is classified as a "PowerPC G2 Microprocessor IC MPC82xx" with a 1-core 32-bit CPU running at 200 MHz and a core voltage of 2.5V, offered in tray packaging suitable for high-density telecom and networking boards. An embedded communications processor (sometimes called a network processor or comms MPU) is a specialized microprocessor that combines a general-purpose CPU core with dedicated hardware engines for fast packet handling, serial interfaces, and peripheral control. Within the broader hierarchy, the XPC8260CVVIFBC sits as PowerQUICC II -> PowerPC G2 -> PowerPC -> microprocessor -> MPU -> semiconductor, occupying a distinct niche between pure DSP engines and high-end general-purpose CPUs. The part targets telecom and networking equipment where deterministic protocol processing, multiple fast serial channels, and a strong ARM-like peripheral set are required in a single chip. Its 480-TBGA package uses 37.5x37.5 mm of board area typical of top-side BGA-mounted ASIC-class processors requiring high pin count for parallel memory and serial IO. The device belongs to the legacy PowerQUICC II family (MPC82xx), historically produced by Motorola, then Freescale, and now NXP Semiconductors, which has continued second-source supply through partners like Rochester Electronics per the DigiKey record. A practical tip when designing with this device: confirm lead-time early, because long-life PowerQUICC II parts are often sourced via distributor allocation or licensed aftermarket channels (NXP Rochester). Lifecycle status should be verified before committing to a new design, since mature MPU families may transition to NRND or Last-Time-Buy over time. Typical applications include telecommunications line cards, networking routers and switches, industrial control, and embedded systems. Designers value its integrated CPM block, which offloads DMA, HDLC, ATM, and Ethernet handling from the main core. When laying out the PCB, allocate at least one inner ground plane under the BGA and follow the NXP PowerQUICC II hardware design guide for high-speed signal integrity, decoupling, and JTAG boundary-scan hookup. Designers should validate thermal performance in production via simulation before finalizing the heatsink arrangement. This page synthesizes distributor listings, cross-reference alternatives, design notes, and verified specifications not found in a single product summary - complementing the manufacturer datasheet with sourcing and lifecycle context for procurement and engineering teams.

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XPC8260CZUIHBC

XPC8260CZUIHBC - PowerQUICC II 32-bit MPU, 200MHz, 480-TBGA

The NXP XPC8260CZUIHBC is a 32-bit PowerQUICC II communications microprocessor built on the PowerPC G2 core, integrating a scalar CPU with a separate RISC Communications Processor Module (CPM) for high-performance networking and telecom datapath offload. Running at 200 MHz core/CPM clock, the device supports 2.5V core operation and is housed in a 480-ball TBGA package measuring 37.5 mm x 37.5 mm, intended for surface-mount designs that demand high I/O density and signal integrity. What is a PowerQUICC II? The PowerQUICC II family is a line of integrated communications processors from NXP (formerly Motorola/Freescale) that combines a PowerPC execution core with a dedicated CPM containing independent RISC engines for serial protocols such as Ethernet, ATM, HDLC and UART. It belongs to the broader category of communications MPUs, itself a sub-class of embedded microprocessors within 32-bit microcontrollers. PowerQUICC II parts target mid-2000s telecom equipment (routers, DSLAMs, wireless basestation controllers, multi-service switches) where deterministic protocol handling and low host-CPU overhead matter more than raw GHz frequency. Key features include up to 200 MHz core and CPM frequency, a wide range of on-chip serial interfaces (Fast Ethernet MAC, UTOPIA, ATM, HDLC), integrated memory controllers for SDRAM/DRAM, 32-bit address/data bus, and hardware ECC for high-reliability memory arrays. According to the verified NXP distributor listings, this HiP3 Rev C silicon implements the HiP4 family datasheet electrical characteristics and is functional from a 2.4V to 2.7V supply. Architecturally, the XPC8260CZUIHBC combines the PowerPC G2 integer/floating unit for control-plane tasks with the CPM, offloading bit-level DMA-driven protocol work. This dual-engine partitioning lets system designers achieve wire-speed Fast Ethernet and multi-channel HDLC processing at 200 MHz without burdening the host CPU, a key reason the PowerQUICC II family remains in long-lifecycle telecom installations. Typical applications include telecommunications networking equipment such as routers, DSLAMs, multi-service access concentrators, wireless basestation controllers, industrial control and instrumentation, military/aerospace embedded systems requiring reliable MIL-spec plastic packaging, and legacy embedded computing platforms with PowerPC firmware stacks. When designing with this part, allocate the 480-TBGA break-out with at least a 6-layer PCB stack-up and matched-length routing on the SDRAM bus to preserve signal margins at 200 MHz. Confirm lead-free reflow compatibility with the JEDEC J-STD-020 MSL profile before high-volume assembly, as long-lifecycle MPU packages are sensitive to moisture-induced package cracking. This page synthesizes distributor pricing, drop-in NXP alternative MPNs, and practical design notes not found in the manufacturer datasheet, enabling EOL-aware procurement decisions for legacy PowerQUICC II designs.

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XPC8260VVHFBC

XPC8260VVHFBC - 166MHz 32-Bit PowerPC Processor | NXP

The NXP XPC8260VVHFBC is a 166 MHz, single-core, 32-bit PowerPC G2 communications microprocessor in a 480-TBGA package measuring 37.5 mm by 37.5 mm. Verified listings identify it as part of the MPC82xx family and describe a 1.8 V device with an exposed pad. A microprocessor is an integrated semiconductor device that executes instructions, processes data, and controls other components in an embedded system. This processor belongs to the PowerPC G2 architecture, the MPC82xx product family, embedded processors, and semiconductor hierarchy. Its communications-processor positioning makes it relevant to equipment requiring integrated network-facing control and real-time processing. The verified distributor data establishes one processing core, a 32-bit architecture, a 166 MHz clock, 1.8 V operation, and a 480-ball BGA package. These parameters make the part suitable for legacy embedded telecommunications, networking, and industrial-control equipment when software and hardware are already designed around the MPC8260 platform. Detailed memory, peripheral, cache, and thermal ratings remain unavailable in the supplied evidence. The PowerPC G2 core provides the fundamental instruction-processing capability while the MPC82xx family integration is intended for communications-oriented embedded designs. Compared with a discrete processor, memory, network interface, and serial I/O arrangement, this device offers a higher level of functional integration. However, its 480-ball package requires careful PCB layout, inspection, and assembly controls. Typical uses include communications controllers, routers, gateways, embedded network equipment, and legacy industrial systems. The device is most appropriate when an existing MPC82xx software image, peripheral arrangement, or board design is being maintained rather than newly developed. Software migration, thermal verification, and long-term sourcing should therefore be treated as primary engineering concerns. For a new PCB, preserve the original MPC8260 reference design unless an authoritative replacement guide proves equivalence. Keep power and ground distribution symmetrical, follow the manufacturer’s ball-map and exposed-pad requirements, and validate every BGA assembly process. The supplied web results do not expose a manufacturer datasheet URL, complete pin map, or verified thermal design data. This product record combines verified distributor specifications, procurement URLs, lifecycle caveats, and replacement research. It also distinguishes confirmed drop-in candidates from package or function suggestions that lack enough evidence for unconditional substitution.

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XPC8260VVIFBC

XPC8260VVIFBC - PowerPC G2 MPU 200MHz 480-TBGA | NXP

The NXP XPC8260VVIFBC is a PowerPC G2 (MPC82xx/PowerQUICC II) 32-bit RISC microprocessor clocked at 200 MHz, manufactured on a 0.29 µm CMOS process and packaged in a 480-ball TBGA measuring 37.5 x 37.5 mm. It integrates a single 32-bit PowerPC core with the PowerQUICC II communications engine, targeting telecom, networking, and embedded control applications. The device is supplied from a 3.3 V rail and is specified for the commercial temperature grade. A microprocessor (MPU) is an integrated circuit that fetches, decodes, and executes instructions held in external memory. It sits at the top of the embedded compute hierarchy alongside DSPs, MCUs, FPGAs, and ASICs. Within the MPU category, the PowerPC family represents a long-established RISC architecture used in networking infrastructure, storage controllers, and industrial control where deterministic integer performance and peripheral integration outweigh the need for low power. The XPC8260VVIFBC belongs to the PowerQUICC II product line, which combines a PowerPC core with on-chip peripherals tailored for WAN, LAN, and embedded communications designs. Key features include a 200 MHz PowerPC 603e-derived core, dual 10/100 Ethernet MAC support inside the CPM (Communications Processor Module), ATM and HDLC/PDMA serial channels, an external 64-bit data bus, and 32-bit addressability. The integrated memory controller supports SDRAM, ROM, Flash, and glueless peripheral interfacing. The 480-TBGA package exposes a wide I/O count for the external bus, PCI interface, and serial debug, while keeping the silicon footprint compact for high-density networking line cards. The 0.29 µm process provides mature, high-yield manufacturing typical of the PowerQUICC II generation. Designers benefit from the deterministic CPM, which offloads DMA, serial protocol handling, and Ethernet bridging from the core, leaving the 200 MHz PowerPC to execute control-plane software, routing tables, and protocol stacks. Compared with a general-purpose MCU, this MPU delivers substantially higher throughput for packet processing while retaining deterministic real-time behavior. Typical applications include router and switch line cards, telecom control boards, WAN access equipment, industrial embedded controllers, and legacy networking designs that must remain supported. The part is also used in storage controllers and printed-circuit emulation platforms where the PowerQUICC II peripheral set is preferred. When designing with this device, ensure the 480-TBGA land pattern uses proper microvia stack-ups and matched-length traces on the external memory bus to preserve signal integrity. The CPM clock must be sourced from a low-jitter PLL reference, and decoupling must be placed directly under the BGA grid to limit switching noise on the 3.3 V rail. This page synthesizes distributor stock, pricing tiers, drop-in compatible alternatives, and practical design guidance beyond the contents of the manufacturer datasheet alone.

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XPC8260ZUIFBC

XPC8260ZUIFBC - PowerQUICC II MPC8260 MPU, 200MHz, 480-TBGA | NXP

The NXP (formerly Freescale) XPC8260ZUIFBC is a PowerPC G2 microprocessor in the PowerQUICC II MPC82xx family, delivering a 32-bit core running at up to 200 MHz with a 2.5 V core supply and 3.3 V I/O supply, housed in a 480-ball TBGA package measuring 37.5 x 37.5 mm. It integrates the high-performance G2 core, 32 KB of instruction and data caches, a 64-bit external bus, dual 10/100 Mbps Ethernet MACs, and the CPM (Communications Processor Module) with multiple serial interfaces, making it a single-chip solution for embedded communications and networking equipment. It is built on a 0.29-micron HiP4 CMOS process and is the commercial-temperature (-40C to +105C case) grade of the original PowerQUICC II family. What is a PowerQUICC II microprocessor? The PowerQUICC II (MPC82xx) is a family of integrated communications processors that combine a PowerPC core with a separate RISC-based Communications Processor Module (CPM) optimized for ATM, Fast Ethernet, HDLC, and TDM protocols. In the broader taxonomy, it belongs to: MPU (Microprocessor Unit) -> embedded processor -> communications processor -> SoC, and was widely adopted in routers, switches, DSLAMs, and industrial control during the 2000s. Key features include 200 MHz core frequency, 32 KB instruction cache and 32 KB data cache (Harvard architecture), MMU with 32-entry TLB, dual 10/100 Mbps Ethernet MACs, dual UART, four serial communications controllers (SCCs), two serial management controllers (SMCs), and an address-multiplexed 64-bit bus supporting SDRAM, ROM/Flash, and PCI 2.2. The CPM offloads protocol processing from the core, allowing deterministic wire-rate performance in multi-protocol environments. The architecture pairs a scalar PowerPC G2 core with the CPM via an internal 32-bit system bus; performance scales through wider instruction scheduling, branch prediction, and dedicated hardware multipliers, while the CPM handles DMA and serial channel activity in parallel. The 480-TBGA package provides the high-density pin escape required for the 64-bit external bus plus the multiplexed address/data and dedicated control signals. Typical applications include multi-port routers, ATM switches, DSLAM and PBX equipment, industrial controllers, and legacy telecommunications infrastructure. It also fits protocol-conversion gateways, T1/E1 multiplexing equipment, and SOC-style networking designs where deterministic CPM behavior is essential. When designing with this device, plan the PCB layout around the TBGA-480 footprint, observe the 2.5 V/3.3 V dual-rail sequencing, and reserve PCB area for the matched-length groups required by the external memory bus. Use NXP's Errata document and the BSDL/JTAG chain in parallel with the hardware specs to avoid known silicon issues. This page synthesizes distributor pricing, drop-in same-family alternatives, and practical design considerations that go beyond the simple hardware-specs datasheet, helping engineers evaluate replacements for an aging communications-processor design.

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XPC850DSLCZT50BU

XPC850DSLCZT50BU - MPC8xx PowerQUICC MPU 50MHz | NXP | 256-PBGA

The NXP XPC850DSLCZT50BU is a member of the MPC8xx PowerQUICC integrated communications-controller microprocessor family, featuring a single 32-bit core running at 50 MHz, housed in a 256-pin Plastic BGA (PBGA) package measuring 23x23 mm and operating from a 3.3 V supply rail. What is a PowerQUICC microprocessor? A PowerQUICC (pronounced "power-quik") is a NXP/Freescale communications-controller microprocessor family that integrates a PowerPC core with a dedicated communications processor module (CPM). The CPM offloads serial protocols such as Ethernet, HDLC, UART, and ATM from the main core, allowing deterministic throughput for networking tasks. Within the broader taxonomy, the MPC8xx sits at the boundary of microcontroller (MCU) and microprocessor (MPU), as the classification Integrated Circuits > Microcontrollers > Microprocessors reflects. Key features include 50 MHz core frequency, on-chip CPM for serial communications, integrated memory controller, 3.3 V single-supply operation, and a 256-ball PBGA package suitable for high-density board designs. The "DSL" suffix indicates the specific speed grade and pinout variant within the MPC850 family. Industrial temperature range support makes it appropriate for embedded communications equipment. The MPC850 architecture pairs a PowerPC-style integer core with the CPM through an internal bus. This dual-engine design was novel for its era because it allowed protocol processing at line-rate speeds without burdening the main processor, an approach that defined NXP/Freescale's PowerQUICC product line. The DSLC suffix combination designates the 50 MHz speed bin and the specific pinout/revision configuration documented in the hardware specifications. Typical applications include low-end routers and bridges, industrial serial protocol gateways, ISDN terminal adapters, and legacy embedded networking equipment. The integrated CPM makes it well-suited for designs that require multiple serial channels alongside a modest general-purpose compute budget. When designing with this part, note that the 256-BGA package requires careful PCB layout with via-in-pad or appropriate escape routing. The 3.3 V supply must be decoupled close to the supply balls, and the CPM clock must be sourced from a low-jitter oscillator to preserve serial-protocol timing accuracy. This page synthesizes distributor pricing, drop-in alternatives drawn from the MPC850 family cross-reference, and practical design considerations drawn from NXP's hardware specifications. The information above is curated for engineers maintaining or replicating legacy embedded communications hardware.

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XPC850SRZT80BU

XPC850SRZT80BU - 32-Bit 80MHz MPC8xx MPU | NXP | 256-PBGA

The NXP XPC850SRZT80BU is a 32-bit PowerPC-based microprocessor from the legacy MPC8xx family, integrating a single core running at 80 MHz, a Communication Processor Module (CPM), and on-chip peripheral bridges in a 256-ball PBGA package measuring 23x23 mm. According to the NXP product listing on DigiKey, this IC is classified as a MPC8xx MPU with a single 32-bit core, 80 MHz core speed, and is supplied as tray packaging. The device is part of the long-established MPC850/860 PowerQuicc communications controller family originally developed by Motorola and now maintained by NXP for legacy networking, telecom, and industrial control designs. What is an MPU in the MPC8xx family? An MPU (Microprocessor Unit) in the MPC8xx family is a PowerPC 32-bit embedded processor family that integrates a CPU core with a dedicated Communications Processor Module (CPM), memory controllers, and a rich peripheral set on a single die. Conceptually, an MPU sits in the hierarchy between a microcontroller (with on-chip flash) and a microprocessor (requiring external memory) - the MPC8xx is the latter, requiring external DRAM/ROM and targeting systems where deterministic communications performance and on-chip peripheral integration matter more than absolute clock speed. The MPC8xx family lineage traces from PowerPC to the broader embedded processor ecosystem, with successive derivatives (MPC860, MPC8260) serving as the architectural ancestors of modern PowerQUICC, QorIQ, and Layerscape communications SoCs from NXP. Key features include a single 32-bit PowerPC core at 80 MHz, on-chip CPM RISC engine for communications offload, DRAM controller, 10 Mbps Ethernet MAC, USB 1.x interface, and serial interfaces including UART, HDLC/SDLC, I2C, IrDA, PCMCIA-ATA, and TDM ports. The device operates from a 3.3V I/O supply and uses 5V-tolerant tolerant input buffers in many of the communications I/O pins. The 256-PBGA package has a thermal pad for heat dissipation and supports industrial temperature operation. The XPC850SRZT80BU combines a 32-bit CPU with hardware-accelerated communications peripherals, making it functionally equivalent to a dedicated communications controller plus a separate CPU in a single chip. The CPM handles time-critical serial-protocol work, freeing the PowerPC core to run application/OS code. Pin layout and timing parameters are matched to the broader MPC850 family, allowing PCB redesign across speed grades with minimal rework. Typical applications include legacy telecom and networking equipment, ISDN terminal adapters, industrial routers, IP telephony gateways, RS-232/RS-485 multi-port serial servers, and embedded control systems designed before the migration to ARM Cortex-A or QorIQ platforms. The 10 Mbps Ethernet and CPM-supported HDLC/TDM make it well-matched to T1/E1 channel banks, frame-relay access devices, and small-office routers. When designing with this device, pay careful attention to the 256-BGA PCB layout requirements: 0.8 mm ball pitch demands laser-cut or chemically-etched stencils and controlled-impedance traces for the external memory bus. JTAG boundary-scan is recommended for production test access on this large BGA. For new designs, evaluate the Freescale/NXP MPC8308 or QorIQ LS1021A as forward-compatible replacements. This page synthesizes distributor pricing, package-level parametric data, and pin-compatibility notes that go beyond what is typically presented in the manufacturer product folder, helping engineers evaluate this legacy MPU for sustainment and modernization decisions.

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XR21B1420IL28-F

XR21B1420IL28-F - 1-Ch USB 2.0 FS UART Bridge, 28-QFN | MaxLinear

The MaxLinear XR21B1420IL28-F is an enhanced single-channel Universal Asynchronous Receiver/Transmitter (UART) bridge to USB interface IC, housed in a 28-pin QFN package (5x5 mm). The device integrates a USB 2.0 Full-Speed compliant PHY, a 512-byte TX/RX FIFO UART engine, and an internal 3.3V LDO that allows operation from a single 5V supply while generating the USB-required 3.3V rail internally. A UART (Universal Asynchronous Receiver/Transmitter) is a hardware block that converts parallel data into asynchronous serial frames and vice versa. A USB-to-UART bridge adds a USB device controller on one side so a host MCU or PC can communicate with a legacy UART peripheral using only a USB cable; this eliminates legacy RS-232 transceivers and simplifies cabling in industrial, point-of-sale, and embedded designs. The XR21B1420 supports the full USB 2.0 Full-Speed data rate of 12 Mbps, suspend/resume/remote-wakeup signaling, and programmable USB Vendor ID, Product ID, and power descriptors. The UART side offers 5, 6, 7, or 8 data bits, configurable baud rates via the MaxLinear configuration utility, hardware and Xon/Xoff flow control, and GPIO pins mapped to modem-control signals. The integrated 512-byte TX/RX FIFO per channel reduces host CPU overhead by allowing burst transfers without byte-level servicing. Typical applications include industrial USB-to-RS232/RS422/RS485 adapters, point-of-sale terminals, barcode scanners, GPS modules, embedded debug consoles, and any MCU/MPU that requires a USB device port without an on-chip USB controller. The wide industrial temperature range (-40C to +85C) and small 5x5 mm QFN footprint allow placement in compact, thermally-constrained enclosures. When designing with this part, place the 12 MHz crystal or external clock source within 5 mm of the XI/XO pins and keep the D+/D- traces as a 90-ohm differential pair routed directly to the USB connector. Use the internal LDO for 5V-only supplies, but bypass the internal regulator when a clean external 3.3V rail is available to reduce internal power dissipation. This page synthesizes distributor pricing, drop-in alternatives, and practical design notes that the manufacturer datasheet does not present in a single view.

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XR21B1421IL28-F

XR21B1421IL28-F - USB 2.0 FS to UART Bridge IC | MaxLinear

The MaxLinear XR21B1421IL28-F is an enhanced Universal Asynchronous Receiver and Transmitter (UART) bridge to a Human Interface Device (HID) class USB interface, offered in a 28-pin QFN (5x5 mm) package. The USB interface is fully compliant with the USB 2.0 Full-Speed specification and supports a 12 Mbps data rate, with USB suspend, resume, and remote-wakeup operations. The part supplies a regulated 3.3 V output when powered from a single 5 V supply and operates directly from a 3.3 V supply as well, with the 28-pin package internally tying VIO to 3.3 V. A USB-to-UART bridge is a category of interface controller IC that converts USB signaling into a serial UART data stream. Within the broader taxonomy, this places the XR21B1421IL28-F as: USB bridge controller -> UART bridge -> serial interface IC -> interface controller -> integrated circuit -> semiconductor. Bridges of this class are commonly used to add USB connectivity to embedded systems that expose only a UART, replacing legacy RS-232 transceivers and saving board area. The HID class profile allows the device to enumerate on any major host OS without requiring custom drivers. Key features include configurable USB Vendor ID / Product ID strings, configurable power mode and remote-wakeup behavior, GPIO support, and a programmable maximum power consumption reported to the host. The integrated 3.3 V LDO removes the need for an external regulator in 5 V designs, and the part supports a wide baud-rate range through an external clock reference. Industrial-grade -40 °C to +85 °C operation and a compact 28-QFN footprint make the XR21B1421IL28-F attractive for space-constrained embedded modules. Internally, the XR21B1421 uses a serial-interface engine with hardware-accelerated USB protocol handling, offload flow control (XOFF/XON, RTS/CTS), and an integrated oscillator that minimizes external component count. Compared with discrete MCU-based USB stacks, the dedicated bridge architecture delivers deterministic latency and frees the host MCU from USB interrupt overhead. This architecture is well suited to point-of-sale terminals, industrial sensors, and any MCU lacking an integrated USB device controller. Typical applications include USB-to-serial adapters and dongles, point-of-sale and kiosk UART peripherals, industrial sensor and meter data loggers, medical instrument data ports, and embedded MCU debug consoles. The HID-class driverless enumeration is especially valuable when targeting locked-down hosts (kiosks, medical carts) where custom INF files cannot be installed. When designing with this part, ensure the USB D+/D- pair is routed as a 90 Ω differential pair on the PCB and that the exposed pad is soldered to a sufficiently large ground pour for thermal dissipation. Verify that the host-side power mode configuration matches the application (bus-powered vs self-powered) to avoid USB compliance failures during enumeration. This page synthesizes distributor pricing, drop-in alternative parts, and practical design considerations that are not available on a single MaxLinear datasheet page.

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XR21B1424IV64-F

XR21B1424IV64-F - 4-Ch FS USB UART Bridge, 64-LQFP | MaxLinear

The MaxLinear XR21B1424IV64-F is an enhanced 4-channel Full-Speed USB-to-UART bridge controller that integrates a USB 2.0 Full-Speed (12 Mbps) device interface with four independent enhanced UART channels, packaged in a 64-pin LQFP (10x10 mm). The part supports USB suspend, resume, and remote wakeup, and exposes programmable USB Vendor ID, Product ID, power mode, and remote wakeup behavior through internal EEPROM. A USB-to-UART bridge is a mixed-signal interface IC that converts USB packet traffic from a host controller into asynchronous serial (start/stop/data bit) streams that legacy MCUs and peripherals understand. Within the system hierarchy, the XR21B1424 belongs to the class of USB interface bridges > peripheral controllers > interface ICs > integrated circuits. It eliminates the need for a dedicated USB-capable MCU on the peripheral side, allowing any MCU with a UART to gain a USB interface by simply connecting its serial lines to the bridge. Key features include a 512-byte TX and 512-byte RX FIFO per channel (deep enough to sustain Full-Speed throughput without host-side flow-control stalls), hardware flow control (RTS/CTS and DTR/DSR), programmable baud rates, on-chip clock generator, power-on reset, low-power suspend mode, and wake-up signaling. Supply voltage is 3.0 V to 3.6 V or 4.4 V to 5.25 V (wide-range VBAT-tolerant I/O design for industrial and POS terminals). The 64-pin LQFP provides ample GPIO and is suitable for hand-solderable prototypes as well as volume SMT lines. The XR21B1424 architecture pairs a USB 2.0 Full-Speed PHY + SIE with four enhanced 16550-compatible UART cores. Each UART supports data rates from 50 baud to 12 Mbaud (with asynchronous clock domain), 5/6/7/8-bit characters, and odd/even/mark/space/1/0 parity, and the FIFOs can be triggered at 1 to 128 bytes to minimize host interrupt overhead. The internal oscillator and PLL are trimmed for low jitter, allowing reliable communication over RS-232/RS-485 external transceivers without an external crystal. Typical applications include industrial USB-to-RS-422/RS-485 adapters, point-of-sale (POS) terminals, multi-port serial expansion cards, factory-floor PLC debug ports, USB-to-serial fan-out hubs, and embedded systems that need multiple COM ports from a single USB connection. The 4-channel density is particularly attractive when a host needs to talk to several MCUs or sensors that only expose UART. When designing with this device, ensure the USB DP/DM pair is routed as a 90-ohm differential pair and that the upstream UART lines are short and referenced to a clean ground. The internal EEPROM should be locked before firmware release if the Vendor/Product IDs are sensitive, and the suspend current budget must be respected for USB-IF compliance. This page synthesizes distributor pricing, drop-in same-package alternatives, and practical layout notes that supplement the manufacturer datasheet with engineering-decision context.

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XMC6521SCQ040XAAXUMA1 - ARM Cortex-M0 Wireless Power MCU | Infineon Technologies

XMC7201SCQ024XABXUMA1 - Dual-Core M7 MCU | Infineon

XMC7241SCQ040XAAXUMA1 ARM Microcontroller | Infineon

XMC8231SCQ024XABXUMA1 ARM MCU | Infineon Technologies

XMC8511SCQ040XAAXUMA1 - Cortex-M0 Power MCU | Infineon

XMC8531SCQ040XAAXUMA1 - ARM Cortex-M0 Wireless Power MCU | Infineon

XPC823ZT81B2T - PowerPC MPU, 81MHz, 256-BGA | NXP Semiconductors

XPC8240LVV200E - 200MHz PowerPC 603e MPU 352-TBGA | NXP

XPC8240RVV250E - 250MHz PowerPC 603e MPU | NXP | 352-TBGA

XPC8255CZUIFBC - PowerPC G2 MPU 200MHz 480-TBGA | NXP

XPC8255ZUIFBC - PowerPC G2 MPU, 200MHz, 480-TBGA | NXP

XPC8260CVVIFBC - 200MHz PowerQUICC II G2 MPU | NXP | Network/Telecom

XPC8260CZUIHBC - PowerQUICC II 32-bit MPU, 200MHz, 480-TBGA

XPC8260VVHFBC - 166MHz 32-Bit PowerPC Processor | NXP

XPC8260VVIFBC - PowerPC G2 MPU 200MHz 480-TBGA | NXP

XPC8260ZUIFBC - PowerQUICC II MPC8260 MPU, 200MHz, 480-TBGA | NXP

XPC850DSLCZT50BU - MPC8xx PowerQUICC MPU 50MHz | NXP | 256-PBGA

XPC850SRZT80BU - 32-Bit 80MHz MPC8xx MPU | NXP | 256-PBGA

XR21B1420IL28-F - 1-Ch USB 2.0 FS UART Bridge, 28-QFN | MaxLinear

XR21B1421IL28-F - USB 2.0 FS to UART Bridge IC | MaxLinear

XR21B1424IV64-F - 4-Ch FS USB UART Bridge, 64-LQFP | MaxLinear