XPC8260CVVIFBC - 200MHz PowerQUICC II G2 MPU | NXP | Network/Telecom
N.º de pieza: XPC8260CVVIFBC ✓ Activo| Cant. | Precio unitario | Total |
|---|---|---|
| 1 | $285 | $285,00 |
| 10 | $268.5 | $2.685,00 |
| 100 | $245 | $24.500,00 |
| 250 | $232 | $58.000,00 |
| 500 | $219.5 | $109.750,00 |
XPC8260CVVIFBC Descripción general
An embedded communications processor (sometimes called a network processor or comms MPU) is a specialized microprocessor that combines a general-purpose CPU core with dedicated hardware engines for fast packet handling, serial interfaces, and peripheral control. Within the broader hierarchy, the XPC8260CVVIFBC sits as PowerQUICC II -> PowerPC G2 -> PowerPC -> microprocessor -> MPU -> semiconductor, occupying a distinct niche between pure DSP engines and high-end general-purpose CPUs.
The part targets telecom and networking equipment where deterministic protocol processing, multiple fast serial channels, and a strong ARM-like peripheral set are required in a single chip. Its 480-TBGA package uses 37.5x37.5 mm of board area typical of top-side BGA-mounted ASIC-class processors requiring high pin count for parallel memory and serial IO. The device belongs to the legacy PowerQUICC II family (MPC82xx), historically produced by Motorola, then Freescale, and now NXP Semiconductors, which has continued second-source supply through partners like Rochester Electronics per the DigiKey record.
A practical tip when designing with this device: confirm lead-time early, because long-life PowerQUICC II parts are often sourced via distributor allocation or licensed aftermarket channels (NXP Rochester). Lifecycle status should be verified before committing to a new design, since mature MPU families may transition to NRND or Last-Time-Buy over time.
Typical applications include telecommunications line cards, networking routers and switches, industrial control, and embedded systems. Designers value its integrated CPM block, which offloads DMA, HDLC, ATM, and Ethernet handling from the main core.
When laying out the PCB, allocate at least one inner ground plane under the BGA and follow the NXP PowerQUICC II hardware design guide for high-speed signal integrity, decoupling, and JTAG boundary-scan hookup. Designers should validate thermal performance in production via simulation before finalizing the heatsink arrangement.
This page synthesizes distributor listings, cross-reference alternatives, design notes, and verified specifications not found in a single product summary - complementing the manufacturer datasheet with sourcing and lifecycle context for procurement and engineering teams.
Alternativas directas para XPC8260CVVIFBC — mismo encapsulado, compatible pin a pin. Se excluyen las piezas de otro encapsulado que requieren retrabajo de la PCB.
Variantes de esta serie
Modelos de la misma serie compatibles directamente con XPC8260CVVIFBC (mismo factor de forma y huella) — difiere en Mounting Type, Communications Processor Module (CPM), Core Supply Voltage, Process Technology, Series.
Herramienta de comparación rápida — seleccione piezas alternativas para compararlas lado a lado:
MPC8260ACZUMIBB
✅ Sustitución directa ⚠️ Especificaciones sin verificar✓ En stock
$200 / unidad
Ver hoja de datos →MPC8260AZUPJDB
✅ Sustitución directa ⚠️ Especificaciones sin verificar✓ En stock
$165 / unidad
Ver hoja de datos →MPC8260AVVIFBC
✅ Sustitución directa ⚠️ Especificaciones sin verificar📋 Alternativa de referencia (no en el catálogo)
XPC8260CVVIFBC Valores máximos y características eléctricas
| Processor Type | PowerPC G2 Microprocessor IC MPC82xx (PowerQUICC II) |
| Core Architecture | PowerPC G2, 1 Core, 32-Bit |
| CPU Clock Speed | 200 MHz |
| Core Supply Voltage | 2.5 V |
| Communications Processor Module (CPM) | Integrated (per PowerQUICC II architecture) |
| Encapsulado / Carcasa | 480-LBGA (TBGA), 37.5 x 37.5 mm |
| Terminal Form | Ball |
| Number of Terminals | 480 |
| Package Body Material | Plastic / Epoxy |
| Tipo de montaje | Surface Mount (BGA) |
| Packaging | Tray |
| Manufacturer Lifecycle Source | NXP Semiconductors (Freescale/Motorola legacy) |
| Series | PowerQUICC II (PQ II HIP 3) |
Guía de configuración de pines de XPC8260CVVIFBC plastic / epoxy
Configuración de pines para XPC8260CVVIFBC (encapsulado plastic / epoxy). Este CI digital incluye GPIO, interfaces de comunicación (UART, SPI, I2C) y pines de alimentación. Consulte la hoja de datos del fabricante para conocer las funciones alternativas de los pines y las opciones de configuración. Esencial para el diseño de sistemas embebidos y el diseño de PCB.
No hay datos detallados de patillaje disponibles para XPC8260CVVIFBC.
Consulte la hoja de datos para ver la configuración completa de patillas.
Aplicaciones típicas
XPC8260CVVIFBC es adecuado para 6 aplicacións: Telecommunications Line Cards, Networking Routers and Switches, Industrial Control Systems, Embedded Networking Appliances, ATM/Frame Relay Edge Devices, Legacy Telecom Infrastructure Maintenance.
Telecommunications Line Cards
The XPC8260CVVIFBC's 200 MHz PowerPC G2 core plus integrated PowerQUICC II CPM makes it well suited to T1/E1 and DSL line cards where multiple HDLC channels and time-slot interchange must be handled deterministically. At 200 MHz the CPU has enough headroom to run a small RTOS for OAM&P while the CPM offloads DMA, ATM SAR, and Fast Ethernet MAC traffic in parallel. Typical implementations place the XPC8260CVVIFBC between a framer and a TDM switch, with 64-256 MB of SDRAM and 8 MB of boot Flash completing the node. The 480-LBGA's high pin count accommodates the parallel memory bus plus multiple SCC/SMC serial channels without external bus switching.
Recomendado
Networking Routers and Switches
In mid-range enterprise routers and access switches the XPC8260CVVIFBC performs forwarding-plane packet classification while the CPM drives multiple 10/100 Ethernet MACs and HDLC uplinks. Its 200 MHz core can sustain a Linux or VxWorks control plane for routing daemons, SNMP, and CLI management, while hardware offloads free CPU cycles for data-plane throughput. Designers typically pair the chip with an external PCI bridge, a Marvell or Vitesse PHY, and 64-128 MB of 32-bit SDRAM. The result is a stable platform favored by long-life enterprise and SMB networking gear where the software investment outweighs the need for ARM-class newer silicon.
Recomendado
Industrial Control Systems
The XPC8260CVVIFBC is widely deployed in industrial controllers where deterministic serial IO, long product lifecycles, and field-proven firmware are decisive. Its CPM provides SCC/SMC channels for RS-232/RS-485 fieldbuses and HDLC-based industrial protocols, while the 200 MHz core can run VxWorks, QNX, or an RTOS for SCADA logic. The plastic LBGA-480 package tolerates industrial -40C to +85C ambient operation typical of substation and factory-floor enclosures. The mature NXP supply chain plus Rochester Electronics aftermarket support means industrial OEMs can keep producing equipment for 10-20 years without forced redesign.
Recomendado
Embedded Networking Appliances
Small-to-mid sized network appliances such as VPN concentrators, print servers, and protocol converters benefit from the XPC8260CVVIFBC's integrated CPM, which handles packet reassembly and serial bridging without burdening the host OS. At 200 MHz, it provides adequate CPU headroom for IPSec-lite, packet filtering, and management tasks while sustaining four to eight serial channels concurrently. Designers typically add 32-64 MB of SDRAM and 4 MB of boot Flash, keeping BOM cost low for high-volume appliance production. Field reliability at higher ambient temperatures makes the chip attractive for fanless industrial appliance designs.
Recomendado
ATM/Frame Relay Edge Devices
Edge devices terminating ATM, Frame Relay, or multi-link PPP circuits rely on the XPC8260CVVIFBC's PowerQUICC II CPM to handle AAL1/AAL2 SAR, cell interleaving, and HDLC framing in hardware. The 200 MHz PowerPC G2 core runs control-plane routing protocols while the CPM sustains wire-rate layer-2 termination. Typical designs feed the CPM's TDM channels directly from a framer, then forward IP traffic to an Ethernet PHY, achieving deterministic latency for voice and leased-line services. The chip's deterministic DMA and time-slot interchange remain a strong differentiator versus newer generic CPUs without equivalent offload engines.
Recomendado
Legacy Telecom Infrastructure Maintenance
Carriers and equipment vendors still maintain installed bases of PowerQUICC II-based switches and DSLAMs, creating an active service-replacement market for the XPC8260CVVIFBC. Rochester Electronics and licensed distributors provide long-term aftermarket supply, allowing service organizations to repair legacy line cards without redesigning the entire chassis. The deterministic CPM, mature VxWorks/POSIX software stack, and field-proven reliability make the chip irreplaceable for high-availability service contracts. Design teams maintaining such gear use the XPC8260CVVIFBC as a known-quantity repair component with predictable behavior across decades of field operation.
Recomendado
Resumen de productos recomendados
Datos de referencia de ingeniería para XPC8260CVVIFBC — comparación, orientación de diseño e información de cumplimiento.
Guía de selección
Comparación con alternativas
| Parámetro | Este producto | MPC8260ACZUMIBB | MPC8260AZUPJDB | MPC8260AVVIFBC |
|---|---|---|---|---|
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Package | 480-LBGA (TBGA), 37.5x37.5 mm | 480-LBGA (TBGA) - same | 480-LBGA (TBGA) - same | 480-LBGA (TBGA) - same |
| Architecture | PowerPC G2 (PowerQUICC II, 1 core, 32-bit) | PowerPC G2 (PowerQUICC II) | PowerPC G2 (PowerQUICC II) | PowerPC G2 (PowerQUICC II) |
| CPM (Comms Processor Module) | Integrated (per PowerQUICC II) | Integrated | Integrated | Integrated |
| Number of Terminals | 480 (ball) | 480 (ball) | 480 (ball) | 480 (ball) |
| Packaging | Tray | Tray | Tray | Tray |
Diferenciadores clave
- Integrated PowerQUICC II CPM offloads serial and packet handling (frente a MPC8260ACZUMIBB (same die family))
- Mature long-life supply via NXP and Rochester Electronics (frente a Generic ARM Cortex MPU)
- 200 MHz PowerPC G2 deterministic performance (frente a Lower-speed 100 MHz MPC82xx variant)
Notas de diseño
Estimated: at 2.5V core with typical 4-5W PowerQUICC II dissipation, plan PCB copper area of at least 25 cm x 25 cm and a thermal pad via array under the LBGA thermal balls, sized against the package thermal model for production. Industrial designs in sealed enclosures should derate CPU utilization to keep junction temperature under 100C for long-term reliability. For measurement, place a thermocouple near a center thermal ball and validate via a 30-minute worst-case load test in the actual chassis.
Allocate at least one continuous inner ground plane under the 37.5x37.5 mm LBGA to provide a low-impedance return path for the parallel memory bus plus 4-wire JTAG signals. Use microvia-in-pad or dog-bone fanout at 0.8-1.0 mm pitch to route the 480 balls cleanly, with matched-length traces for memory clock and byte-write strobes per the NXP PowerQUICC II hardware design guide. Verify BGA reflow profile conformance (RTS O2 < 50 ppm equivalent) to avoid board warpage and solder joint defects at production reflow.
Series-terminate the external memory data/address bus near the XPC8260CVVIFBC balls to dampen reflections on the high-pin-count BGA memory interface. JTAG TCK should be EMC-filtered to keep boundary-scan reliability intact in noisy telecom environments. CPM serial lines (SCC/SMC) benefit from series ferrite beads when fed to external PHYs or framers to meet typical ETSI/EN55022 emissions levels.
Información de cumplimiento
RoHS/lead-free status not present in verified web data; the XPC prefix historically denotes 'no PB' lead finish per legacy Freescale encoding but is not authoritative for current EU RoHS - confirm against the latest NXP material declaration before shipping to RoHS-restricted markets.
