PIC32MX564F064H-V/MR
PIC32MX564F064H-V/MR - 80MHz 32-bit MCU 64KB Flash USB OTG | Microchip
The Microchip PIC32MX564F064H-V/MR is a 32-bit MIPS M4K microcontroller running at 80 MHz with 64 KB Flash and 32 KB SRAM, integrated USB OTG, 10-bit ADC, and DMA, housed in a 64-pin VQFN (9x9 mm) package with extended (-40C to +105C) temperature grade.
A 32-bit microcontroller (MCU) is a programmable processor that integrates a CPU core, memory, and peripherals on a single die. Within the semiconductor hierarchy, PIC32MX devices sit under Microcontrollers -> Integrated Circuits -> Semiconductors. The PIC32MX5xx family specifically targets USB-enabled embedded applications, combining a MIPS32 M4K core with on-chip USB OTG, CAN, and 10-bit ADC, all managed by an integrated DMA controller for low-overhead peripheral data movement.
Key features include 64 KB (64K x 8) Flash program memory, 32 KB SRAM, 80 MHz maximum CPU clock, USB On-The-Go (OTG) full-speed and low-speed transceiver, a 10-bit 1 Msps ADC with up to 16 channels, DMA with multiple channels for offloading CPU transfers, and configurable I/O. The 64-VQFN (9x9 mm) package offers a low-profile surface-mount footprint suitable for compact embedded designs.
Architecturally, the PIC32MX564 uses the MIPS32 M4K core with 5-stage pipeline, Harvard cache, and a peripheral bus that connects USB, ADC, SPI, I2C, UART, and CAN modules to the DMA engine. This architecture delivers deterministic interrupt latency and 1.56 DMIPS/MHz, which is sufficient for USB stack processing, motor control loops, and basic signal processing without external logic.
Typical applications include USB peripherals (HID, CDC, MSD), industrial control with CAN, embedded graphics controllers, low-cost sensor hubs, and consumer devices that need on-board USB connectivity. The integrated USB OTG PHY eliminates an external transceiver and reduces BOM cost.
When designing with this device, allocate sufficient decoupling on VDD/VSS pairs (typically 100 nF per pin) and keep the 80 MHz trace lengths short to avoid EMI. The 64-VQFN package exposes a thermal pad that must be soldered to a continuous ground plane for thermal dissipation and electrical reference.
This page synthesizes distributor pricing, parametric drop-in alternatives, and practical design notes not found in the manufacturer datasheet. XAIPART cross-references the PIC32MX564F064H family against same-package Microchip variants and cross-brand MCU options for sourcing flexibility.
USD $4,10
En stock