10AS032H1F34E1HG vs 10AS032H1F35I1HG Comparación
Comparación detallada lado a lado de 10AS032H1F34E1HG por Intel y 10AS032H1F35I1HG por Intel. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
Intel
10AS032H1F34E1HG - Arria 10 SX SoC FPGA, 320K LE, 1152-FBGA | Intel (Altera)
10AS032H1F34E1HG ✓ Activo
Comparación de especificaciones
| Parámetro | 10AS032H1F34E1HG | 10AS032H1F35I1HG |
|---|---|---|
| Marca | Intel | Intel |
| Categoría | FPGA & CPLD | FPGA & CPLD |
| Estado del ciclo de vida | Activo | Activo |
| Estado del stock | In Stock | In Stock |
| Precio unitario (USD) | $1.755,00 | $2.265,00 |
| Device Family | Arria 10 SX | Arria 10 SX |
| Architecture | 20nm SoC FPGA (FPGA + hard ARM Cortex-A9 subsystem) | — |
| Logic Elements | 320,000 | 320K |
| Hard Processor System | Dual-core ARM Cortex-A9 MPCore with CoreSight | — |
| HPS Maximum Frequency | 1.5 GHz | — |
| On-chip Memory | Approx. 21 Mb (M20K blocks) | — |
| Transceivers | Up to 24 channels, up to 17.4 Gbps | — |
| DSP Blocks | Variable-precision hardened DSP with floating-point | — |
| Hard Memory Controllers | DDR4 up to 2133 Mbps, DDR3, QDRII+, RLDRAM3 | — |
| PCIe Hard IP | PCIe Gen3 x8 | — |
| Encapsulado | 1152-ball FCBGA (35 x 35 mm) | 1152-FBGA, FC (35x35 mm) |
| Operating Temperature (E1 suffix) | 0C to +100C (extended) | — |
| Tipo de montaje | Surface Mount, flip-chip BGA | Surface Mount |
| Estado RoHS | Compliant | Compliant |
| Pin/Ball Count | 1152 | — |
| Device Sub-Family | — | SoC FPGA |
| Processor Subsystem | — | Dual ARM Cortex-A9 MPCore with CoreSight |
| Maximum Processor Frequency | — | 1.5 GHz |
| General Purpose I/Os | — | 384 |
| Terminal Pitch | — | 1.0 mm |
| Terminal Form | — | Ball |
| Process Technology | — | 20 nm |
| Temperatura de funcionamiento | — | -40C to +100C (Industrial) |
| Nivel MSL | — | [DATA_NEEDED: MSL Level] |
| Lead-Free | — | Yes |