10AS032H1F34E1HG vs 10AS032H1F35I1HG 비교
다음의 상세 나란히 비교: 10AS032H1F34E1HG 제조: Intel 및 10AS032H1F35I1HG 제조: Intel. 주요 사양, 전기적 파라미터, 패키징, 수명 주기 상태, 가격 및 재고를 비교하여 설계 요구 사항에 가장 적합한 부품을 결정하십시오.
Intel
10AS032H1F34E1HG - Arria 10 SX SoC FPGA, 320K LE, 1152-FBGA | Intel (Altera)
10AS032H1F34E1HG ✓ 활성
사양 비교
| 파라미터 | 10AS032H1F34E1HG | 10AS032H1F35I1HG |
|---|---|---|
| 브랜드 | Intel | Intel |
| 카테고리 | FPGA & CPLD | FPGA & CPLD |
| 수명 주기 상태 | 활성 | 활성 |
| 재고 상태 | In Stock | In Stock |
| 단가 (USD) | $1,755.00 | $2,265.00 |
| Device Family | Arria 10 SX | Arria 10 SX |
| Architecture | 20nm SoC FPGA (FPGA + hard ARM Cortex-A9 subsystem) | — |
| Logic Elements | 320,000 | 320K |
| Hard Processor System | Dual-core ARM Cortex-A9 MPCore with CoreSight | — |
| HPS Maximum Frequency | 1.5 GHz | — |
| On-chip Memory | Approx. 21 Mb (M20K blocks) | — |
| Transceivers | Up to 24 channels, up to 17.4 Gbps | — |
| DSP Blocks | Variable-precision hardened DSP with floating-point | — |
| Hard Memory Controllers | DDR4 up to 2133 Mbps, DDR3, QDRII+, RLDRAM3 | — |
| PCIe Hard IP | PCIe Gen3 x8 | — |
| 패키지 | 1152-ball FCBGA (35 x 35 mm) | 1152-FBGA, FC (35x35 mm) |
| Operating Temperature (E1 suffix) | 0C to +100C (extended) | — |
| 실장 유형 | Surface Mount, flip-chip BGA | Surface Mount |
| RoHS 상태 | Compliant | Compliant |
| Pin/Ball Count | 1152 | — |
| Device Sub-Family | — | SoC FPGA |
| Processor Subsystem | — | Dual ARM Cortex-A9 MPCore with CoreSight |
| Maximum Processor Frequency | — | 1.5 GHz |
| General Purpose I/Os | — | 384 |
| Terminal Pitch | — | 1.0 mm |
| Terminal Form | — | Ball |
| Process Technology | — | 20 nm |
| 동작 온도 | — | -40C to +100C (Industrial) |
| MSL 레벨 | — | [DATA_NEEDED: MSL Level] |
| Lead-Free | — | Yes |