10AS032H4F35I3SG vs 10AS032H4F35E3SG Comparación
Comparación detallada lado a lado de 10AS032H4F35I3SG por Altera y 10AS032H4F35E3SG por Intel. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
Comparación de especificaciones
| Parámetro | 10AS032H4F35I3SG | 10AS032H4F35E3SG |
|---|---|---|
| Marca | Altera | Intel |
| Categoría | FPGA & CPLD | FPGA & CPLD |
| Estado del ciclo de vida | Activo | Activo |
| Estado del stock | In Stock | In Stock |
| Precio unitario (USD) | $1.080,00 | $3.750,00 |
| Family | Arria 10 SX SoC FPGA | Arria 10 SX SoC FPGA |
| Logic Elements | 320,000 | 320K |
| Adaptive Logic Modules (ALM) | 118,730 | — |
| Embedded Memory (Mbits) | 21.6 | — |
| DSP Blocks | 1,568 | Variable-precision DSP (per Arria 10 SX family) |
| DSP Format | Variable-precision with hard IEEE 754 single-precision FP | — |
| Transceivers | 24 (up to 17.4 Gbps) | Multi-gigabit transceivers present (per Arria 10 SX datasheet family) |
| HPS Processor | Dual ARM Cortex-A9 MPCore with CoreSight | — |
| HPS Clock Speed | 1.5 GHz | — |
| Hard Memory Controller | Yes (DDR3/DDR4, LPDDR2/3) | — |
| PCIe Hard IP | PCIe Gen3 x8 | — |
| Process Node | 20 nm | — |
| Encapsulado | 1152-ball Flip-Chip BGA (35x35 mm) | 1152-ball FC-FBGA, 35 x 35 mm (F35) |
| Temperatura de funcionamiento | -40C to +100C (Industrial) | — |
| Estado RoHS | Compliant | Compliant (per Altera product page) |
| Device | — | 10AS032 |
| Hard Processor System | — | Dual-core ARM Cortex-A9 MPCore with CoreSight |
| Process Technology | — | 20 nm |
| Core Voltage (typical) | — | 0.9 V |
| Maximum Processor Frequency | — | 1.5 GHz |
| Tipo de montaje | — | Surface Mount |
| Operating Temperature Grade | — | E (Enhanced, per suffix) |
| Nivel MSL | — | [DATA_NEEDED: MSL level] |
| Ordering Suffix Coding | — | H4 = device variant, F35 = 35x35 mm 1152-FBGA package, E3 = Enhanced operating temperature |