10AX090N3F40E2LG vs 10AX090N2F45E2SG Comparación
Comparación detallada lado a lado de 10AX090N3F40E2LG por Intel y 10AX090N2F45E2SG por Intel. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
Comparación de especificaciones
| Parámetro | 10AX090N3F40E2LG | 10AX090N2F45E2SG |
|---|---|---|
| Marca | Intel | Intel |
| Categoría | FPGA & CPLD | FPGA & CPLD |
| Estado del ciclo de vida | Activo | Activo |
| Estado del stock | In Stock | In Stock |
| Precio unitario (USD) | $2.280,00 | $4.943,22 |
| Family | Arria 10 GX | Arria 10 GX |
| Logic Elements | 900,000 | 900,000 |
| Adaptive Logic Modules (ALMs) | [DATA_NEEDED: ALM count] | — |
| Embedded Memory | 59,234,304 bits | 23,104 Kbits |
| DSP Blocks | 1,518 | 24 (variable precision, hardened FP) |
| User I/O Pins | 600 | — |
| Transceivers | Up to 24 full-duplex channels | Up to 12.05 Gbps |
| Transceiver Data Rate | Up to 14.4 Gbps | — |
| Hard Memory Controllers | Yes (DDR4, DDR3, QDR IV, RLDRAM 3) | — |
| Maximum DDR4 Rate | 2666 Mbps | — |
| PCIe Hard IP | PCIe Gen3 x8 (root port or endpoint) | — |
| Encapsulado | 1517-ball FCBGA, 40 mm | 1932-ball FCBGA (F45) |
| Process Technology | TSMC 20nm | TSMC 20nm |
| Temperatura de funcionamiento | -40C to +100C (extended industrial) | — |
| Core Voltage | 0.9 V typical | — |
| Configuration Encryption | AES-256 bitstream encryption | — |
| Partial Reconfiguration | Supported | — |
| Estado RoHS | Compliant | Compliant |
| User I/O Count | — | 768 |
| PCI Express Hard IP | — | Yes (Gen3 capable) |
| External Memory Support | — | DDR4 up to 1,200 MHz, DDR3, QDR IV, RLDRAM III |
| Hard Processor System | — | Dual ARM Cortex-A9 MPCore (on SoC variants) |
| Configuration Modes | — | JTAG, Passive Serial (PS), Fast Passive Parallel (FPP), Avalon-ST |
| Operating Temperature Grade | — | E2 (extended) |
| Tipo de montaje | — | Surface Mount (BGA) |