10AX090R2F40E2LG vs 10AX090R3F40E2LG Comparación
Comparación detallada lado a lado de 10AX090R2F40E2LG por Intel y 10AX090R3F40E2LG por Intel. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
Comparación de especificaciones
| Parámetro | 10AX090R2F40E2LG | 10AX090R3F40E2LG |
|---|---|---|
| Marca | Intel | Intel |
| Categoría | FPGA & CPLD | FPGA & CPLD |
| Estado del ciclo de vida | Activo | Activo |
| Estado del stock | In Stock | In Stock |
| Precio unitario (USD) | $2.920,00 | $5.750,00 |
| Series | Arria 10 GX | — |
| Family | 10AX090 | Arria 10 GX |
| Logic Elements (LE) | 900,000 | — |
| Adaptive Logic Modules (ALM) | [DATA_NEEDED: ALM count] | — |
| User I/O Count | 342 | 342 |
| Process Technology | 20 nm | 20 nm |
| Core Voltage | 0.9 V | — |
| Transceivers | 66 channels | Multi-gigabit serial transceivers (on-die) |
| Transceiver Data Rate | Up to 12.5 Gbps (GX) | — |
| Embedded Memory | 25 Mbits (MLAB + block RAM, total) | 59,234,304 bits |
| DSP Blocks | 18x19 multipliers | Hardened fixed/floating-point DSP blocks (on-die) |
| Encapsulado | 1517-ball FCBGA | 1517-Ball FCBGA |
| Tipo de montaje | Surface Mount (flip-chip BGA) | Surface Mount |
| Speed Grade | -E2 (Extended, mid-tier) | — |
| Operating Temperature Grade | Extended (-E) | — |
| Estado RoHS | Compliant | Compliant |
| Nivel MSL | 3 | — |
| Lead-Free | Yes | — |
| Logic Elements | — | 900,000 |
| Core Supply Voltage | — | 0.9 V |
| Package Type | — | Flip-Chip Ball Grid Array |
| Number of Terminals | — | 1517 |
| Memory Interfaces | — | Hardened DDR3/DDR4 memory controller IP |
| Hard IP | — | PCI Express Gen3, 10/40/100 GbE Ethernet |
| Configuration | — | Partial reconfiguration supported |