10AX090R3F40E2LG - Arria 10 GX 900K LE FPGA | Intel | 1517-FCBGA
N.º de pieza: 10AX090R3F40E2LG ✓ Activo| Cant. | Precio unitario | Total |
|---|---|---|
| 1 | $7250 | $7.250,00 |
| 10 | $6980 | $69.800,00 |
| 100 | $6550 | $655.000,00 |
| 500 | $6100 | $3.050.000,00 |
| 1.000 | $5750 | $5.750.000,00 |
10AX090R3F40E2LG Descripción general
An FPGA (Field Programmable Gate Array) is a type of programmable logic device (PLD) that allows engineers to implement arbitrary digital logic in hardware after manufacturing. Within the broader semiconductor taxonomy, FPGAs sit alongside ASICs and microcontrollers as reconfigurable compute fabrics; an FPGA hierarchy reads: FPGA -> programmable logic -> logic IC -> integrated circuit -> semiconductor. The Arria 10 GX family is Intel's mid-range, transceiver-rich FPGA line that bridges the gap between Cyclone low-cost devices and Stratix high-performance devices, delivering an optimal balance of logic density, transceiver bandwidth, and power efficiency.
Key features of the 10AX090R3F40E2LG include up to 900K logic elements, 59.2 Mbits of embedded memory, 342 general-purpose I/O pins, dedicated on-chip transceivers rated for multi-gigabit operation, embedded DSP blocks for high-throughput signal processing, and hard memory controller IP for external DDR3/DDR4 interfaces. The 1517-ball FCBGA package uses flip-chip solder-bump technology that minimizes lead inductance and enables the high I/O density required by transceiver-heavy applications.
Technically, the Arria 10 GX architecture combines a hardened ARM Cortex-A9 subsystem option, partial reconfiguration support, and hardened PCI Express Gen3 IP blocks. The 20 nm process technology reduces dynamic power compared with the previous 28 nm Arria V generation, while the core fabric supports operation at typical clock frequencies that satisfy line-rate packet processing, video bridging, and 4K video pipeline designs. Hardware DSP blocks deliver fixed-point and floating-point arithmetic at teraflop-class throughput per watt.
Typical applications include wireless baseband processing, radar and electronic warfare, broadcast video encoders and decoders, PCI Express Gen3 acceleration cards, high-speed serial interface bridging, and test and measurement instrumentation. The Arria 10 GX family is widely deployed in 4G/5G fronthaul, medical imaging backplanes, and defense signal-intelligence platforms.
Designers should note that the 1517-ball FCBGA package requires a multi-layer PCB with controlled-impedance routing, via-in-pad construction, and a sophisticated reflow profile. The 0.9 V core supply demands multiple on-board voltage rails (typically 0.9 V, 1.0 V, 1.2 V, 1.5 V, 2.5 V, and 3.3 V), all of which must be sequenced during power-up to avoid latch-up. Quartus Prime Prime design software is the supported toolchain.
Alternativas directas para 10AX090R3F40E2LG — mismo encapsulado, compatible pin a pin. Se excluyen las piezas de otro encapsulado que requieren retrabajo de la PCB.
Variantes de esta serie
Modelos de la misma serie compatibles directamente con 10AX090R3F40E2LG (mismo factor de forma y huella) — difiere en Package, Transceivers, DSP Blocks, Speed Grade, Mounting Type.
Herramienta de comparación rápida — seleccione piezas alternativas para compararlas lado a lado:
10AX090R2F40E2LG
✅ Sustitución directa✓ En stock
$2920 / unidad
Ver hoja de datos →10AX090R2F40E2SG
✅ Sustitución directa ⚠️ Especificaciones sin verificar✓ En stock
$4750 / unidad
Ver hoja de datos →10AX090N3F40E2LG
✅ Sustitución directa✓ En stock
$2280 / unidad
Ver hoja de datos →10AX090R3F40I2LG
✅ Sustitución directa ⚠️ Especificaciones sin verificar✓ En stock
$3640 / unidad
Ver hoja de datos →10AX090N3F40E2LG
✅ Sustitución directa✓ En stock
$2280 / unidad
Ver hoja de datos →10AX090R3F40E2LG Valores máximos y características eléctricas
| Family | Arria 10 GX |
| Logic Elements | 900,000 |
| Embedded Memory | 59,234,304 bits |
| User I/O Count | 342 |
| Process Technology | 20 nm |
| Core Supply Voltage | 0.9 V |
| Encapsulado | 1517-Ball FCBGA |
| Package Type | Flip-Chip Ball Grid Array |
| Tipo de montaje | Surface Mount |
| Number of Terminals | 1517 |
| Transceivers | Multi-gigabit serial transceivers (on-die) |
| DSP Blocks | Hardened fixed/floating-point DSP blocks (on-die) |
| Memory Interfaces | Hardened DDR3/DDR4 memory controller IP |
| Hard IP | PCI Express Gen3, 10/40/100 GbE Ethernet |
| Configuration | Partial reconfiguration supported |
| Estado RoHS | Compliant |
Guía de configuración de pines de 10AX090R3F40E2LG flip-chip ball grid array
Configuración de pines para 10AX090R3F40E2LG (encapsulado flip-chip ball grid array). Este CI digital incluye GPIO, interfaces de comunicación (UART, SPI, I2C) y pines de alimentación. Consulte la hoja de datos del fabricante para conocer las funciones alternativas de los pines y las opciones de configuración. Esencial para el diseño de sistemas embebidos y el diseño de PCB.
No hay datos detallados de patillaje disponibles para 10AX090R3F40E2LG.
Consulte la hoja de datos para ver la configuración completa de patillas.
Aplicaciones típicas
10AX090R3F40E2LG es adecuado para 6 aplicacións: 4G/5G Wireless Baseband Processing, Radar and Electronic Warfare (EW), Broadcast Video Encoder/Decoder, PCI Express Gen3 Accelerator Card, High-Speed Serial Interface Bridging, Test & Measurement Instrumentation.
4G/5G Wireless Baseband Processing
The 10AX090R3F40E2LG is well suited for 4G and 5G wireless baseband processing where 900K logic elements, 7.4 Mbytes of embedded M20K SRAM, and 342 user I/O provide the headroom for CPRI/eCPRI fronthaul, FFT/IFFT engines, and channel-codec acceleration. Its hard PCI Express Gen3 blocks pair naturally with baseband cards plugged into AdvancedTCA or ATX backplanes, while hardened DDR3/DDR4 controllers feed the multi-gigabit sample buffers required for LTE-A carrier aggregation and 5G NR sub-6 GHz signal chains. Compared with microcontrollers or DSP-only SoCs, the FPGA's massive parallelism delivers 10x-100x throughput per watt for baseband PHY-layer functions. Designers should size the PCB power tree to handle the multi-rail sequencing of 0.9 V core, 1.0/1.2 V transceiver, and 1.5/2.5/3.3 V auxiliary supplies.
Recomendado
Radar and Electronic Warfare (EW)
The 10AX090R3F40E2LG's combination of 900K LEs, hardened floating-point capable DSP blocks, and multi-gigabit transceivers makes it a strong choice for radar and EW front-end processing. The fabric can implement thousands of FIR filters, beamforming weights, and pulse-compression correlators in parallel, while 59 Mbits of embedded SRAM buffer radar returns for moving-target indication (MTI) and SAR processing. The 1517-FCBGA package supports the high pin-count required to interface directly with wideband ADC/DAC front-ends over LVDS or JESD204B/C links, and Arria 10's hardened 10/40/100 GbE Ethernet IP enables direct-to-switch radar data distribution. Extended-industrial temperature grades and partial reconfiguration enable runtime mode-switching between surveillance and jamming waveforms on a single board.
Recomendado
Broadcast Video Encoder/Decoder
The 10AX090R3F40E2LG is deployed in broadcast video encoder and decoder platforms that handle SD/HD/3G/6G/12G-SDI streams plus emerging IP-based SMPTE ST 2110 workflows. The 900K-LE fabric supports multiple simultaneous HEVC/H.264 encode or decode channels at 4K60 resolution, while 342 user I/O accommodate dozens of SDI inputs/outputs and redundant control interfaces. On-chip M20K memory blocks provide line-store buffers for deinterlacing and motion-estimation search windows, eliminating external SRAM and reducing BOM cost. Hardened 10/40 GbE Ethernet IP enables direct IP-network integration for IP-based broadcast studios, and partial reconfiguration allows hardware-accelerated codec switching on the fly without system downtime, a critical feature for live-production broadcast equipment.
Recomendado
PCI Express Gen3 Accelerator Card
The 10AX090R3F40E2LG's hard PCI Express Gen3 IP blocks enable drop-in deployment on PCIe Gen3 x8 accelerator cards for data-center workloads such as machine-learning inference, computational storage, and database acceleration. Hard IP delivers lower latency and lower power than soft PCIe cores, freeing fabric resources for the actual application logic - critical when only 900K LEs are available. The 59 Mbits of embedded SRAM accelerate key-value caches and intermediate tensor data without round-tripping through external DRAM, while 342 user I/O accommodate HBM2 or DDR4 expansion memory and high-speed network interfaces. The 1517-FCBGA package's flip-chip construction maintains signal integrity on 8 GT/s PCIe lanes and multi-gigabit backplane links, making this FPGA a workhorse for production accelerator deployments in 2024-2026 hyperscaler fleets.
Recomendado
High-Speed Serial Interface Bridging
The 10AX090R3F40E2LG serves as a multi-protocol serial bridge IC, simultaneously translating between PCIe Gen3, 10/40/100 GbE Ethernet, Interlaken, SATA, and legacy protocols such as Fibre Channel and SONET/SDH. The Arria 10 GX architecture provides hardened PCS and PMA layers for these protocols, so designers consume far fewer LEs for transceiver management and more for application-level bridging logic. With 900K LEs and 7.4 Mbytes of embedded SRAM, the device can implement deep packet buffers for cut-through switching and store-and-forward applications, eliminating external packet-memory chips. The 1517-FCBGA F40 footprint is shared with the Arria 10 GT family, allowing OEMs to migrate between GX and GT variants on the same PCB for cost-engineered product tiers.
Recomendado
Test & Measurement Instrumentation
The 10AX090R3F40E2LG is used in test and measurement instrumentation including protocol analyzers, BERT (Bit Error Rate Testers), oscilloscopes with deep digital channels, and protocol-aware logic analyzers. Its 342 user I/O and high-speed transceivers enable simultaneous capture of multi-lane protocols such as 100 GbE, PCIe Gen3, USB 3.x, and SATA, while 900K LEs implement trigger logic, pattern generators, and protocol decoders. The 59 Mbits of embedded SRAM provide deep capture buffers at sample rates that exceed external memory bandwidth, and the FPGA's partial reconfiguration supports runtime protocol decode upgrades in the field without instrument recalibration. Designers targeting bench-top instruments value the Arria 10 GX family's robust design maturity and the mature Quartus Prime tool flow that minimizes time-to-market for new protocol decoder IP.
Recomendado
Resumen de productos recomendados
Datos de referencia de ingeniería para 10AX090R3F40E2LG — comparación, orientación de diseño e información de cumplimiento.
Guía de selección
Comparación con alternativas
| Parámetro | Este producto | 10AX090R2F40E2LG | 10AX090N3F40E2LG | 10AX090R3F40I2LG |
|---|---|---|---|---|
| Brand | Intel | Intel | Intel | Intel |
| Family | Arria 10 GX | Arria 10 GX | Arria 10 GT | Arria 10 GX |
| Package | 1517-FCBGA | 1517-FCBGA - same | 1517-FCBGA - same | 1517-FCBGA - same |
| Logic Elements | 900,000 | 900,000 | 900,000 | 900,000 |
| Embedded Memory (bits) | 59,234,304 | 59,234,304 | 59,234,304 | 59,234,304 |
| User I/O | 342 | 342 | 342 | 342 |
| Speed Grade | -3 (fastest) | -2 (slower) | -3 (fastest) | -2 (slower) |
| Temperature Grade | E (extended industrial) | E (extended industrial) | E (extended industrial) | I (industrial) |
| Hard PCIe Gen3 IP | Yes | Yes | Yes | Yes |
Diferenciadores clave
- Highest speed grade in Arria 10 GX family for this density (frente a 10AX090R2F40E2LG)
- GX family member optimized for transceiver density (frente a 10AX090N3F40E2LG)
- Extended industrial temperature grade with F40 package (frente a 10AX090R3F40I2LG)
Notas de diseño
The Arria 10 GX family requires a multi-rail power tree: 0.9 V core, 1.0/1.2 V transceiver analog, 1.5/2.5/3.3 V auxiliary I/O, plus auxiliary supplies for HPS if used. Per the Intel Arria 10 GX datasheet, core current at 900K-LE utilization can exceed 20 A at full toggle rates - use a synchronous buck controller with at least 25 A peak capability and place input/output bulk capacitors within 100 mils of the FCBGA balls. Implement power-rail sequencing per Intel's Power Management Design Guidelines; failure to sequence can trigger latch-up. Estimated: at VIN=12 V, VOUT=0.9 V, and 20 A core load, regulator power dissipation is (12-0.9)*20 = 222 W - so the regulator's cooling solution must be sized accordingly.
The 1517-FCBGA package requires an 8-12 layer PCB with via-in-pad construction, laser-drilled microvias, and matched-length trace impedance (typically 50 ohm single-ended, 100 ohm differential). Per Arria 10 GX PCB design guidelines, every FCBGA ball should have a fanout via to inner layers, and the FPGA's ball-pitch dictates a 1.0 mm BGA pitch with 0.5 mm drill microvias. Solid ground and power planes must be continuous beneath the BGA to control return-current paths for the multi-gigabit transceivers, which operate at data rates up to 17.4 Gbps (PMA) per channel.
Do not assume all 342 user I/O are simultaneously available - the device's I/O count is allocated across LVDS pairs, regular I/O, and dedicated transceiver/clock pin functions per the device pin connection guidelines. Forgetting to constrain I/O standards in Quartus Prime can result in Quartus silently downgrading LVDS to LVCMOS and losing high-speed interface functionality. Also note that Arria 10 configuration via fast passive parallel (FPP) x32 mode requires a dedicated external flash, and the configuration scheme selected in the Quartus Prime pin planner must match the board schematic.
Información de cumplimiento
RoHS and lead-free compliance per Altera/Intel FPGA product environmental documentation. AEC-Q100 is automotive-grade qualification - Arria 10 GX is not AEC-Q100 qualified; for automotive designs use Cyclone V or specific automotive-grade Cyclone 10 GX parts instead.
