10AX090R2F40E2SG vs 10AX090R2F40E1SG Comparación
Comparación detallada lado a lado de 10AX090R2F40E2SG por Intel y 10AX090R2F40E1SG por Intel. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
Comparación de especificaciones
| Parámetro | 10AX090R2F40E2SG | 10AX090R2F40E1SG |
|---|---|---|
| Marca | Intel | Intel |
| Categoría | FPGA & CPLD | FPGA & CPLD |
| Estado del ciclo de vida | Activo | Activo |
| Estado del stock | In Stock | In Stock |
| Precio unitario (USD) | $4.750,00 | $5.750,00 |
| Family | Arria 10 GX | Arria 10 GX |
| Logic Elements | 900000 | — |
| LABs/CLBs | 339620 | — |
| Total RAM Bits | 59234304 | — |
| User I/O Count | 342 | 342 |
| Package Type | 1517-BBGA, FCBGA | — |
| Package Code | F40 (approx. 40mm FCBGA) | — |
| Speed Grade | 2 (R2 -2 transceiver rating) | — |
| Temperature Grade | E2 (Extended: -40C to +100C junction) | — |
| Lead-Free / RoHS | Yes (SG suffix) | — |
| Transceivers | Up to 14.1 Gbps (Arria 10 GX feature) | — |
| DSP Blocks | Variable-precision, hardened floating-point capable | [DATA_NEEDED: variable-precision DSP count] |
| Process Node | TSMC 20nm | — |
| Tipo de montaje | Surface Mount (FCBGA ball grid) | Surface Mount |
| Nivel MSL | 3 (168 Hours) | — |
| Packaging | Tray | — |
| Logic Elements (LE) | — | 900,000 |
| Adaptive Logic Modules (ALM) | — | [DATA_NEEDED: ALM count] |
| Embedded Memory Bits | — | 59,234,304 |
| Transceiver Count | — | [DATA_NEEDED: GX transceiver count] |
| Max Transceiver Data Rate | — | 28.3 Gbps |
| Hard Memory Controllers | — | Yes |
| Hard PCIe Gen3 IP | — | Yes (x8) |
| Hard 100G Ethernet MAC | — | Yes |
| Process Technology | — | 20 nm |
| Core Voltage | — | 0.9 V |
| Operating Temperature Grade | — | Enhanced (E1) |
| Encapsulado | — | 1517-ball FCBGA (F40), 40 x 40 mm |
| Estado RoHS | — | Compliant |
| Lead-Free | — | Yes |