10AX090R2F40E2SG vs 10AX090R2F40E2LG Comparación
Comparación detallada lado a lado de 10AX090R2F40E2SG por Intel y 10AX090R2F40E2LG por Intel. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
Comparación de especificaciones
| Parámetro | 10AX090R2F40E2SG | 10AX090R2F40E2LG |
|---|---|---|
| Marca | Intel | Intel |
| Categoría | FPGA & CPLD | FPGA & CPLD |
| Estado del ciclo de vida | Activo | Activo |
| Estado del stock | In Stock | In Stock |
| Precio unitario (USD) | $4.750,00 | $2.920,00 |
| Family | Arria 10 GX | 10AX090 |
| Logic Elements | 900000 | — |
| LABs/CLBs | 339620 | — |
| Total RAM Bits | 59234304 | — |
| User I/O Count | 342 | 342 |
| Package Type | 1517-BBGA, FCBGA | — |
| Package Code | F40 (approx. 40mm FCBGA) | — |
| Speed Grade | 2 (R2 -2 transceiver rating) | -E2 (Extended, mid-tier) |
| Temperature Grade | E2 (Extended: -40C to +100C junction) | — |
| Lead-Free / RoHS | Yes (SG suffix) | — |
| Transceivers | Up to 14.1 Gbps (Arria 10 GX feature) | 66 channels |
| DSP Blocks | Variable-precision, hardened floating-point capable | 18x19 multipliers |
| Process Node | TSMC 20nm | — |
| Tipo de montaje | Surface Mount (FCBGA ball grid) | Surface Mount (flip-chip BGA) |
| Nivel MSL | 3 (168 Hours) | 3 |
| Packaging | Tray | — |
| Series | — | Arria 10 GX |
| Logic Elements (LE) | — | 900,000 |
| Adaptive Logic Modules (ALM) | — | [DATA_NEEDED: ALM count] |
| Process Technology | — | 20 nm |
| Core Voltage | — | 0.9 V |
| Transceiver Data Rate | — | Up to 12.5 Gbps (GX) |
| Embedded Memory | — | 25 Mbits (MLAB + block RAM, total) |
| Encapsulado | — | 1517-ball FCBGA |
| Operating Temperature Grade | — | Extended (-E) |
| Estado RoHS | — | Compliant |
| Lead-Free | — | Yes |