10AX090S4F45I3SG vs 10AX090S2F45E2SG Comparación
Comparación detallada lado a lado de 10AX090S4F45I3SG por Intel y 10AX090S2F45E2SG por Intel. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
Comparación de especificaciones
| Parámetro | 10AX090S4F45I3SG | 10AX090S2F45E2SG |
|---|---|---|
| Marca | Intel | Intel |
| Categoría | FPGA & CPLD | FPGA & CPLD |
| Estado del ciclo de vida | Activo | Activo |
| Estado del stock | In Stock | In Stock |
| Precio unitario (USD) | $4.520,00 | $2.050,00 |
| Family | Arria 10 GX | Arria 10 |
| Logic Elements | 900,000 | 900,000 |
| Adaptive Logic Modules (ALMs) | [DATA_NEEDED: ALM count] | — |
| Embedded Memory (bits) | 59,234,304 | 59,234,304 |
| Maximum User I/O | 624 | — |
| Transceivers | [DATA_NEEDED: transceiver count and speed grade] | [DATA_NEEDED: number of transceiver channels] |
| Process Technology | TSMC 20nm Tri-Gate | — |
| Hard Processor System (HPS) | Integrated (dual-core ARM Cortex-A9 MPCore) | — |
| Memory Controllers | Hardened DDR4/DDR3/QDR-IV controllers | — |
| Encapsulado | 1932-ball FCBGA, F45 (45mm) | — |
| Speed Grade | -3 (commercial fast / industrial fast) | -2 (mid) |
| Temperature Grade | Industrial (-40C to +100C junction) | — |
| Configuration | Active serial (AS) / passive serial (PS) / JTAG | — |
| Tipo de montaje | Surface Mount (HDI required) | Surface Mount |
| Estado RoHS | Compliant | Compliant |
| REACH Status | Compliant | — |
| Lead-Free | Yes | Yes |
| Sin halógenos | Yes | — |
| Nivel MSL | [DATA_NEEDED: MSL rating] | [DATA_NEEDED: moisture sensitivity level] |
| Design Tool | Intel Quartus Prime | — |
| Series | — | Arria 10 GX |
| User I/O Count | — | 624 |
| Logic Blocks | — | [DATA_NEEDED: ALM count] |
| DSP Blocks | — | [DATA_NEEDED: variable-precision DSP count] |
| Package Type | — | 1932-BBGA, FCBGA |
| Temperatura de funcionamiento | — | -40C to +100C (E2 = extended) |
| Process Node | — | 20nm TSMC |
| Device Variant | — | GX (transceiver-equipped) |
| Ball Count | — | 1932 |