10AX090S4F45I3SG vs 10AX090S2F45E2SG Comparaison
Comparaison détaillée côte à côte de 10AX090S4F45I3SG par Intel et 10AX090S2F45E2SG par Intel. Comparez les spécifications clés, les paramètres électriques, le conditionnement, le statut de cycle de vie, les prix et la disponibilité pour déterminer le meilleur composant pour vos exigences de conception.
Comparaison des spécifications
| Paramètre | 10AX090S4F45I3SG | 10AX090S2F45E2SG |
|---|---|---|
| Marque | Intel | Intel |
| Catégorie | FPGA & CPLD | FPGA & CPLD |
| Statut du cycle de vie | Actif | Actif |
| Statut du stock | In Stock | In Stock |
| Prix unitaire (USD) | $4 520,00 | $2 050,00 |
| Family | Arria 10 GX | Arria 10 |
| Logic Elements | 900,000 | 900,000 |
| Adaptive Logic Modules (ALMs) | [DATA_NEEDED: ALM count] | — |
| Embedded Memory (bits) | 59,234,304 | 59,234,304 |
| Maximum User I/O | 624 | — |
| Transceivers | [DATA_NEEDED: transceiver count and speed grade] | [DATA_NEEDED: number of transceiver channels] |
| Process Technology | TSMC 20nm Tri-Gate | — |
| Hard Processor System (HPS) | Integrated (dual-core ARM Cortex-A9 MPCore) | — |
| Memory Controllers | Hardened DDR4/DDR3/QDR-IV controllers | — |
| Boîtier | 1932-ball FCBGA, F45 (45mm) | — |
| Speed Grade | -3 (commercial fast / industrial fast) | -2 (mid) |
| Temperature Grade | Industrial (-40C to +100C junction) | — |
| Configuration | Active serial (AS) / passive serial (PS) / JTAG | — |
| Type de montage | Surface Mount (HDI required) | Surface Mount |
| Statut RoHS | Compliant | Compliant |
| REACH Status | Compliant | — |
| Lead-Free | Yes | Yes |
| Sans halogène | Yes | — |
| Niveau MSL | [DATA_NEEDED: MSL rating] | [DATA_NEEDED: moisture sensitivity level] |
| Design Tool | Intel Quartus Prime | — |
| Series | — | Arria 10 GX |
| User I/O Count | — | 624 |
| Logic Blocks | — | [DATA_NEEDED: ALM count] |
| DSP Blocks | — | [DATA_NEEDED: variable-precision DSP count] |
| Package Type | — | 1932-BBGA, FCBGA |
| Température de fonctionnement | — | -40C to +100C (E2 = extended) |
| Process Node | — | 20nm TSMC |
| Device Variant | — | GX (transceiver-equipped) |
| Ball Count | — | 1932 |