10AX115H3F34E2LG vs 10AX115H3F34I2LG Comparación
Comparación detallada lado a lado de 10AX115H3F34E2LG por Intel y 10AX115H3F34I2LG por Intel. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
Comparación de especificaciones
| Parámetro | 10AX115H3F34E2LG | 10AX115H3F34I2LG |
|---|---|---|
| Marca | Intel | Intel |
| Categoría | FPGA & CPLD | FPGA & CPLD |
| Estado del ciclo de vida | Activo | Activo |
| Estado del stock | In Stock | In Stock |
| Precio unitario (USD) | $6.550,00 | $6.800,00 |
| Family | Arria 10 GX | Arria 10 GX |
| Series | 10AX115 | — |
| Logic Elements (LE) | 1,150,000 | — |
| Embedded Memory | 68,857,856 bits (67.7 Mbit) | 68,857,856 bits |
| User I/O Count | 504 | 504 |
| Transceivers | Up to 17.4 Gbps (per Arria 10 datasheet) | — |
| Hard IP | PCIe Gen3 x8, 10/25/100G Ethernet MAC, DDR4 controller | — |
| DSP Blocks | Variable-precision DSP (per Arria 10 datasheet) | Variable-precision, floating-point capable |
| Process Technology | 20 nm TSMC | — |
| Core Voltage | 0.9 V | 0.9 V |
| Speed Grade | E2 (commercial, mid-speed) | H3 |
| Encapsulado | 1152-ball FCBGA (F34), 1.0 mm pitch | 1152-ball FCBGA |
| Temperatura de funcionamiento | 0C to +100C (commercial) | — |
| Tipo de montaje | Surface Mount (BGA, reflow) | — |
| Estado RoHS | Compliant | Compliant |
| Nivel MSL | MSL3 (per JEDEC J-STD-020) | — |
| Logic Elements (LEs) | — | 1,150,000 |
| Transceiver Count | — | 24 |
| Maximum Transceiver Data Rate | — | 17.4 Gbps |
| DSP Performance | — | Up to 1.5 TFLOP/s (FP) |
| Hardened Memory Controllers | — | DDR4/DDR3/LPDDR3 |
| Hardened PCIe | — | PCIe Gen3 x8 |
| Hardened Ethernet MAC | — | 10G/40G/100G capable |
| Process Node | — | 20 nm |
| Temperature Grade | — | Industrial (-40C to +100C junction) |