10AX115R2F40I1SG vs 10AX115R2F40E2LG Comparación
Comparación detallada lado a lado de 10AX115R2F40I1SG por Intel y 10AX115R2F40E2LG por Intel. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
Comparación de especificaciones
| Parámetro | 10AX115R2F40I1SG | 10AX115R2F40E2LG |
|---|---|---|
| Marca | Intel | Intel |
| Categoría | FPGA & CPLD | FPGA & CPLD |
| Estado del ciclo de vida | Activo | Activo |
| Estado del stock | In Stock | In Stock |
| Precio unitario (USD) | $3.490,00 | $10.300,00 |
| Family | Arria 10 GX | Arria 10 GX |
| Logic Elements | 1,150,000 | — |
| Adaptive Logic Modules (ALMs) | [DATA_NEEDED: ALM count] | — |
| Embedded Memory | 68,857,856 bits (68.86 Mbit) | — |
| DSP Blocks | 1,518 (variable-precision, hardened FP) | — |
| 18x19 Multipliers | 2,014 | — |
| User I/O Count | 342 | — |
| Transceivers | [DATA_NEEDED: transceiver count for F40 package] | 24 (up to 17.4 Gbps, 28.3 Gbps with -3 speed grade) |
| Transceiver Speed | Up to 14.1 Gbps (chip-dependent) | — |
| Memory Interfaces | DDR4, QDR-IV, RLDRAM3 (hard controllers) | — |
| PCIe Hard IP | PCIe Gen3 x8 | Gen3 x8 hard IP blocks |
| Process Node | 20 nm TSMC | — |
| Core Voltage | 0.9 V | — |
| Encapsulado | 1517-ball FCBGA (F40) | 1517-ball FCBGA (F40) |
| Temperature Grade | Industrial (-40C to +100C) | E2 (Extended) |
| Speed Grade | I1 (industrial, fastest) | -2 |
| Logic Elements (LE) | — | 1,150,000 |
| Adaptive Logic Modules (ALM) | — | [DATA_NEEDED: ALM count] |
| Embedded Memory Bits | — | 68,857,856 |
| Embedded Memory Blocks (M20K) | — | [DATA_NEEDED: M20K count] |
| DSP Blocks (18x19 Multipliers) | — | 1,518 |
| User I/O Pins | — | 342 |
| Memory Controllers | — | 2x hard DDR4/DDR3/RLDRAM3 controllers |
| PLLs | — | 24 fractional PLLs |
| Process Technology | — | TSMC 20 nm |
| Estado RoHS | — | Compliant |
| Tipo de montaje | — | Surface Mount (BGA) |