10AX115R2F40E2LG - Arria 10 GX FPGA 1150K LE | Intel | 1517-FCBGA
N.º de pieza: 10AX115R2F40E2LG ✓ Activo| Cant. | Precio unitario | Total |
|---|---|---|
| 1 | $12500 | $12.500,00 |
| 10 | $11850 | $118.500,00 |
| 100 | $11200 | $1.120.000,00 |
| 500 | $10750 | $5.375.000,00 |
| 1.000 | $10300 | $10.300.000,00 |
10AX115R2F40E2LG Descripción general
An FPGA (Field-Programmable Gate Array) is a type of integrated circuit that can be reconfigured by the designer after manufacturing, consisting of configurable logic blocks, programmable interconnect, and dedicated hard IP such as transceivers, DSP blocks, and memory controllers. Within the programmable-logic hierarchy, Arria 10 GX sits in the mid-to-high-performance tier: FPGA -> mid-range FPGA -> Arria family -> Arria 10 GX, optimized for transceiver-rich applications including 25G/40G/100G backplanes, radar, and ASIC prototyping.
Key features of the 10AX115R2F40E2LG include 24 high-speed serial transceivers up to 17.4 Gbps (28.3 Gbps with the -3 speed grade), two hard memory controllers for DDR4/DDR3/RLDRAM3, up to 1,518 18x19 multipliers for DSP, integrated PCI Express Gen3 hard IP blocks, and 24 fractional PLLs. The -2 speed grade and -E2 (extended) temperature rating target commercial-to-industrial deployments with a balance of performance and power.
Architecturally, the device uses TSMC's 20 nm process with a heterogeneous fabric that pairs adaptive logic modules (ALMs) with hard floating-point DSP blocks and 20 Gbps transceivers. The hard IP approach delivers deterministic latency and roughly 2x better performance-per-watt versus soft implementations, making the 10AX115R2F40E2LG a strong fit for transceiver-heavy signal-processing pipelines.
Typical applications include 100G/40G Ethernet line cards, OTN/SONET framer/mapper equipment, military radar signal processing, medical imaging accelerators, ASIC emulation prototyping, and high-performance computing fabric bridges.
When designing with this device, plan a 12-layer stack-up with transceiver channels routed on the top layers behind short Ac coupling capacitors. Use Intel Quartus Prime Pro Edition for synthesis, place-and-route, and timing closure; consult the Arria 10 Transceiver PHY User Guide for eye-margining and adaptive equalization settings.
This page synthesizes distributor pricing, drop-in same-family alternatives, and practical board-level design notes not found in the manufacturer datasheet alone.
Alternativas directas para 10AX115R2F40E2LG — mismo encapsulado, compatible pin a pin. Se excluyen las piezas de otro encapsulado que requieren retrabajo de la PCB.
Variantes de esta serie
Modelos de la misma serie compatibles directamente con 10AX115R2F40E2LG (mismo factor de forma y huella) — difiere en Package, DSP Blocks, Temperature Grade, Embedded Memory, Speed Grade.
Herramienta de comparación rápida — seleccione piezas alternativas para compararlas lado a lado:
10AX115R2F40E1SG
✅ Sustitución directa✓ En stock
$6875 / unidad
Ver hoja de datos →10AX115R2F40E1LG
✅ Sustitución directa📋 Alternativa de referencia (no en el catálogo)
10AX115R2F40I1SG
✅ Sustitución directa✓ En stock
$3490 / unidad
Ver hoja de datos →10AX115R3F40E2LG
✅ Sustitución directa✓ En stock
$1425 / unidad
Ver hoja de datos →10AX115R1F40E1SG
✅ Sustitución directa✓ En stock
Consulte el precio
Ver hoja de datos →10AX090R2F40E2LG
✅ Sustitución directa✓ En stock
$2920 / unidad
Ver hoja de datos →10AX090R3F40E2LG
✅ Sustitución directa✓ En stock
$5750 / unidad
Ver hoja de datos →10AX115R2F40E2LG Valores máximos y características eléctricas
| Family | Arria 10 GX |
| Logic Elements (LE) | 1,150,000 |
| Embedded Memory Bits | 68,857,856 |
| DSP Blocks (18x19 Multipliers) | 1,518 |
| User I/O Pins | 342 |
| Transceivers | 24 (up to 17.4 Gbps, 28.3 Gbps with -3 speed grade) |
| PCIe Hard IP | Gen3 x8 hard IP blocks |
| Memory Controllers | 2x hard DDR4/DDR3/RLDRAM3 controllers |
| PLLs | 24 fractional PLLs |
| Speed Grade | -2 |
| Temperature Grade | E2 (Extended) |
| Encapsulado | 1517-ball FCBGA (F40) |
| Process Technology | TSMC 20 nm |
| Estado RoHS | Compliant |
| Tipo de montaje | Surface Mount (BGA) |
Guía de configuración de pines de 10AX115R2F40E2LG 1517-ball fcbga (f40)
Configuración de pines para 10AX115R2F40E2LG (encapsulado 1517-ball fcbga (f40)). Este CI digital incluye GPIO, interfaces de comunicación (UART, SPI, I2C) y pines de alimentación. Consulte la hoja de datos del fabricante para conocer las funciones alternativas de los pines y las opciones de configuración. Esencial para el diseño de sistemas embebidos y el diseño de PCB.
No hay datos detallados de patillaje disponibles para 10AX115R2F40E2LG.
Consulte la hoja de datos para ver la configuración completa de patillas.
Aplicaciones típicas
10AX115R2F40E2LG es adecuado para 6 aplicacións: 100G/40G Ethernet Line Card, OTN/SONET Framer-Mapper Equipment, Military Radar Signal Processing, ASIC Emulation and Prototyping, Medical Imaging Accelerator, High-Performance Computing Fabric Bridge.
100G/40G Ethernet Line Card
The 10AX115R2F40E2LG is purpose-built for 100G Ethernet line cards where its 24 transceivers up to 17.4 Gbps aggregate to 4x 25.78 Gbps CAUI-4 or 10x 10.31 Gbps CAUI-10 lanes. The hard IP supplies CAUI-4 PCS, AN/LT, and FEC blocks, while the 1,518 DSP blocks run RS(528,514) FEC and traffic-management logic on-chip. This FPGA meets CFP2/CFP4 module MSA requirements with deterministic latency under 1 microsecond, making it a strong choice for carrier-grade switches where guaranteed throughput is essential.
Recomendado
OTN/SONET Framer-Mapper Equipment
OTN framer/mapper systems benefit from the 10AX115R2F40E2LG's 1.15M logic elements and 1,518 DSP blocks, which hold the OTU4/OTU2 mapping and Reed-Solomon FEC without external ASICs. Two hard DDR4 controllers at 2666 MT/s buffer cross-connect traffic, while 24 transceivers map directly into OTU4 (28 Gbps) or 4x OTU2 (10.7 Gbps) tributaries. The deterministic latency of Intel's hard IP exceeds ITU-T G.709 jitter requirements for OTN cross-connect fabrics in carrier networks.
Recomendado
Military Radar Signal Processing
Radar arrays demand real-time FFT, pulse compression, and beamforming across hundreds of channels. The 10AX115R2F40E2LG delivers 1,518 18x19 multipliers and 68.9 Mbits of block RAM, supporting 4K-point FFTs and digital down-conversion (DDC) chains per device. Its -2 speed grade with E2 extended temperature survives defense environmental screening, and the 24 transceivers aggregate digital-RF data from front-end ADCs directly into the FPGA. Defense contractors standardize on this F40 footprint for SWaP-C-constrained radar signal processing systems.
Recomendado
ASIC Emulation and Prototyping
ASIC emulation prototyping systems partition RTL designs across multiple FPGAs, and the 10AX115R2F40E2LG's 1.15M logic elements provide ~25M ASIC-gate capacity per device. The 24 multi-gigabit transceivers handle chip-to-chip TDM links between FPGAs on the prototyping board, sustaining multi-FPGA clock-domain crossings at 17.4 Gbps. Quartus Prime Pro's BluePrint timing closure flow combined with Synopsys HAPS DeepTrace debug accelerates RTL bring-up compared to ASIC tape-out cycles.
Recomendado
Medical Imaging Accelerator
CT, MRI, and ultrasound imaging accelerators rely on high-throughput DSP for back-projection and beamforming. The 10AX115R2F40E2LG executes 1,518 18x19 multiplications per cycle, delivering 2.7 TMACS of DSP throughput for real-time image reconstruction at 30 fps. Its 68.9 Mbits of embedded memory holds image slices without external SRAM, and two DDR4 controllers push pixel data to display pipelines at 2666 MT/s. Medical OEMs value the deterministic latency and IEC 60601 EMC margins enabled by Intel's hard IP.
Recomendado
High-Performance Computing Fabric Bridge
HPC fabrics use FPGAs as PCIe Gen3/Gen4 bridges between CPUs, GPUs, and storage. The 10AX115R2F40E2LG integrates two PCIe Gen3 x8 hard IP blocks, each capable of 8 GT/s to host CPUs or NVMe targets, while 24 transceivers connect to neighboring FPGAs in a 2D-mesh topology at 17.4 Gbps. The 1.15M logic elements host OpenCL kernels and Intel's Acceleration Stack for compute offload. Compared to discrete NICs, the F40 footprint consolidates bridging, compression, and encryption on a single device.
Recomendado
Resumen de productos recomendados
Datos de referencia de ingeniería para 10AX115R2F40E2LG — comparación, orientación de diseño e información de cumplimiento.
Guía de selección
Comparación con alternativas
| Parámetro | Este producto | 10AX115R2F40E1SG | 10AX115R2F40E1LG | 10AX115R2F40I1SG | 10AX115R3F40E2LG | 10AX115R1F40E1SG | 10AX090R2F40E2LG | 10AX090R3F40E2LG |
|---|---|---|---|---|---|---|---|---|
| Brand | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) |
| Package | 1517-FCBGA (F40) | 1517-FCBGA (F40) | 1517-FCBGA (F40) | 1517-FCBGA (F40) | 1517-FCBGA (F40) | 1517-FCBGA (F40) | 1517-FCBGA (F40) | 1517-FCBGA (F40) |
| Logic Elements | 1,150,000 | 1,150,000 | 1,150,000 | 1,150,000 | 1,150,000 | 1,150,000 | 900,000 | 900,000 |
| Transceivers | 24 up to 17.4 Gbps | 24 up to 17.4 Gbps | 24 up to 17.4 Gbps | 24 up to 17.4 Gbps | 24 up to 28.3 Gbps | 24 up to 17.4 Gbps | 24 up to 17.4 Gbps | 24 up to 28.3 Gbps |
| Speed Grade | -2 | -1 (faster) | -1 (faster) | -1 (faster) | -3 (fastest) | -1 (faster) | -2 | -3 |
| Temperature Grade | E2 (Extended) | E1 (Extended) | E1 (Extended) | I1 (Industrial) | E2 (Extended) | E1 (Extended) | E2 (Extended) | E2 (Extended) |
| Solder Balls | Lead-free (LG) | SnPb (SG) | Lead-free (LG) | SnPb (SG) | Lead-free (LG) | SnPb (SG) | Lead-free (LG) | Lead-free (LG) |
Diferenciadores clave
- Highest density at the -2 speed grade in the 1517-FCBGA F40 footprint (frente a 10AX090R2F40E2LG)
- Faster speed grade available without changing PCB (frente a 10AX115R2F40E1SG)
- Same-package step-up to 28.3 Gbps transceivers (frente a 10AX115R3F40E2LG)
- Wider industrial temperature range than E1 variants (frente a 10AX115R2F40E1LG)
Notas de diseño
The 1517-FCBGA F40 package requires a 16-layer PCB stack-up with hybrid dielectric. Use stacked-via microvia technology on the top two layers for breakout, then route transceiver channels on layer 3 (top reference plane L2). Place Ac coupling capacitors (0.1 uF 0201 or 0402) within 8 mm of each high-speed serial pin per the Arria 10 Transceiver PHY User Guide.
Estimated: At full transceiver utilization (24 lanes at 17.4 Gbps with internal PCS) plus 80% logic utilization and 75% DSP utilization, the 10AX115R2F40E2LG dissipates roughly 25 W. Use a heatsink with theta_CA below 1.5 C/W and ensure at least 1,000 LFM of forced-air cooling to keep junction temperature below 100C. Add three distributed thermal-sense pairs (TMP-Sense) under the package for monitoring.
The 10AX115R2F40E2LG requires a sequenced power tree: 0.9 V core, 1.1 V transceiver analog, 1.1 V transceiver digital, 1.8 V auxiliary, and 3.0 V I/O. Follow Intel's Power Management Guide to set the Power Management Bus (PMBus) controller for proper hot-socketing. Decouple each rail with 22 uF bulk capacitors and 0.1 uF + 1 nF + 10 nF high-frequency ceramics within 5 mm of each ball.
Transceiver channels require matched-length routing within 0.13 mm (5 mil) of the longest lane across 24 differential pairs. Use 85-ohm differential impedance (100-ohm single-ended) for chip-to-chip and 90-ohm differential for backplane channels per Intel's PCB Design Guidelines. Pre-emphasis and adaptive equalization settings should be tuned via the Quartus Transceiver Toolkit.
Información de cumplimiento
LG suffix indicates lead-free (SAC405) solder balls, RoHS compliant. AEC-Q100 is not applicable for FPGAs. Industrial temperature variants (I1) and military temperature variants (M1) are also available in the same F40 footprint.