10AX115U2F45E1SG vs 10AX090U2F45E1SG Comparación
Comparación detallada lado a lado de 10AX115U2F45E1SG por Intel y 10AX090U2F45E1SG por Intel. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
Comparación de especificaciones
| Parámetro | 10AX115U2F45E1SG | 10AX090U2F45E1SG |
|---|---|---|
| Marca | Intel | Intel |
| Categoría | FPGA & CPLD | FPGA & CPLD |
| Estado del ciclo de vida | Activo | Activo |
| Estado del stock | In Stock | In Stock |
| Precio unitario (USD) | $13.900,00 | $5.895,00 |
| Family | Arria 10 GX | Arria 10 GX |
| Logic Elements | 1,150,000 | 900,000 |
| Adaptive Logic Modules (ALMs) | [DATA_NEEDED: ALM count] | [DATA_NEEDED: ALM count] |
| Embedded Memory (bits) | 68,857,600 | — |
| Embedded Memory (Mbits) | 68.86 Mbit | — |
| DSP Blocks | [DATA_NEEDED: DSP block count] | [DATA_NEEDED: DSP block count] |
| 18x18 Multipliers | 1,518 | — |
| User I/O Pins | 480 | 480 |
| Transceiver Channels | 24 | Up to 24 |
| Max Transceiver Data Rate | 17.4 Gbps (chip-to-chip/backplane) | 17.4 Gbps (chip-to-chip) |
| Hard Memory Controllers | 6 (DDR4/DDR3/QDRII+/RLDRAM3) | — |
| PCIe Hard IP | PCIe Gen3 x8 | — |
| Process Node | TSMC 20 nm | — |
| Core Voltage | 0.9 V | 0.9 V |
| Encapsulado | 1932-ball FCBGA, 45 x 45 mm, 1.0 mm pitch | 1932-BBGA, FCBGA |
| Grade | E1 (extended industrial, -40C to +100C) | — |
| Estado RoHS | Compliant | — |
| Embedded Memory | — | 59,234,304 bits (~28.05 Mbit) |
| Process Technology | — | 20 nm |
| Package Code | — | F45 (45x45 mm) |
| Operating Temperature Grade | — | Industrial (E1) |
| Tipo de montaje | — | Surface Mount (BGA) |
| Hard IP | — | PCIe Gen3, memory controllers |