10AX115U3F45E2LG vs 10AX115U2F45I2LG Comparación
Comparación detallada lado a lado de 10AX115U3F45E2LG por Intel y 10AX115U2F45I2LG por Intel. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
Comparación de especificaciones
| Parámetro | 10AX115U3F45E2LG | 10AX115U2F45I2LG |
|---|---|---|
| Marca | Intel | Intel |
| Categoría | FPGA & CPLD | FPGA & CPLD |
| Estado del ciclo de vida | Activo | Activo |
| Estado del stock | In Stock | In Stock |
| Precio unitario (USD) | $8.500,00 | $9.589,87 |
| Series | Arria 10 GX | — |
| Family | Arria 10 | Arria 10 GX |
| Logic Elements | 1,150,000 | 1,150,000 |
| Embedded Memory Bits | 68,857,856 | 68,857,856 bits |
| User I/O Count | 480 | 480 |
| Speed Grade | U3 (medium-performance, transceiver-focused) | 2 (moderate) |
| Package Code | F45 (45 × 45 mm FCBGA) | — |
| Package Type | 1932-ball FCBGA (Flip-Chip BGA) | — |
| Process Technology | 20 nm TSMC | 20 nm |
| Transceiver Data Rate | Up to 28.05 Gbps | Up to 12.5 Gbps |
| DSP Blocks | Variable-precision, 1.5 TFLOPs FP32 | 1,518 |
| PCIe Hard IP | Gen3 x8/x16 | — |
| Memory Interfaces | DDR4, DDR3, QDR IV, RLDRAM 3 | — |
| Temperatura de funcionamiento | 0C to +100C (Industrial, E2 grade) | — |
| Tipo de montaje | Surface Mount (BGA) | Surface Mount (BGA) |
| Configuration Method | SRAM-based, loaded via JTAG / AS / PS | — |
| Estado RoHS | Compliant | Compliant |
| Lead-Free / Halogen-Free | Yes / Yes | — |
| Transceiver Count | — | 24 |
| PCIe Hard IP Blocks | — | 4 (up to Gen3 x8) |
| Fractional PLLs | — | 8 |
| Core Voltage | — | 0.9 V |
| Encapsulado | — | 1932-ball FCBGA (F45) |
| Package Body Size | — | 45 mm |
| Ball Pitch | — | 1.0 mm |
| Operating Temperature Grade | — | Industrial (-40C to +100C) |