10CL025YU256I7G vs 10CL025ZU256I8G Comparación
Comparación detallada lado a lado de 10CL025YU256I7G por Intel y 10CL025ZU256I8G por Intel. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
Comparación de especificaciones
| Parámetro | 10CL025YU256I7G | 10CL025ZU256I8G |
|---|---|---|
| Marca | Intel | Intel |
| Categoría | FPGA & CPLD | FPGA & CPLD |
| Estado del ciclo de vida | Activo | Activo |
| Estado del stock | In Stock | In Stock |
| Precio unitario (USD) | $44,50 | $14,95 |
| FPGA Family | Cyclone 10 LP | — |
| Number of Logic Elements / Cells | 24624 | — |
| Total RAM Bits | 608256 bits | — |
| Number of I/O | 150 | — |
| Encapsulado / Carcasa | 256-LFBGA (UBGA-256) | — |
| Número de pines | 256 | — |
| Tipo de montaje | Surface Mount | Surface Mount (BGA) |
| Ordering Temperature Grade | I7 (industrial, indicated by I suffix) | — |
| Speed Grade | 7 (from I7 suffix) | 8 (I8G - industrial, speed grade 8) |
| Lead-Free / RoHS Ordering Code Suffix | G | — |
| Core Supply Voltage | [DATA_NEEDED: VCCINT core voltage] | — |
| I/O Supply Voltage Range | [DATA_NEEDED: VCCIO supported voltage range] | — |
| Number of PLLs | [DATA_NEEDED: number of PLLs] | — |
| Embedded 18x18 Multipliers | [DATA_NEEDED: DSP multiplier count] | — |
| Configuration Schemes | [DATA_NEEDED: supported configuration modes] | — |
| Number of User I/O Banks | [DATA_NEEDED: number of I/O banks] | — |
| Package Family | Ultra FineLine BGA (UFBGA), 0.8 mm ball pitch class | — |
| Distributor Inventory at Verification | 70 units at LCSC on 2026-09-05 | — |
| Family | — | Cyclone 10 LP |
| Series | — | 10CL025 |
| Logic Elements (LE) | — | 24,624 |
| Embedded Memory Bits | — | 608,256 bits |
| Maximum User I/O | — | 150 |
| Embedded Multipliers (18x18) | — | 66 |
| PLLs | — | 4 |
| Global Clock Networks | — | 20 |
| Core Voltage | — | 1.0 V (typical) / 1.2 V (transceiver supply not present on LP) |
| Process Technology | — | TSMC 60 nm low-power |
| Encapsulado | — | 256-pin UBGA (Ultra FineLine BGA) |
| Package Dimensions | — | 17 mm x 17 mm |
| Temperatura de funcionamiento | — | -40C to +100C (industrial, I8G) |
| Configuration Scheme | — | Active serial (EPCS) / JTAG |
| Estado RoHS | — | Compliant |
| Lead-Free | — | Yes |