10CL025YU256I7G - Cyclone 10 LP FPGA 24K LE | Intel
N.º de pieza: 10CL025YU256I7G ✓ Activo| Cant. | Precio unitario | Total |
|---|---|---|
| 1 | $51.14 | $51,14 |
| 10 | $50.5 | $505,00 |
| 100 | $48.5 | $4.850,00 |
| 500 | $46.5 | $23.250,00 |
| 1.000 | $44.5 | $44.500,00 |
10CL025YU256I7G Descripción general
What is an FPGA? A field-programmable gate array is a semiconductor logic device containing configurable logic blocks, embedded memory, and programmable interconnect that can implement arbitrary digital functions after manufacturing. FPGAs sit in the hierarchy: FPGA -> programmable logic device -> integrated circuit -> semiconductor. Unlike fixed-function ASICs, the 10CL025YU256I7G can be reprogrammed in-system to adapt to changing interface standards, protocol needs, or processing algorithms.
Key features of the 10CL025YU256I7G include 24,624 logic elements for moderate-density gate designs, 608,256 bits of embedded RAM for FIFOs and small packet buffers, and 150 user I/O signals for parallel bus and control-plane applications. The device is supplied in the compact 256-ball LFBGA/UBGA package that fits space-constrained PCBs while still allowing enough routing channels for moderate pin-count designs.
Technically, the Cyclone 10 LP family uses a low-power FPGA fabric intended for 1.0 V-class core logic and multi-voltage I/O banks. The industrial I7 suffix indicates operation suitable for extended-temperature environments, making the part usable outside a controlled indoor setting. The absence of hardened processor or transceiver blocks helps keep static power and unit cost lower than high-end FPGA families.
Typical applications for the 10CL025YU256I7G include industrial control I/O aggregation, motor drive PWM generation, medical monitoring data acquisition, display panel timing controllers, and IoT edge glue logic. Its broad parallel I/O count supports connecting multiple ADCs, DACs, SRAM, and host processors without requiring an expensive high-speed transceiver FPGA.
A key design consideration is that all user I/O banks must be supplied with the correct VCCIO voltage for the connected interface standard. Review the Intel Cyclone 10 LP pin connection guidelines before finalizing the PCB because BGA escape routing and VCCIO assignments affect signal integrity.
This page synthesizes distributor inventory, price data, same-package drop-in ordering variants, and practical board-level guidance not found in the compact manufacturer summary, giving engineers a faster selection and cross-reference path.
Alternativas directas para 10CL025YU256I7G — mismo encapsulado, compatible pin a pin. Se excluyen las piezas de otro encapsulado que requieren retrabajo de la PCB.
Variantes de esta serie
Modelos de la misma serie compatibles directamente con 10CL025YU256I7G (mismo factor de forma y huella) — difiere en Package, Speed Grade, RoHS Status, Operating Temperature, Process Technology.
Herramienta de comparación rápida — seleccione piezas alternativas para compararlas lado a lado:
10CL025YU256C8G
✅ Sustitución directa ⚠️ Especificaciones sin verificar✓ En stock
$32.54 / unidad
Ver hoja de datos →10CL025YU256C6G
✅ Sustitución directa ⚠️ Especificaciones sin verificar✓ En stock
$25.6 / unidad
Ver hoja de datos →10CL025YU256A7G
✅ Sustitución directa ⚠️ Especificaciones sin verificar✓ En stock
$24.1 / unidad
Ver hoja de datos →10CL025YU256I7G Valores máximos y características eléctricas
| FPGA Family | Cyclone 10 LP |
| Number of Logic Elements / Cells | 24624 |
| Total RAM Bits | 608256 bits |
| Number of I/O | 150 |
| Encapsulado / Carcasa | 256-LFBGA (UBGA-256) |
| Número de pines | 256 |
| Tipo de montaje | Surface Mount |
| Ordering Temperature Grade | I7 (industrial, indicated by I suffix) |
| Speed Grade | 7 (from I7 suffix) |
| Lead-Free / RoHS Ordering Code Suffix | G |
| Package Family | Ultra FineLine BGA (UFBGA), 0.8 mm ball pitch class |
| Distributor Inventory at Verification | 70 units at LCSC on 2026-09-05 |
Guía de configuración de pines de 10CL025YU256I7G ultra fineline bga (ufbga), 0.8 mm ball pitch class
Configuración de pines para 10CL025YU256I7G (encapsulado ultra fineline bga (ufbga), 0.8 mm ball pitch class). Este CI digital incluye GPIO, interfaces de comunicación (UART, SPI, I2C) y pines de alimentación. Consulte la hoja de datos del fabricante para conocer las funciones alternativas de los pines y las opciones de configuración. Esencial para el diseño de sistemas embebidos y el diseño de PCB.
No hay datos detallados de patillaje disponibles para 10CL025YU256I7G.
Consulte la hoja de datos para ver la configuración completa de patillas.
Aplicaciones típicas
10CL025YU256I7G es adecuado para 6 aplicacións: Industrial Automation and PLC I/O, AC Motor and Servo Drive Control, Medical Monitoring and Data Acquisition, Test and Measurement Instrumentation, Display and Video Interface Bridge, IoT Edge Gateway and Smart Factory Glue Logic.
Industrial Automation and PLC I/O
The 10CL025YU256I7G fits industrial automation because its 150 parallel I/O lines can connect directly to optocouplers, digital input/output transceivers, and motor-drive interface logic. Its industrial-temperature I7 suffix supports operation in factory environments where heat rise and ambient control are less predictable. In a PLC or remote I/O module, the FPGA implements address decode, bus arbitration, and input debounce logic while offloading repetitive tasks from the host MCU. The 24,624 logic elements provide ample headroom for multiple UART/SPI bridges and fault-logic blocks. The 608,256 RAM bits can buffer high-speed sensor bursts before the host processor reads them. Because the device does not contain high-speed transceivers, its static power remains low enough for fanless industrial enclosures. Designers should place FPGA logic near the backplane connector and use careful ground planes for the parallel I/O bus.
Recomendado
AC Motor and Servo Drive Control
For motor control, the 10CL025YU256I7G provides the parallelism needed to generate multi-channel PWM signals and read encoder feedback simultaneously. Its 24,624 logic elements can implement space-vector PWM state machines, overcurrent trip logic, and incremental encoder quadrature decoders without burdening a host DSP. The 150 I/O allow direct connection to gate-driver interfaces, current-sense ADC converters, and encoder inputs. The industrial temperature grade is important for drives mounted inside cabinets with elevated heat. The embedded RAM can store commutation tables and short FIFO buffers for time-critical data. Cyclone 10 LP devices are frequently selected for cost-sensitive drive applications because they provide deterministic timing without the licensing cost associated with high-end FPGA families. The board layout should separate the noisy power stage from FPGA I/O and include sufficient decoupling on the FPGA core and I/O voltage rails.
Recomendado
Medical Monitoring and Data Acquisition
Medical systems such as patient monitors and imaging front ends require deterministic data acquisition and clean digital interfacing. The 10CL025YU256I7G can capture samples from multiple ADCs, apply simple digital filters, and forward processed data to a host processor over a parallel or SPI bridge. Its 608,256 RAM bits are sufficient for small waveform FIFOs and calibration coefficient tables. The FPGA fabric allows the isolation of infrequent protocol updates from the analog front end, which is valuable in a regulated medical development cycle. Because patient monitoring equipment often passes extended temperature qualification, the I7 industrial suffix provides more margin than a commercial-grade FPGA. Medical PCB designs should keep analog and digital sections separated and use single-point grounding; the FPGA's I/O banks should be powered from clean low-noise supplies to avoid coupling into sensitive acquisition channels.
Recomendado
Test and Measurement Instrumentation
In test equipment, the 10CL025YU256I7G is used for trigger logic, pattern generation, and custom bus interfaces between front-end ASICs and processors. Its 150 user I/O are sufficient for connecting multiple high-speed comparators or DACs in parallel, while the 24,624 logic elements implement state machines for measurement sequencing. The low static power of Cyclone 10 LP helps minimize thermal drift inside benchtop instruments. The 608,256 bits of RAM can hold digital waveform patterns or acquisition buffers without requiring an external FIFO. Instrument designers benefit from the reprogrammability of an FPGA because protocol modes can be updated in the field by loading a new configuration image. For signal integrity, keep the FPGA I/O traces length-matched and provide solid reference planes. The device is not intended for chip-to-chip SERDES designs, so use it in parallel-bus roles where data rates stay within standard LVCMOS limits.
Recomendado
Display and Video Interface Bridge
The 10CL025YU256I7G can act as a low-cost timing controller or interface bridge for TFT panels, generating sync pulses, pixel clock counters, and small line buffers. Its 608,256 RAM bits are useful for line buffering in non-interlaced display paths, and the 150 I/O can connect parallel RGB busses from image sensor or video decoder devices. The parallel logic fabric allows independent pixel data and control signal generation on the same device. Designers can implement gamma correction lookup tables, test-pattern generators, and simple image processing filters in the FPGA. Because display interfaces often require multiple voltage rails for the panel backlight and logic, the FPGA's multi-bank I/O structure helps manage level translation. The device is best used for lower-resolution panels or controller-level bridging rather than high-speed HDMI/DisplayPort processing, which would require hardened serial transceivers.
Recomendado
IoT Edge Gateway and Smart Factory Glue Logic
The 10CL025YU256I7G supports IoT edge gateways by implementing protocol glue logic, sensor aggregation, and deterministic control functions alongside a host application processor. Its low static power is beneficial for compact gateways that cannot use large heatsinks. The 150 I/O are sufficient to bridge multiple sensors, UARTs, CAN controllers, and memory-mapped peripherals to a main SoC. The 24,624 logic elements can offload cyclic redundancy check, framing, and packet classification tasks, reducing host CPU load. The industrial I7 suffix makes the device suitable for smart-factory installations near machines or outdoor environment sensors. Developers can update the FPGA image remotely over a configuration interface, enabling protocol tweaks without changing board hardware. For EMI-sensitive wireless gateways, careful filtering of FPGA I/O lines and a solid ground plane are recommended to avoid compromising radio receiver sensitivity.
Recomendado
Resumen de productos recomendados
Datos de referencia de ingeniería para 10CL025YU256I7G — comparación, orientación de diseño e información de cumplimiento.
Guía de selección
Comparación con alternativas
| Parámetro | Este producto | 10CL025YU256C8G | 10CL025YU256C6G | 10CL025YU256A7G |
|---|---|---|---|---|
| Brand | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) |
| Package | 256-LFBGA (UBGA-256) | 256-LFBGA (UBGA-256) - same | 256-LFBGA (UBGA-256) - same | 256-LFBGA (UBGA-256) - same |
| FPGA Family | Cyclone 10 LP | Cyclone 10 LP | Cyclone 10 LP | Cyclone 10 LP |
| Logic Elements | 24624 | 24624 | 24624 | 24624 |
| Total RAM Bits | 608256 bits | 608256 bits | 608256 bits | 608256 bits |
| User I/O | 150 | 150 | 150 | 150 |
| Temperature Ordering Grade | I7 (industrial) | C8 (commercial) | C6 (commercial) | A7 (alternate ordering grade) |
| Speed Grade | 7 | 8 | 6 | 7 |
Diferenciadores clave
- Industrial-temperature I7 grade for harsh environments (frente a 10CL025YU256C8G)
- Same U256 footprint with speed grade 7 (frente a 10CL025YU256C6G)
- Only known true drop-in family is the same-density 10CL025 U256 series (frente a 10CL016YU256I7G)
Notas de diseño
The 10CL025YU256I7G is a 256-ball BGA and requires proper escape routing and decoupling. Place at least one 0.1 uF ceramic capacitor close to each FPGA power-supply ball group and a bulk capacitor near the board-edge power entry. Use multiple vias when transitioning from BGA balls to inner power planes to reduce inductance. Follow Intel's pin connection guidelines for all VCCIO banks, GND, and configuration pins. Do not leave unused I/O unconnected unless Intel power and pin rules allow it; a consistent pull-up/pull-down strategy prevents unintended input float states.
Static power and transient current are not specified in the supplied web data, so use Intel PowerPlay Early Power Estimator for a real current budget before selecting regulators. The Cyclone 10 LP family is optimized for low static power, but dynamic current scales with clock frequency, toggle rate, and I/O loading. Estimate power using the actual resource utilization and I/O standards. Provide sufficient regulator margin for configuration current spikes and use separate supplies for core and I/O banks where the board layout allows.
Cyclone 10 LP devices require an external configuration source at power-up. Depending on the board architecture, use JTAG for debug and an active-serial configuration device or download cable for production. Verify the MSEL pin strapping required for the chosen configuration scheme before layout. The FPGA configuration image is stored externally, so ensure the memory device and programming interface are in the BOM. If no configuration flash is planned, the board cannot self-boot after power cycling.
Do not assume that any Cyclone 10 LP FPGA in a U256 package is pin-compatible with the 10CL025YU256I7G. Different density families may use a similar package name but have different ball assignments. Verify each alternative against the Intel pin file before using it as a drop-in. Also remember that the FPGA is not configured as soon as power is applied; the firmware must load the configuration bitstream before the design can communicate with the rest of the system.
Información de cumplimiento
The G suffix in the ordering number commonly indicates a lead-free/RoHS-compliant Intel/Altera package, but the supplied web data does not contain a formal compliance statement. Verify current RoHS/REACH status on the Intel product page before certification work.
