10CX105YF780I5G vs 10CX105YF780E6G Comparación
Comparación detallada lado a lado de 10CX105YF780I5G por Intel y 10CX105YF780E6G por Intel. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
Intel
10CX105YF780E6G - Cyclone 10 GX FPGA, 104K LE, 780-FCBGA | Altera/Intel
10CX105YF780E6G ✓ ActivoComparación de especificaciones
| Parámetro | 10CX105YF780I5G | 10CX105YF780E6G |
|---|---|---|
| Marca | Intel | Intel |
| Categoría | FPGA & CPLD | FPGA & CPLD |
| Estado del ciclo de vida | Activo | Activo |
| Estado del stock | In Stock | In Stock |
| Precio unitario (USD) | $115,00 | $580,00 |
| Series | Cyclone 10 GX | — |
| Logic Elements | 105,000 LE | — |
| Adaptive Logic Modules (ALMs) | 38,000 ALM | — |
| Embedded Memory | 8,641,536 bits (8.4 Mbit) | — |
| Number of I/O | 284 | — |
| Number of Transceivers | [DATA_NEEDED: exact transceiver count for 10CX105 F780] | — |
| Maximum Transceiver Data Rate | 12.5 Gbps | — |
| Operating Supply Voltage (Core) | 0.9 V | — |
| Rango de temperatura de funcionamiento | -40C to +100C (Industrial) | — |
| Estilo de montaje | SMD/SMT | — |
| Package Type | 780-BBGA, FCBGA (F780) | — |
| Package Code | BGA, SQUARE | — |
| Terminal Form | BALL | — |
| Number of Terminals | 780 | — |
| Process Technology | 20 nm | — |
| Hard PCIe IP | PCIe Gen2 x4 (per Cyclone 10 GX family) | — |
| Design Software | Intel Quartus Prime Lite/Pro | — |
| Estado RoHS | Compliant | Compliant |
| Temperature Grade | Industrial (I) | — |
| Speed Grade | 5 | — |
| Family | — | Cyclone 10 GX |
| Series / Model | — | 10CX105 |
| Logic Elements (LE) | — | 104,000 |
| Embedded Memory Bits | — | 8,641,536 (8.5 Mb) |
| DSP Blocks / 18x19 Multipliers | — | 156 |
| User I/O Count | — | 284 |
| Transceivers | — | 6 channels, up to 12.5 Gbps |
| PCIe Hard IP | — | 1 x PCIe Gen2 (x1/x2/x4) |
| LVDS SERDES | — | Up to 1.4 Gbps |
| External Memory Interface | — | DDR3/DDR3L/LPDDR2 up to 3.0 Gbps |
| Process Node | — | 20 nm TSMC |
| Core Voltage | — | 1.0 V |
| Auxiliary Voltage | — | 0.9 V |
| Encapsulado | — | 780-ball FCBGA (F780) |
| Temperatura de funcionamiento | — | -40C to +100C (industrial) |
| Configuration Mode | — | FPP and AS |